Exynos 4412


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This sheet shows the documentation for the Exynos 4412 Rhomb.io core. Preliminary version, use only for data updating or corrections.

Overview

The Exynos 4412 is a Rhomb.io core module based on the Samsung Exynos 4 Quad System on Chip (SoC), also named Exynos 4412. This thin and small board, is easily pluggable on the standard Rhomb.io core sockets and has been designed as to be the brain of your modular system. It mainly accomplish two different roles: power supply management and computing. The Exynos 4412 core is capable to manage the input power in order to accommodate it according to the Rhomb.io standard specifications.

This board embeds a 32 bits RISC quad-core SoC based on the ARM Cortex-A9 microarchitecture. This is a cost-effective and performance optimized solution for smart and low power applications. The SoC includes hardware acceleration for different tasks such as motion video processing, real-time video, image signal processing, display control and scaling, integrated multi-format codec (MFC), encoding and decoding of MPEG-2/4, H263, H264 and decoding VC1. This integrated circuit can be found in high-end devices like the Samsung Galaxy S III, Note II, Note 10.1, Hardkernel ODROID, Lenovo K860, etc.

Two options for the Exynos 4412 Rhomb.io core are available. The only difference in between them is the size of the RAM: 1GB or 2GB, using in both cases LPDDR2 memory.

The next table summarizes the main features of the Rhomb.io Exynos 4412 core.

Exynos 4412 core features
ARM Cortex A-9 quad-core CPU, 32 bit
1GB or 2GB LPDDR2 RAM
Operating frequency up to 1.4 GHz
NEON multi-media processing engine
MALI-400 GPU
Off board program and storage memory
RTC with two alarms
Max input voltage 6V
100% Rhomb.io standard v4.2 compatible


Exynos4412 top shield v2.jpg Exynos4412 top v2.jpg Exynos4412 bottom v2.jpg

Core specifications

The Exynos 4412 is the first one of the many cores that will come to the Rhomb.io platform. It integrates a Samsung Exynos SoC, a PMIC and a USB Hub in a small board that measures 45x27x3mm. In addition to these components, the Block Diagram also shows that, among other auxiliary components, the board has eight tiny connectors named from J1 to J8, all those components assembled in order to accomplish the standard for the Rhomb.io modular open hardware platform. Those male connectors are intended to drive all the signals coming from the SoC, PMIC, and the Hub, to a Rhomb.io motherboard such as the Gaia or the Hyperion boards. Look at the "Connections" section to see which signals are available on the connectors.


Exynos4412 Block Diagram v3.jpg

The next figure identifies among others the Samsung Exynos 4412, an ARM SoC widely used in consumer electronics products such as tablets and smartphones. It includes a quad-core processor based on the Cortex-A9 architecture with a maximum clock speed of 1.6 GHz. The SoC integrates an ARM Mali-400 MP4 GPU (15.8 GFLOPS at 440 MHz). Videos can be accelerated by a multi-format video decoder: 1080p AVI, WMV, H.264, H.263, VC1, MPEG2, MPEG4. The RAM is assembled Package on Package (PoP), so two options for the RAM are available: 1GB or 2GB. In both cases the memory is LPDDR2.

The chip is manufactured in 32nm technology and mainly found in high-end devices like the Samsung Galaxy S3 or Note 2. Indicar potencia consumida.

A complete Power Management IC (PMIC) is used on the Exynos 4412 core in order to provide power supply not only to the SoC, but also to the entire Rhomb.io modular system. The MAX77686 is in charge of this behalf. This IC is designed for the latest consumer electronics devices such as smartphones, and contains nine efficient buck converters, 26 LDOs and a Real Time Clock (RTC). The linear regulators provide greater than 60db PSRR and less than 45uV of output noise. This IC is managed by the SoC trough I2C and is configured according to the system requirements.

The left image on the "Overview" section shows the Exynos 4412 core assembled with a shield. This component has been designed in order to reduce the electromagnetic perturbations bearing in mind the normative regarding Electromagnetic Interference (EMI).


Exynos4412 Description top v2.jpg Exynos4412 Description bottom v2.jpg

Connectors

The following table indicates the pinout of each one of the eight connectors. It has been grouped the signals according to its functionality and according to the Rhomb.io standard v4.2. Each pin on the connector supports a maximum of 300mA.

J1 connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 GND Connected to GND 26 GND Connected to GND
2 27 VIDEO_VD15 XvVD[15] RGB Video Output or GPIO
3 VIDEO_VD16 XvVD[16] RGB Video Output or GPIO 28 VIDEO_VD00 XvVD[0]
4 VIDEO_VD22 XvVD[22] 29 VIDEO_CLK XvVCLK
5 VIDEO_VD13 XvVD[13] 30 VIDEO_VD18 XvVD[18]
6 VIDEO_VD01 XvVD[1] 31 VIDEO_SYS_OE XvSYS_OE
7 VIDEO_VD04 XvVD[4] 32 VIDEO_VD11 XvVD[11]
8 VIDEO_VD09 XvVD[9] 33 VIDEO_VSYNC XvVSYNC
9 VIDEO_VSYNC_LDI XvVSYNC_LDI 34 VIDEO_VD06 XvVD[6]
10 VIDEO_VD23 XvVD[23] 35 VIDEO_HSYNC XvHSYNC
11 VIDEO_VD14 XvVD[14] 36 VIDEO_VD12 XvVD[12]
12 GND Connected to GND 37 VIDEO_VD03 XvVD[3]
13 38 VIDEO_VD17 XvVD[17]
14 VIDEO_VD05 XvVD[5] RGB Video Output or GPIO 39 SLIMBUS_CLK XsbusCLK Slimbus port
15 VIDEO_VD10 XvVD[10] 40 SLIMBUS_DATA XsbusDATA
16 VIDEO_EN XvVDEN 41 GND Connected to GND
17 VIDEO_VD20 XvVD[20] 42 HDMI_D2_P XhdmiTX2P HDMI Data
18 VIDEO_VD07 XvVD[7] 43 HDMI_D2_N XhdmiTX2N
19 VIDEO_VD08 XvVD[8] 44 HDMI_D1_P XhdmiTX1P
20 VIDEO_VD02 XvVD[2] 45 HDMI_D1_N XhdmiTX1N
21 VIDEO_VD21 XvVD[21] 46 HDMI_D0_P XhdmiTX0P
22 VIDEO_VD19 XvVD[19] 47 HDMI_D0_N XhdmiTX0N
23 LDO04_2V8_150mA OUT4 PMIC LDO4 output 48 HDMI_CLK_P XhdmiTXCP
24 LDO05_1V8_150mA OUT5 PMIC LDO5 output 49 HDMI_CLK_N XhdmiTXCN
25 GND Connected to GND 50 GND Connected to GND
J2 connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 GND Connected to GND 26 GND Connected to GND
2 CAN_TX Not available 27 UART2_RTSN XuRTSn[2] UART 2 interface
3 CAN_RX 28 SPI0_CSN XspiCSn[0] SPI 0 interface
4 I2S_SCLK Xi2s1SCLK I2S interface 29 UART0_TXD XuTXD[0] UART 0 interface
5 RFU Xi2s2SDI Does not fit the standard 30 PWM_OUT0 XpwmTOUT[0] PWM 0 output
6 Xi2s2CDCLK 31 SPI1_CLK XspiCLK[1] SPI 1 interface
7 I2S_LRCK Xi2s1LRCK I2S interface 32 PWM_OUT1 XpwmTOUT[1] PWM 1 output
8 I2S_CDCLK Xi2s1CDCLK 33 UART3_RXD XuRXD[3] UART 3 interface
9 I2S_SDO Xi2s1SDO 34 I2C0_SCL Xi2c0SCL I2C 0 interface
10 I2S_SDI Xi2s1SDI 35 GND Connected to GND
11 I2C1_SCL Xi2c1SCL I2C 1 interface 36
12 UART1_RXD XuRXD[1] UART 1 interface 37
13 SPI0_CLK XspiCLK[0] SPI 0 interface 38 UART0_RTSN XuRTSn[0] UART 0 interface
14 GND Connected to GND 39 SPI0_MISO XspiMISO[0] SPI 0 interface
15 40 SPI1_MISO XspiMISO[1] SPI 1 interface
16 41 UART2_CTSN XuCTSn[2] UART 2 interface
17 PWM_OUT2 XpwmTOUT[2] PWM 2 output 42 I2C1_SDA Xi2c1SDA I2C 1 interface
18 PWM_OUT3 XpwmTOUT[3] PWM 3 output 43 UART1_CTSN XuCTSn[1] UART 1 interface
19 SPI1_MOSI XspiMOSI[1] SPI 1 interface 44 UART0_CTSN XuCTSn[0] UART 0 interface
20 UART2_RXD XuRXD[2] UART 2 interface 45 UART3_TXD XuTXD[3] UART 3 interface
21 SPI0_MOSI XspiMOSI[0] SPI 0 interface 46 UART0_RXD XuRXD[0] UART 0 interface
22 UART1_TXD XuTXD[1] UART 1 interface 47 UART1_RTSN XuRTSn[1] UART 1 interface
23 I2C0_SDA Xi2c0SDA I2C 0 interface 48 UART2_TXD XuTXD[2] UART 2 interface
24 SPI1_CSN XspiCSn[1] SPI 1 interface 49 RFU Xi2s2SCLK Does not fit the standard
25 GND Connected to GND 50 GND Connected to GND
J3 connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 GND Connected to GND 26 VSYS BATT PMIC power input
2 27
3 RFU Xi2s0SDO[1] Does not fit the standard 28
4 Xi2s0SCLK 29
5 Xi2s0SDO[0] 30 LDO25_3V0_150mA OUT25 PMIC LDO25 output
6 Xi2s0SDO[2] 31 LDO21_2V8_300mA OUT21 PMIC LDO21 output
7 Xi2s0CDCLK 32 LDO26_3V0_150mA OUT26 PMIC LDO26 output
8 Xi2s0LRCK 33 LDO19_1V8_150mA OUT19 PMIC LDO19 output
9 Xi2s0SDI 34 LDO23_3V0_300mA OUT23 PMIC LDO23 output
10 P32KH 35 LDO12_3V0_150mA OUT12 PMIC LDO12 output
11 CLK_32KH 32KHCP 32.768 KHz CLK output 36 LDO24_3V0_150mA OUT24 PMIC LDO24 output
12 PWR_ON PWRON PMIC Power ON 37 LDO16_1V8_150mA OUT16 PMIC LDO16 output
13 GND Connected to GND 38 LDO20_1V8_150mA OUT20 PMIC LDO20 output
14 39 LDO09_1V8_150mA OUT9 PMIC LDO9 output
15 PMIC_RST_2 MRSTB2 PMIC Reset 40 LDO11_1V8_150mA OUT11 PMIC LDO11 output
16 PMIC_RST_1 MRSTB1 41 BUCK8_3V3_300mA BUCK8 PMIC BUCK8 output
17 BOOT_SW1 XOM[1] Bootloader configurator 42
18 BOOT_SW5 XOM[5] 43
19 BOOT_SW3 XOM[3] 44 LDO10_1V8_300mA OUT10 PMIC LDO10 output
20 BOOT_SW2 XOM[2] 45 LDO03_1V8_300mA OUT3 PMIC LDO3 output
21 BOOT_SW4 XOM[4] 46 BUCK9_3V3_300mA BUCK9 PMIC BUCK9 output
22 BOOT_SW0 XOM[0] 47
23 GND Connected to GND 48
24 49
25 VSYS BATT PMIC power input 50
J4 connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 GND Connected to GND 26 GND Connected to GND
2 27 SDIO1_DATA1 Xmmc1DATA[1] SDIO port 1
3 LDO13_1V8_150mA OUT13 PMIC LDO13 output 28 AUX_CLK Xmmc1CLK
4 LDO22_2V8_300mA OUT22 PMIC LDO22 output 29 SDIO1_DATA2 Xmmc1DATA[2]
5 SDIO3_CMD Xmmc3CMD SDIO port 3 30 AUX_CDN Xmmc1CDn
6 SDIO3_CLK Xmmc3CLK 31 SDIO1_DATA0 Xmmc1DATA[0]
7 SDIO3_DATA2 Xmmc3DATA[2] 32 AUX_CMD Xmmc1CMD
8 SDIO3_CDN Xmmc3CDn 33 SDIO1_DATA3 Xmmc1DATA[3]
9 SDIO3_DATA1 Xmmc3DATA[1] 34 SDIO0_DATA0 Xmmc0DATA[0] SDIO port 0
10 SDIO3_DATA0 Xmmc3DATA[0] 35 SDIO0_DATA1 Xmmc0DATA[1]
11 SDIO3_DATA3 Xmmc3DATA[3] 36 SDIO0_CLK Xmmc0CLK
12 GND Connected to GND 37 SDIO0_DATA2 Xmmc0DATA[2]
13 RFU VDD33_BYP Does not fit the standard 38 SDIO0_DATA3 Xmmc0DATA[3]
14 USB3_HOST_OC OCS_N USB 3 port overcurrent 39 SDIO0_CDN Xmmc0CDn
15 USB3_HOST_EN PRTPWR USB 3 port enable 40 SDIO0_CMD Xmmc0CMD
16 GND Connected to GND 41 SDIO2_DATA3 Xmmc2DATA[3] SDIO port 2
17 USB2_HOST_N USBDN2_DM USB 2 port data 42 SDIO2_CLK Xmmc2CLK
18 USB2_HOST_P USBDN2_DP 43 SDIO2_DATA1 Xmmc2DATA[1]
19 GND Connected to GND 44 SDIO2_DATA2 Xmmc2DATA[2]
20 USB3_HOST_N USBDN3_DM USB 3 port data 45 SDIO2_CMD Xmmc2CMD
21 USB3_HOST_P USBDN3_DP 46 SDIO2_DATA0 Xmmc2DATA[0]
22 GND Connected to GND 47 SDIO2_CDN Xmmc2CDn
23 USB1_HOST_N USBDN1_DM USB 1 port data 48 VSYS BATT PMIC power input
24 USB1_HOST_P USBDN1_DP 49
25 GND Connected to GND 50
J5 connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 GND Connected to GND 26 GND Connected to GND
2 27 GPIO01 XEINT[1] GPIO port
3 HSIC_DATA DATA HSIC port 28 GPIO02 XEINT[2]
4 HSIC_STROBE STROBE 29 GND Connected to GND
5 GND Connected to GND 30
6 XEINT15 XEINT[25] Interrupt port 31 GPIO03 XEINT[7] GPIO port
7 XEINT14 XEINT[23] 32 GPIO00 XGNSS_GPIO_0
8 XEINT13 XEINT[30] 33 HSIC_OC XuhostOVERCUR HSIC port
9 XEINT12 XEINT[8] 34 JTAG_TMS XjTMS JTAG port
10 XEINT11 XEINT[14] 35 GPIO04 XEINT[3] GPIO port
11 XEINT10 XEINT[13] 36 GPIO05 XEINT[18]
12 XEINT09 XEINT[0] 37 JTAG_TRSTN XjTRSTn JTAG port
13 XEINT08 XEINT[27] 38 HSIC_PWREN XuhostPWREN HSIC port
14 XEINT07 XEINT[31] 39 JTAG_TDI XjTDI JTAG port
15 XEINT06 XEINT[9] 40 JTAG_CLK XjTCK
16 XEINT05 XEINT[22] 41 JTAG_TDO XjTDO
17 XEINT04 XEINT[17] 42 GND Connected to GND
18 XEINT03 XEINT[16] 43 USB_OTG_P XuotgDP USB OTG bus
19 XEINT02 XEINT[10] 44 USB_OTG_N XuotgDM
20 XEINT01 XEINT[12] 45 GND Connected to GND
21 RST_OUT XnRSTOUT Exynos reset signal out 46 USB_OTG_DRVBUS XuotgDRVVBUS USB OTG bus
22 XEINT00 XEINT[15] Interrupt port 47 JTAG_NRST XjTRSTn JTAG port
23 RST_RESET XnWRESET Exynos hardware reset 48 USB_OTG_VBUS XuotgDRVVBUS USB OTG bus
24 GND Connected to GND 49 USB_OTG_ID XuotgID
25 50 RFU VIO Does not fit the standard
J6 connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 GND Connected to GND 26 GND Connected to GND
2 GPIO06 XispMCLK GPIO port 27 RFU VIO / OUT3 Does not fit the standard
3 GND Connected to GND 28 MIPI_DSI_D0_N XmipiMDN0 MIPI Display port
4 LDO17_1V2_300mA OUT17 PMIC LDO17 output 29 MIPI_DSI_D0_P XmipiMDP0
5 GND Connected to GND 30 MIPI_DSI_D1_N XmipiMDN1
6 AD_IN3 XadcAIN[3] ADC port 31 MIPI_DSI_D1_P XmipiMDP1
7 AD_IN0 XadcAIN[0] 32 MIPI_DSI_CLK_N XmipiMDNCLK
8 AD_IN2 XadcAIN[2] 33 MIPI_DSI_CLK_P XmipiMDPCLK
9 AD_IN1 XadcAIN[1] 34 MIPI_DSI_D2_N XmipiMDN2
10 GND Connected to GND 35 MIPI_DSI_D2_P XmipiMDP2
11 RFU XciFIELD Does not fit the standard 36 MIPI_DSI_D3_N XmipiMDN3
12 RFU XciDATA[3] 37 MIPI_DSI_D3_P XmipiMDP3
13 RFU XciVSYNC 38 GND Connected to GND
14 RFU XciCLKenb 39 MIPI_CSI1_D0_N XmipiSDN0 MIPI Camera port 1
15 RFU XciDATA[6] 40 MIPI_CSI1_D0_P XmipiSDP0
16 RFU XciDATA[0] 41 MIPI_CSI1_D1_N XmipiSDN1
17 RFU XciDATA[2] 42 MIPI_CSI1_D1_P XmipiSDP1
18 RFU XciPCLK 43 MIPI_CSI1_CLK_N XmipiSDNCLK
19 RFU XciDATA[7] 44 MIPI_CSI1_CLK_P XmipiSDPCLK
20 RFU XciDATA[4] 45 MIPI_CSI1_D2_N XmipiSDN2
21 RFU XciDATA[1] 46 MIPI_CSI1_D2_P XmipiSDP2
22 RFU XciDATA[5] 47 MIPI_CSI1_D3_N XmipiSDN3
23 RFU XciHREF 48 MIPI_CSI1_D3_P XmipiSDP3
24 GND Connected to GND 49 RFU VIO / OUT3 Does not fit the standard
25 50 GND Connected to GND
J7 connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 ?? Unused ?? 26 GND Connected to GND
2 27 RGMII_TXCLK Unused RGMII port
3 28 RGMII_TXD0
4 29 RGMII_TXD1
5 30 RGMII_TXD2
6 31 RGMII_TXD3
7 32 RGMII_TXDEN
8 33 RGMII_INT
9 GND Connected to GND 34 GND Connected to GND
10 SATA_RX_N SATA port 35 PCIE_CLK_N PCIE port
11 SATA_RX_P 36 PCIE_CLK_P
12 GND Connected to GND 37 PCIE_TX_N
13 PCIE_RX_N PCIE port 38 PCIE_TX_P
14 PCIE_RX_P 39 GND Connected to GND
15 PCIE_WAKE 40 SATA_TX_N SATA port
16 RGMII_MDC RGMII port 41 SATA_TX_P
17 RGMII_MDIO 42 GND Connected to GND
18 RGMII_REFCLK 43  ??  ??
19 RGMII_RXDV 44
20 RGMII_RXD3 45
21 RGMII_RXD2 46
22 RGMII_RXD1 47
23 RGMII_RXD0 48
24 RGMII_RXCLK 49
25 GND Connected to GND 50
J8 connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 BUCK8_3V3_300mA BUCK8 PMIC BUCK8 output 26 GND Connected to GND
2 27 GPIO07 XispRGB[9] GPIO port
3 GPIO41 XispRGB[12] GPIO port 28 GPIO08 XispRGB[0]
4 GND Connected to GND 29 GPIO09 XispRGB[4]
5 GPIO40 XispGP2 GPIO port 30 GPIO10 XispRGB[11]
6 GPIO39 XispVSYNC 31 GPIO11 XispRGB[10]
7 GPIO38 XispGP3 32 GPIO12 XispI2C1SCL
8 LDO14_1V8_150mA OUT14 PMIC LDO14 output 33 GPIO13 XispSPICSn
9 GND Connected to GND 34 GPIO14 XispRGB[5]
10 GPIO37 XispGP5 GPIO port 35 GPIO15 XispSPICLK
11 GPIO36 XispGP8 36 GPIO16 XispSPIMOSI
12 GPIO35 XispI2C1SDA 37 GPIO17 XispGP7
13 GPIO34 XispRGB[2] 38 GPIO18 XispSPIMISO
14 GPIO33 XispGP0 39 GPIO19 XispI2C0SDA
15 GPIO32 XispRGB[6] 40 GPIO20 XispGP6
16 GPIO31 XispRGB[1] 41 GPIO21 XispGP4
17 GPIO30 XispRGB[3] 42 GPIO22 XispPCLK
18 GND Connected to GND 43 GPIO23 XispHSYNC
19 MIPI_CSI2_D1_P Xmipi2LSDP1 MIPI Camera port 2 44 GPIO24 XispGP1
20 MIPI_CSI2_D1_N Xmipi2LSDN1 45 GPIO25 XispGP9
21 MIPI_CSI2_CLK_P Xmipi2LSDPCLK 46 GPIO26 XispRGB[8]
22 MIPI_CSI2_CLK_N Xmipi2LSDNCLK 47 GPIO27 XispI2C0SCL
23 MIPI_CSI2_D0_P Xmipi2LSDP0 48 GPIO28 XispRGB[13]
24 MIPI_CSI2_D0_N Xmipi2LSDN0 49 GPIO29 XispRGB[7]
25 GND Connected to GND 50 GND Connected to GND

Special attention deserves the following signals for newer motherboard designs. The next Reserved for Future Use (RFU) signals on the connectors are internally connected on the Exynos 4412 core board. The following table summarizes them.

Connector Pin IC Signal IC Connector Pin IC Signal IC
J2 5 Xi2s2SDI SoC J6 11 XciFIELD SoC
6 Xi2s2CDCLK 12 XciDATA[3]
49 Xi2s2SCLK 13 XciVSYNC
J3 3 Xi2s0SDO[1] SoC 14 XciCLKenb
4 Xi2s0SCLK 15 XciDATA[6]
5 Xi2s0SDO[0] 16 XciDATA[0]
6 Xi2s0SDO[2] 17 XciDATA[2]
7 Xi2s0CDCLK 18 XciPCLK
8 Xi2s0LRCK 19 XciDATA[7]
9 Xi2s0SDI 20 XciDATA[4]
10 P32KH PMIC 21 XciDATA[1]
J4 13 VDD33_BYP Hub USB 22 XciDATA[5]
J5 50 VIO/OUT3 PMIC 23 XciHREF
J6 27 VIO/OUT3 PMIC 28 VIO/OUT3 PMIC

Power

The next table shows the features of each one of the power supply signals on the Rhomb.io core connectors J1, J3, J4, J6 and J8.

Power supply Pin Connector Voltage(V) Max current(mA) Power supply Pin Connector Voltage(V) Max current(mA)
LDO03_1V8_300mA 45 J3 1,8 300 VSYS 25 J3 0-6 2400
LDO04_2V8_150mA 23 J1 2,8 150 26
LDO05_1V8_150mA 24 1,8 150 27
LDO09_1V8_150mA 39 J3 1,8 150 28
LDO10_1V8_300mA 44 1,8 300 29
LDO11_1V8_150mA 40 1,8 150 48 J4
LDO12_3V0_150mA 35 3 150 49
LDO13_1V8_150mA 3 J4 1,8 150 50
LDO14_1V8_150mA 8 J8 1,8 150 BUCK8_3V3_300mA 41 J3 3,3 1500
LDO16_1V8_150mA 37 J3 1,8 150 42
LDO17_1V2_300mA 4 J6 1,2 300 43
LDO19_1V8_150mA 33 J3 1,8 150 1 J8
LDO20_1V8_150mA 38 1,8 150 2
LDO21_2V8_300mA 31 2,8 300 BUCK9_3V3_300mA 46 J3 3,3 1500
LDO22_2V8_300mA 4 J4 2,8 300 47
LDO23_3V0_300mA 34 J3 3 300 48
LDO24_3V0_150mA 36 3 150 49
LDO25_3V0_150mA 30 3 150 50
LDO26_3V0_150mA 32 3 150

Note that each pin on the connector supports a maximum of 300mA. The VSYS signal is the PMIC input, while the other signals are all outputs.

Mechanical specifications


Exynos4412 Dimensions v1.JPG

Warranty

  • Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:
  1. The users should wear anti-static clothing and use earth band when manipulating the device.
  2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
  3. Equipment and work table must be earthed.
  4. Ionizer is recommended to remove electron charge.
  • Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
  • Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
  • Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
  • Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
  • Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
  • Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
  • EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

Disclaimer

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