Display 0.96 v1.0

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This document shows the documentation for the Rhomb.io Display 0.96 Module.

Overview

The Display 0.96 Module is a certified Rhomb.io module with a 0.96" OLED LCD Display and 128*64 pixels. It's a good choice to take a quick look about the working system information. For example, it can show CPU charge and power consumption in real time working operation.

The next figure show a 3D view for the Display 0.96 Module.

Display 0.96 3D TOP.pngDisplay 0.96 3D BOTTOM.png

Applications:

  • Real time system information.
  • Low power display when there's no screen present.

Module specification

Key features

This module equips a I2C-SPI 0.96" OLED Display with 128*64 pixels, this is a low cost and low power display that allows to display many information, simple graphics or text information.

The following figure identifies the main Integrated Circuits (IC) onboard.

Display 0.96 3D TOP Description.jpgDisplay 0.96 3D BOTTOM Description.png

The next figure shows the Block Diagram for the Display 0.96 Module.

Display 0.96 Diagrama.png

Display 0.96 Module features
Control Chip SSD1306
Operating voltage 3.3V
Display Voltage 7V (Internal step-up)
Interface I2C - SPI (selectable)
Resolution 128x64 pixels
Pixel Size 0.15×0.15

User interfaces

This module has some Solder Jumpers needed to change between I2C and SPI connections. Further more, less significant bit of I2C address can be changed to allow connecting another display in the same bus.

Connections

GPIO

The following table summarizes the GPIOs used on the Display 0.96 Module. Note that ZZ of them should be configured as interrupt sources.

Rhomb.io pinout Signal (module) Device Interruption
GPIO0 DC/SA0 Display No
GPIO1 RESET Display No
GPIO2 N/C N/C No
GPIO3 N/C N/C No
GPIO4 N/C N/C No
GPIO5 ShiftLevel_ENABLE Shift Level No
GPIO6 EEPROM.BP ID Memory No
GPIO7 EEPROM.IO ID Memory No

DC/SA0 signal, in SPI mode allows to change between Data and Command (DC), when in I2C mode allows to change Slave Address (SA) if there are another display in the same bus. . For more details, look at the module specifications for the Rhomb.io standard.

Serial interfaces

The following table indicates the available serial interfaces on the Rhomb.io standard and which of them are in use. The table also shows the nomenclature used on the Rhomb.io standard and its corresponding on the schematic.

Signal (Rhomb.io) Signal (module) Used by Signal (Rhomb.io) Signal (module) Used by
I2C SPI
I2C_SDA S_Data SPI_MISO N/C
I2C_SCL S_CLK SPI_MOSI S_Data
I2C_INT N/C SPI_CLK S_CLK
UART SPI_CSn CS
UART_RTSN SPI_INT N/C
UART_RXD USB
UART_TXD USB_DATA_N
UART_CTSN USB_DATA_P

The I2C pull-ups resistors should be mounted on the bus, otherwise, the I2C bus will not work. For more details, look at the module specifications for the Rhomb.io standard.

SDIO

The Secure Digital Input Output (SDIO) interfaces are not used on the Display 0.96 Module.

Power

As per the supply lines used on the board, there is a summary on the next table.

Signal (Rhomb.io) Signal (module) Voltage (V) Used
1V8 150mA 1.8 No
2V8 150mA 2.8 No
VBAT 5 No
VSYS 3 - 5.5 No
Buck8 Buck8 3.3 Yes
Buck9 3.3 No

For more details, look at the module specifications for the Rhomb.io standard.

Other signals

The CLK_32KH, AD_OUT and PWM_INT signals are not used on the Display 0.96 Module. More information regarding these signals can be found at the specifications for the Rhomb.io standard.

For more details, look at the module specifications for the Rhomb.io standard.

Schematics

Click the image below to download the schematic files.

Bill of materials

Click the image below to download the BOM files.

Fabrication files

Click the image below to download the fabrication files.

Mechanical specifications

Board

Warranty

  • Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:
  1. The users should wear anti-static clothing and use earth band when manipulating the device.
  2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
  3. Equipment and work table must be earthed.
  4. Ionizer is recommended to remove electron charge.
  • Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
  • Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
  • Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
  • Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
  • Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
  • Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
  • EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

Disclaimer

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