This document shows the documentation for the rhomb.io GPS SE880 module. Preliminary version, use only for data updating or corrections.
The rhomb.io GPS SE880 module is a high-quality Assisted GPS (A-GPS) receiver developed to give to your device GPS functionality. Thanks to the integrated I2C EEPROM, the module features a time to fix satellites very quick, and integrates a GPS processor which deliver high performance while saving power. This board is interfaced trough UART and assembles an efficient chip antenna. It also accept external antenna which should be plugged on the UMMC type connector.
The next figure show a 3D view for the GPS SE880 module.
This slave board is a very sensible and efficient GPS receiver that includes all that your modular device needs for achieving navigation capacity. The Block Diagram shows that the GPS SE880 module is basically conformed by two Integrated Circuits (ICs): the GPS controller (Telit SE880) and the EEPROM (Microchip 24AA512).
The GPS SE88 module is built around the Telit SE880 System in Package (SiP), a GPS receiver that provides exceptional sensitivity, even in dense foliage and urban canyons. The very low power consumption of this SiP helps maximize runtimes in battery powered applications. It supports assisted ephemeris file injection (A-GPS) as well as Satellite Based Augmentation System (SBAS). For more information, look at the manufacturer documentation here (Telit SE880).
The module also includes internal data logging by using a low-power EEPROM memory for decreasing the Time to First Fix (TTFF). This memory has 512 kb of capacity and is controlled trough the I2C interface. Refer to the manufacturer documentation here (Microchip 24AA512 EEPROM).
The module has a small but efficient chip antenna fixed at the L1 band (1575.45 MHz). This band is the most extended for Global Navigation Satellite System (GNSS) applications today. It also includes a UMMC connector for external antennas.
See the following figure to identify the main parts of the board.
|GPS SE880 module features|
|Time to First Fix||22 s|
|Tracking sensitivity||-165 dBm|
|Navigation sensitivity||-163 dBm|
|Acquisition sensitivity||-148 dBm|
The following table summarizes the GPIOs used on the GPS SE880 module.
|rhomb.io pinout||Signal (module)||Device||Interruption|
The GPS.ON-OFF signal is used for turning on the GPS controller and the GPS.RESET# for reset it. The GPS.STATUS signal indicates the system is running when is at high level. It is quite recommendable to consult those GPIO functionalities on the manufacturer documentation (Telit SE880). Look also at the module specifications for the rhomb.io standard.
The following table indicates the available serial interfaces on the rhomb.io standard and its been indicated the used ones. The table also shows the nomenclature used on the rhomb.io standard and its corresponding on the schematic.
|Signal (rhomb.io)||Signal (module)||Used by||Signal (rhomb.io)||Signal (module)||Used by|
As it is shown in the table above, the module uses two serial interfaces: the I2C and the UART. The I2C is used by the GPS controller for manage the EEPROM, and the UART is used in order to manage the GPS controller. The I2C pull-ups resistors should be mounted on the bus, otherwise, the bus will not work. The resistors R3 and R4 can be used for this purpose. Because it is more common assemble the I2C pull-up resistors on the rhomb.io motherboards than on the rhomb.io modules, R3 and R4 are usually not mounted. For more details, look at the module specifications for the rhomb.io standard.
The Secure Digital Input Output (SDIO) interfaces are not used on the GPS SE880 module.
As per the supply lines used on the board, there is a summary on the next table. Note that the entire module is powered at 1.8 V.
|Signal (rhomb.io)||Signal (module)||Voltage (V)||Used|
|1V8 150mA||1V8 150mA||1.8||Yes|
|VSYS||3 - 5.5||No|
For more details, look at the module specifications for the rhomb.io standard.
The CLK_32KH, AD_OUT and PWM_INT signals are not used on the GPS SE880 module. More information regarding these signals can be found at the specifications for the rhomb.io standard.
Bill of materials
[ESTO ES LA HOJA DE CÁLCULO QUE HAY QUE ADJUNTARLA]
Part number package marking
[PONER VISTAS DEL CONECTOR E INTRUCCIONES DE CÓMO CONECTAR/DESCONECTAR]
- Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:
- The users should wear anti-static clothing and use earth band when manipulating the device.
- All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
- Equipment and work table must be earthed.
- Ionizer is recommended to remove electron charge.
- Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
- Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
- Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
- Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
- Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
- Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
- EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.
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