Class 1 - Hyperion

Overview

The Hyperion board is a certified rhomb PCB that integrates the rhomb modular ecosystem in a small form factor device. This board is a modular machine focused on multimedia capable to support two rhomb modules and a rhomb core. Is not a simple computer with multimedia features, it is the most upgradable device you will find on the market. It gives the opportunity to easily assemble your machine according not only to your needs, but to your imagination.

The most common communication features such as WiFi, Ethernet and USB ports are available on board. But there are no limits on the Hyperion capabilities: LoRa, ZigBee, movement sensing, GPS..., all those are available on standard rhomb modules. The only thing you need is connect them on the corresponding slots. If there is a need for more processing power: you don't need to replace the Hyperion, the only thing you have to do is replace the core module for another more powerful.

The next figure show a 3D view for the Hyperion board.

As a summary, the following table indicates the main features:

Hyperion Key Features
Multi-platform single-board computer
1x Rhomb.io Core
2x Slave rhomb.io sockets
HDMI
Ethernet
WiFi + BT
4x USB
SD card

Applications:

• Mini-PC
• Media center
• Router
• IoT
• WiFi/BT access point
• NAS
• Education

Board specifications

Key features

The Hyperion board has been designed as to be the most upgradeable and customizable computer device in the market using the modular Rhomb.io architecture. This board offers a huge amount of multimedia and communications capabilities such as HDMI, USB, Ethernet, WiFi and Bluetooth. The Hyperion is not limited only to these features, the board also includes two sockets for standard Rhomb.io Modules and one socket for standard Rhomb.io Cores. This brings a countless amount of customization options. The Block Diagram shows the parts that make it possible.

The following figures identify the main parts of the board. The most important parts will be explained with more details in the next sections.

Rhomb.io Core

The Central Processing Unit (CPU), RAM, PMIC among other auxiliary elements are embedded on the Core, a small standardized board designed to be connected on the core socket. Look on the description image to see where this socket is placed. On the following link you can find the currently available Rhomb.io cores. Rhomb.io Shop

Rhomb.io Modules

Lots of Rhomb.io Modules focused in different areas such as communications, sensing or storage, are available. The Hyperion board allows to connect a maximum of two standard Rhomb.io Modules. Look at here to choose the desired module to convert your Hyperion in the device you want. Note that if a memory module is used, it should be connected on the module socket number one.

Memory

Two memory options are available for the Hyperion board: a micro SD card and a Memory eMMCXX Module. The eMMC memory modules used to be faster than the SD cards, but it occupies one module socket. The user should choose either one or other. In order to allow that, there is a switch array on the board that should be configured as it is shown on the two following images:

• eMMC bootloader configuration:

• Micro SD card bootloader configuration:

The DIP switches should not be moved unless the system is turned off.

Connectivity

Wired

There are available three USB 2.0 ports on the Hyperion and all are working as a host. Note that there are two USB B-Type connectors on the board, but these ports are used only as a supply source. See the "Power" section for more details.

It is also available an Ethernet port that can carry traffic at the nominal rate of 100Mbit/s, supporting full and half-duplex with flow control.

Wireless

The Hyperion board offers WiFi and Bluetooth (BT). As a summary, the following table shows the main features for each supported interface:

Hyperion wireless interfaces
WLAN	EEE 802.11b, IEEE 802.11g, IEEE 802.11n
	2.4 GHz
Bluetooth	V2.1+EDR/BT v3.0/BT v3.0+HS/BT v4.0

Video/Audio

The Hyperion board is fully compliant with the HDMI audio and video interface. The next figure shows where the HDMI type A connector is placed on the board.

LEDs and Button

Four LEDs are assembled on the Hyperion board in order to give status feedback to the user. The functionality is explained next:

• Main PWR IN LED: indicates that the main power supply source is connected on its corresponding micro USB connector. More details regarding this connector will be found at the "Power" section.
• SYS ON LED: indicates that the system is running. If all is okay, this LED should bright once the Button ON is pressed.
• Secondary PWR IN LED: indicates that the secondary power supply source is connected on its corresponding micro USB connector. More details regarding this connector will be found at the "Power" section.
• User LED: Programmable LED connected to GPIO00.

The Button ON is used to turn ON/OFF the system and to reset it if you keep it pressed a few seconds.

Connections

GPIO

The following table summarizes the GPIOs used on the Hyperion board.

GPIO	Signal	Description
00	LED_MCU_1	Activates User LED (LED1)
01	-	-
02	-	-
03	-	-
04	-	-
05	-	-
06	MOD_RESET	Resets the Rhomb.io Modules
07	MOD1_GPIO0	Module 1 socket, GPIO 0
08	MOD1_GPIO1	Module 1 socket, GPIO 1
09	MOD1_GPIO2	Module 1 socket, GPIO 2
10	MOD1_GPIO3	Module 1 socket, GPIO 3
11	MOD1_GPIO4	Module 1 socket, GPIO 4
12	MOD1_GPIO5	Module 1 socket, GPIO 5
13	MOD1_GPIO6	Module 1 socket, GPIO 6
14	MOD1_GPIO7	Module 1 socket, GPIO 7
15	MOD2_GPIO0	Module 2 socket, GPIO 0
16	MOD2_GPIO1	Module 2 socket, GPIO 1
17	MOD2_GPIO2	Module 2 socket, GPIO 2
18	MOD2_GPIO3	Module 2 socket, GPIO 3
19	MOD2_GPIO4	Module 2 socket, GPIO 4
20	MOD2_GPIO5	Module 2 socket, GPIO 5
21	MOD2_GPIO6	Module 2 socket, GPIO 6
22	MOD2_GPIO7	Module 2 socket, GPIO 7
23	-	-
24	-	-
25	-	-
26	-	-
27	-	-
28	-	-
29	-	-
30	-	-
31	-	-
32	-	-
33	-	-
34	-	-
35	-	-
36	-	-
37	-	-
38	SPI-A_CS1	SPI-A Chip Select for Rhomb.io Module 2
39	-	-
40	-	-

Interrupts

The following table summarizes the signals that can cause interrupts on the Rhomb.io Core.

XEINT	Signal	Description	XEINT	Signal	Description
00	MOD1_INT	Interrupt on the Rhomb.io Module 1	08	-	-
01	MOD2_INT	Interrupt on the Rhomb.io Module 2	09	-	-
02	-	-	10	-	-
03	-	-	11	-	-
04	-	-	12	-	-
05	-	-	13	CEC_HDMI	HDMI Consumer Electronics Control
06	-	-	14	-	-
07	HPD_HDMI	HDMI Hot Plug Detect	15	XEINT15	System Power ON

Serial interfaces

The following tables indicates the use of the available serial interfaces on the Rhomb.io standard.

I2C

I2C	Used by
A	Rhomb.io Module 1
	Rhomb.io Module 2
	HDMI
B	-

The I2C-A has 4.7kΩ pull-up resistors connected to a VDDIO.

I2S

This interface is not used on the Hyperion board.

SPI

SPI	Used by
A	Rhomb.io Module 1
	Rhomb.io Module 2
B	-

UART

UART	Used by
A	Rhomb.io Module 1
B	Rhomb.io Module 2
	Debug pads
C	-
D	Rhomb.io Module 1
	Rhomb.io Module 2

As the Rhomb.io standard defines, the UART-B is the interface used for the system debugging.

USB

USB	Used by
USB-A	Rhomb.io Module 1
USB-B	WIFI/BT
USB-C	HUB USB/Ethernet
OTG	-
USB1_HUB2	USB-A connector
USB2_HUB2
USB3_HUB2
USB4_HUB2	Rhomb.io Module 2

SDIO

The next table shows how the Secure Digital Input Output (SDIO) interfaces are connected on the Hyperion board.

SDIO	Used by
A	Rhomb.io Module 1
B
C	Module 2 socket
	Micro SD
D

Power

The Block Diagram shows that the supply power comes from the two micro USB B connectors. The "Main PWR USB" is the main power supply and feeds all the circuitry. The "Secondary PWR USB" is a secondary source power that feeds the three USB type A connectors. This should be used when the devices connected there needs more power than the "Main PWR USB" is capable to supply. A switching circuit is responsible to derive the current in order to do so. Note that the data lines are not connected to the micro USB B connectors, are used only as a power supply connectors.

The following table summarizes the power supply signals on the Hyperion board and indicates where are used.

Signal	Voltage (V)	Used by
VBAT	5	Rhomb.io Module 1
		Rhomb.io Module 2
VSYS	3 - 5.5	Rhomb.io Core
		Rhomb.io Module 1
		Rhomb.io Module 2
		HDMI
VDDIO	Rhomb.io Core logic level	Rhomb.io Module 1
		Rhomb.io Module 2
		Boot sequence
		HDMI
BUCK8-A_3V3	3.3	Rhomb.io Module 1
	Rhomb.io Module 2
BUCK-B_REG_3V3	3.3	Rhomb.io Module 1
	Rhomb.io Module 2
	USB HUB/Ethernet
	Wireless IC
LDO-A_2V8	2.8	Rhomb.io Module 2
LDO-B	-	-
LDO-C	-	-
LDO-D	-	-
LDO-E	-	-
LDO-F	2V8	Micro-SD
LDO-G	-	-
LDO-H	-	-
LDO-I	-	-
LDO-J	-	-
LDO-K	-	-
LDO-L	-	-
LDO-M_1V8	-	-
LDO-N	-	-
LDO-O_1V8	1V8	Rhomb.io Module 2
LDO-P	-	-
LDO-Q_1V8	1V8	Rhomb.io Module 1
LDO-R_2V8	1V8	Rhomb.io Module 1

Secondary signals

On the following table it is shown how the Analog to Digital, PWM and CLK signals are connected on the Hyperion board.

Signal	Used by
Analog to Digital
AD_IN0	Rhomb.io Module 1
AD_IN1	Rhomb.io MOdule 2
AD_IN2	-
AD_IN3	-
PWM
PWM_OUT0	Rhomb.io Module 1
PWM_OUT1	Rhomb.io MOdule 2
PWM_OUT2	-
PWM_OUT3	-
CLK 32.768kHz
CLK_32KH_1	Rhomb.io Module 1
	Rhomb.io MOdule 2

Getting started

[Under construction]

Schematics

Click the image below to download the schematic files.

Bill of materials

Click the image below to download the BOM files.

Fabrication files

Click the image below to download the fabrication files.

Mechanical specifications

Board

Warranty

• Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:

1. The users should wear anti-static clothing and use earth band when manipulating the device.
2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
3. Equipment and work table must be earthed.
4. Ionizer is recommended to remove electron charge.

• Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.

• Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.

• Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.

• Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.

• Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.

• Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.

• EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

Disclaimer

Rhomb.io reserves the right to make corrections, enhancements, improvements and other changes to its products and services, and to discontinue any product or service. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All the hardware products are sold subject to the Rhomb.io terms and conditions of sale supplied at the time of order acknowledgment.

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