Helios v2.0

Overview

The Helios board is a certified Rhomb.io PCB that integrates the Rhomb.io modular ecosystem in a development board. Helios is immediately useful, you only need a Rhomb.io master module plugged on the board to start to develop your projects quickly and easily. Is not a simple development board, it is the most upgradable device you will find on the market. It gives the opportunity to easily assemble your machine according not only to your needs, but to your imagination.

The most common interfaces such USB, UART, I2C, SPI, digital inputs/outputs are available on board. But there are no limits on the Helios capabilities: LoRa, ZigBee, movement sensing, GPS..., all those are available on standard Rhomb.io modules. The only thing you need is connect them on the corresponding slots. Furthermore, several microcontrollers of differets manufacturers are compatible thanks to Rhomb.io modular technology. If there is a need for more processing power, you don't need to replace the Helios, the only thing you have to do is replace the master module for another more powerful. Helios board is fully compatible with Arduino and all its shields with extra features.

The next figure show a 3D view for the Helios board.


Helios20 3D Top v1.png Helios20 3D Bottom v1.png


As a summary, the following table indicates the main features:

Helios features
USB 2 x USB type B
SD micro-SD
Expansion headers 134 pins
Rhomb.io modules 1 Master Module slot
1 Slave Module slot

Applications:

  • Prototyping tool
  • Industrial automation
  • Home automation
  • Internet Of Things
  • Energy efficiency
  • Monitoring
  • Data acquisition
  • Technology for artists


Board specifications

Key features

The Helios board has been designed for working only with Rhomb.io standard modules, so a Rhomb.io core is not needed, only a master module. This board offers a huge amount of communications interfaces with easy access such as I2C, SPI, UART or USB. But it is not limited only to these features, the board also includes one socket for standard Rhomb.io modules. This brings a countless amount of customization options. The block diagram shows the parts that make it possible.

Helios20 Block Diagram v2.png

The following figure identify the main parts of the board. The most important parts will be explained with more details in the next sections.

Helios20 Description Top v3.png

Rhomb.io Core

The Helios board has no core sockets.


Rhomb.io Modules

Lots of Rhomb.io modules focused in different areas such as communications, sensing or storage, are available. The Helios board allows to connect one standard S300 Rhomb.io master module and one slave module. Look at here to chose the desired module to convert your Helios in the device you want.

Modules v2.jpg

Memory

Two memory options are available for the Helios board: a micro SD card and the Memory eMMC module. Note that in both cases, the Rhomb.io master module plugged on the Helios should support the SDIO-A interface.


Memory eMMC Module 3D Top v2.png Memory eMMC Module 3D Bottom v2.png

Connectivity

Wired

There are available 2 USB 2.0 ports on the Helios. One of them (J5) works as a host. The other one (J4) works as On-The-Go. The USB ports also are routed to the board headers. These ports can be used as a supply source too. See the "Power" section for more datails.

There are ICSP and JTAG connectors for programming and debugging the Rhomb.io master module plugged on the board. The following tables shows the pinout of the these connectors.

ICSP
Pin Function Pin Function
1 SPI-A_MISO 2 VIO_OUT
3 SPI-A_SCK 4 SPI-A_MOSI
5 #RESET_IN 6 GND
JTAG
Pin Funtion Pin Function
1 VIO_OUT 2 TMS/SWDIO
3 GND 4 TCK/SWCLK
5 GND 6 TDO/SWO
7 TRST 8 TDI
9 GND 10 #RESET_IN

It is also eight headers with a total of 134 pins. Four of these headers have the Arduino standar disposition, so you can use in the Helios board all shields compatible with Arduino and they will work as if it were the module 1 of the Rhomb.io standar. The other four headers allow to access to all S200 Rhomb.io master module signals. The following table shows the pinout of all headers.

H1 H3
Pin Function Pin Function
1 USB_P 1 I2C-A_SCL
2 USB_N 2 I2C-A_SDA
3 - 3 AREF0
4 - 4 GND
5 - 5 SPI-A_SCK
6 VIO_OUT 6 SPI-A_MISO
7 #RESET_IN 7 SPI-A_MOSI
8 3V3 8 SPI-A_CS0
9 VSYS 9 PWM0
10 GND 10 IO4
11 GND
12 VIN
H2 H4
Pin Function Pin Function
1 AD0 1 IO3
2 AD1 2 IO2
3 AD2 3 IO1
4 AD3 4 IO0
5 AD4 5 INT0
6 AD5 6 #NMI_MASTER
7 UART-A_TXD
8 UART-A_RXD
H5 H6
Pin Function Pin Function Pin Function Pin Function
1 TS_XR 2 IO28 1 IO8 2 DIFF-A_N
3 TS_YD 4 IO27 3 IO9 4 DIFF-A_P
5 TS_XL 6 IO26 5 IO10 6 AD3
7 TS_YU 8 SPI-A_CS2 7 IO11 8 COMP-B_N
9 GND 10 SPI-A_CS1 9 IO12 10 COMP-B_P
11 CAN-B_RXD 12 SPI-B_CS0 11 IO13 12 AREF1
13 CAN-B_TXD 14 SPI-B_SCK 13 IO14 14 GND
15 OTG_P 16 SPI-B_MISO 15 IO15 16 1V8
17 OTG_N 18 SPI-B_MOSI 17 IO16 18 2V8
19 OTG_ID 20 I2C-B_SCL 19 IO17 20 3V3
21 QSPI_CS1 22 I2C-B_SDA 21 IO18 22 VIN_REG
23 QSPI_CS2 24 UART-D_TXD 23 IO19 24 VSYS
25 RS485_TXEN 26 UART-D_RXD 25 IO20 26 CAPT1
27 PWM1 28 UART-C_TXD 27 IO21 28 CAPT0
29 PWM2 30 UART-C_RXD 29 IO22 30 INT6
31 PWM3 32 - 31 IO23 32 INT5
33 PWM4 34 COMP-A_N 33 DAC0 34 INT4
35 CAN-A_TXD 36 COMP-A_P 35 DAC1 36 INT3
37 CAN-A_RXD 38 AD6 37 1WIRE 38 INT2
39 GND 40 VBAT 39 GND 40 INT1
H7 H8
Pin Function Pin Function
1 QSPI_CS0 1 RESET_OUT
2 QSPI_IO3 2 IO2
3 QSPI_IO2 3 IO1
4 QSPI_CLK 4 IO0
5 QSPI_IO1 5 INT0
6 QSPI_IO0 6 #NMI_MASTER
7 #NMI_SLAVE 7 UART-A_TXD
8 UART-A_RXD
9 UART-A_RXD
10 UART-A_RXD
11 UART-A_RXD

For the S300 signal there are two 50-pin FPC connectors with the following pinout:

J1 J2
Pin Function Pin Function
1 RMII_MDC 1 CAM_HSYNC
2 RMII_MDIO 2 CAM_VSYNC
3 RMII_TXD1 3 CAM_PIXCLK
4 RMII_TXD0 4 CAM_PIXCLK_OUT
5 RMII_RX_CLK 5 CAM_D7
6 RMII_RXD0 6 CAM_D6
7 RMII_RXD1 7 CAM_D5
8 RMII_TX_EN 8 CAM_D4
9 RMII_RX_DV 9 CAM_D3
10 RMII_RX_ER 10 CAM_D2
11 GND 11 CAM_D1
12 - 12 CAM_D0
13 - 13 GND
14 - 14 LCD_BKL0
15 - 15 LCD_ON
16 - 16 LCD_HCK
17 - 17 LCD_HSYNC/HST/8bE
18 - 18 LCD_CLK/VCK
19 - 19 LCD_VSYNC/VST/8bRS
20 - 10 LCD_XFRP
21 - 21 LCD_RST
22 - 22 LCD_DEM/8bRW
23 - 23 LCD_EXTCLK
24 - 24 VD_IO0/LCD_BKL1
25 GND 25 GND
26 - 26 LCD_R7
27 - 27 LCD_R6
28 - 28 LCD_R5
29 - 29 LCD_R4
30 - 30 LCD_R3
31 - 31 LCD_R2
32 - 32 LCD_R1
33 - 33 LCD_R0
34 - 34 LCD_G7
35 - 35 LCD_G6
36 - 36 LCD_G5
37 GND 37 LCD_G4
38 I2S_CDCLK 38 LCD_G3
39 I2S_LRCK 39 LCD_G2
40 I2S_SCLK 40 LCD_G1
41 I2S_SDO 41 LCD_G0
42 I2S_SDI 42 LCD_B7
43 GND 43 LCD_B6
44 CAM_D13 44 LCD_B5
45 CAM_D12 45 LCD_B4
46 CAM_D11 46 LCD_B3
47 CAM_D10 47 LCD_B2
48 CAM_D9 48 LCD_B1
49 CAM_D8 49 LCD_B0
50 GND 50 GND

Helios20 Wired v1a.png

Wireless

The Helios board has nos wireless interfaces.


Video/Audio

The 50-pin FPC connnectors of Helios board has I2S (Inter-IC Sound), CAM port and LCD 71 lanes.

LEDs and Button

4 LEDs are assembled on the Helios board in order to give status feedback to the user. The functionality is explained next:

  • Red LED: Turned on when the power supply (from DC connector or USBs connectors) is ready.
  • Yellow LED: Turned on when the battery is being charging. Turned off when the battery is fully charged.
  • Green LED: Turned on when the battery is fully charged.
  • User LED: Programmable LED.

The Reset button is used to reset the microcontroller of the master module. In some aplications, the reset capacitor should be opened, so there is available a solder jumper located in the bottom side of the board. Notice that solder jumper is bypassed by default, so you must cut the indicated track the first time.

The User button is connected to the #NMI signals of the modules and can be programmed as you want.

Helios20 LEDsandButton v1.png

Connections

S300 Master Module

The following table summarizes the standard signals of the Rhomb.io master module socket and where they are used in the Helios board. These signals may have no functionality depending of the microcontrolled plugged on the board.


J301
Pin Signal Used by Pin Signal Used by
1 GND GND 50 GND GND
2 SDIO-A_CMD Slave Module, SD card 49 QSPI_CS0 H7 pin 1
3 SDIO-A_CDN Slave Module, SD card 48 QSPI_IO3 Slave Module, H7 pin 2
4 SDIO-A_DATA3 Slave Module, SD card 47 QSPI_IO2 Slave Module, H7 pin 3
5 SDIO-A_DATA2 Slave Module, SD card 46 QSPI_CLK Slave Module, H7 pin 4
6 SDIO-A_CLK Slave Module, SD card 45 QSPI_IO1 Slave Module, H7 pin 5
7 SDIO-A_DATA1 Slave Module, SD card 44 QSPI_IO0 Slave Module, H7 pin 6
8 SDIO-A_DATA0 Slave Module, SD card 43 GND GND
9 GND GND 42 USB_N J5 USB connector, H1 pin 2
10 - - 41 USB_P J5 USB connector, H1 pin 1
11 - - 40 GND GND
12 - - 39 UART-B_RXD Slave Module, H8 pin 3
13 - - 38 UART-B_TXD Slave Module, H8 pin 2
14 - - 37 GND GND
15 - - 36 I2C-A_SDA Slave Module, H3 pin 2
16 - - 35 I2C-A_SCL Slave Module, H3 pin 1
17 GND GND 34 #NMI_MASTER User button, H4 pin 6
18 BAT_RTC Slave Module, H8 pin 4 33 GND GND
19 CLK32K Slave Module, H8 pin 6 32 SPI-A_MISO Slave Module, ICSP connector, H3 pin 6
20 GND GND 31 SPI-A_MOSI Slave Module, ICSP connector, H3 pin 7
21 CAN-A_RXD Slave Module, H5 pin 37 30 SPI-A_CLK Slave Module, ICSP connector, H3 pin 5
22 CAN-A_TXD Slave Module, H5 pin 35 29 SPI-A_CS0 H3 pin 8
23 VBAT Battery 28 INT0 H4 pin 5
24 27 GND GND
25 26 RESET_OUT Slave Module, H8 pin 1
J302
Pin Signal Used by Pin Signal Used by
1 GND GND 50 GND GND
2 DIFF-A_N H6 pin 2 59 DIFF-A_P H6 pin 4
3 IO0 H4 pin 4 48 1WIRE Slave Module, ID EEPROM, H6 pin 37
4 IO1 H4 pin 3 47 VIO_OUT Slave Module, auxiliary circuits, H1 pin 6
5 IO2 H4 pin 2 46 VIO_IN_MASTER -
6 IO3 H4 pin 1 45 GND GND
7 IO4 H3 pin 10 44 1V8 1V8
8 IO5 H8 pin 11 43 GND GND
9 IO6 H8 pin 10 42 - -
10 IO7 H8 pin 9 41 - -
11 - - 40 - -
12 GND GND 39 - -
13 UART-A_RTSN H8 pin 8 38 GND GND
14 UART-A_RXD H4 pin 8 37
15 UART-A_TXD H4 pin 7 36 2V8 2V8
16 UART-A_CTSN H8 pin 7 35
17 GND GND 34 GND GND
18 AD0 H2 pin 1 33
19 GND GND 32 3V3 3V3
20 PWM0 User LED, H3 pin 9 31
21 CAPT0 Slave Module, H6 pin 28 30 GND GND
22 CAPT1 Slave Module, H6 pin 26 29
23 VSYS VSYS 28 VIN_REG VIN_REG
24 27
25 26 #RESET_IN Reset button, ICSP and JTAG/SWD connector, H1 pin 7
J303
Pin Signal Used by Pin Signal Used by
1 TS_XR H5 pin 1 50 AD5 H2 pin 6
2 TS_YD H5 pin 3 49 AD6 H5 pin 38
3 TS_XL H5 pin 5 48 COMP-A_P H5 pin 36
4 TS_YU H5 pin 7 47 COMP-A_N H5 pin 34
5 GND GND 46 GND GND
6 JTAG_TRST JTAG/SWD connector 45 UART-C_RXD Slave Module, H5 pin 30
7 CAN-B_RXD H5 pin 11 44 UART-C_TXD Slave Module, H5 pin 28
8 CAN-B_TXD H5 pin 13 43 UART-D_RXD H5 pin 26
9 PWM4 H5 pin 33 42 UART-D_TXD H5 pin 24
10 OTG_P Slave Module, J4 USB connector, H5 pin 15 41 I2C-B_SDA H5 pin 22
11 OTG_N Slave Module, J4 USB connector, H5 pin 17 40 I2C-B_SCL H5 pin 20
12 OTG_ID J4 USB connector, H5 pin 19 39 SPI-B_MOSI H5 pin 18
13 QSPI_CS1 Slave Module, H5 pin 21 38 SPI-B_MISO H5 pin 16
14 QSPI_CS2 H5 pin 23 37 SPI-B_SCK H5 pin 14
15 - - 36 SPI-B_CS0 H5 pin 12
16 - - 35 - -
17 - - 34 GND GND
18 - - 33 SPI-A_CS1 Slave Mpdule, H5 pin 10
19 - - 32 SPI-A_CS2 H5 pin 8
20 - - 31 IO26 H5 pin 6
21 - - 30 IO27 H5 pin 4
22 - - 29 IO28 H5 pin 2
23 - - 28 PWM3 H5 pin 31
24 - - 27 PWM2 H5 pin 29
25 RS485_TXEN H5 pin 25 26 PWM1 H5 pin 27
J304
Pin Signal Used by Pin Signal Used by
1 - - 50 IO8 Slave Module, H6 pin 1
2 - - 59 IO9 Slave Module, H6 pin 3
3 INT6 H6 pin 30 48 IO10 Slave Module, H6 pin 5
4 IN5 H6 pin 32 47 IO11 Slave Module, H6 pin 7
5 INT4 H6 pin 34 46 IO12 Slave Module, H6 pin 9
6 INT3 H6 pin 36 45 IO13 Slave Module, H6 pin 11
7 INT2 H6 pin 38 44 IO14 Slave Module, H6 pin 13
8 INT1 Slave Module, H6 pin 40 43 IO15 Slave Module, H6 pin 15
9 GND GND 42 GND GND
10 JTAG_TMS/SWDIO JTAG/SWD connector 41 IO16 H6 pin 17
11 JTAG_TCK/SWCLK 40 IO17 H6 pin 19
12 JTAG_TDO/SWO 39 IO18 H6 pin 21
13 JTAG_TDI 38 IO19 H6 pin 23
14 1V8 1V8 37 IO20 H6 pin 25
15 2V8 2V8 36 IO21 H6 pin 27
16 35 IO22 H6 pin 29
17 3V3 3V3 34 IO23 H6 pin 31
18 33 DAC0 H6 pin 33
19 32 DAC1 H6 pin 35
20 AREF1 H6 pin 12 31 - -
21 AREF0 H3 pin 3 30 GND GND
22 GND GND 29 AD1 Slave Module, H2 pin 2
23 COMP-B_P H6 pin 10 28 AD2 H2 pin 3
24 COMP-B_N H6 pin 8 27 AD3 H2 pin 4
25 AD13 H6 pin 6 26 AD4 H2 pin 5
J305
Pin Signal Used by Pin Signal Used by
1 RMII_MDC J1 FPC connector 50 GND GND
2 RMII_MDIO 49 CAM_D8 J1 FPC connector
3 RMII_TXD1 48 CAM_D9
4 RMII_TXD0 47 CAM_D10
5 RMII_RX_CLK 46 CAM_D11
6 RMII_RXD0 45 CAM_D12
7 RMII_RXD1 44 CAM_D13
8 RMII_TX_EN 43 GND GND
9 RMII_RX_DV 42 I2S_SDI J1 FPC connector
10 RMII_RX_ER 41 I2S_SDO
11 GND GND 40 I2S_SCLK
12 - - 39 I2S_LRCK
13 - - 38 I2S_CDCLK
14 - - 37 GND GND
15 - - 36 - -
16 - - 35 - -
17 - - 34 - -
18 - - 33 - -
19 - - 32 - -
20 - - 31 - -
21 - - 30 - -
22 - - 29 - -
23 - - 28 - -
24 - - 27 - -
25 GND GND 26 - -
J306
Pin Signal Used by Pin Signal Used by
1 LCD_R7 J2 FPC connector 50 GND GND
2 LCD_R6 59 VD_IO0/LCD_BKL1 J2 FPC connector
3 LCD_R5 48 LCD_EXTCLK
4 LCD_R4 47 LCD_DEN/8bRW
5 LCD_R3 46 LCD_RST
6 LCD_R2 45 LCD_XFRP
7 LCD_R1 44 LCD_VSYNC/VST/8bRS
8 LCD_R0 43 LCD_CLK/VCK
9 LCD_G7 42 LCD_HSYNC/HST/8bE
10 LCD_G6 41 LCD_HCK
11 LCD_G5 40 LCD_ON
12 LCD_G4 39 LCD_BKL0
13 LCD_G3 38 GND GND
14 LCD_G2 37 CAM_D0 J2 FPC connector
15 LCD_G1 36 CAM_D1
16 LCD_G0 35 CAM_D2
17 LCD_B7 34 CAM_D3
18 LCD_B6 33 CAM_D4
19 LCD_B5 32 CAM_D5
20 LCD_B4 31 CAM_D6
21 LCD_B3 30 CAM_D7
22 LCD_B2 29 CAM_PIXCLK_OUT
23 LCD_B1 28 CAM_PIXCLK
24 LCD_B0 27 CAM_VSYNC
25 GND GND 26 CAM_HSYNC

For more details, look at the specifications for the Rhomb.io standard.

For the I2C interface, the board provides two pull-up resistors (R6 and R7). Those pull-ups are defined as normally connected to the supply. If you want to disconnect the supply, there is a solder jumber next to the pull-up resistors.

Power

The Helios board provides the needed voltages on the Rhomb.io sockets. For doing so, Low Dropout Regulators (LDO) has been included for supplying the "1V8", "2V8" and "3V3" voltages. The "VSYS" voltage is switched in between 5V from DC connector, 5V from USB connectors and VBAT (battery voltage) according to the following cases:

  • There is battery but the USBs or DC connector are not connected: VSYS = VBAT
  • There is battery and the USBs or DC connector are connected: VSYS = 5V
  • There is no battery and the USBs or DC connector is connected: VSYS = 5V
  • There is no battery and the USBs or DC connector is not connected: VSYS = 0V.

As per the above, the Helios board can work connected to a USB 5V source, connected to a DC source or with a battery. In this last case, only single cell Li-Po or Li-Ion batteries are supported. The charging current ranges from 15 to 500 mA. You can adjust it with potentiometer P1 following the next formula:

Ichrg(mA) = 1000V/(2k+P1)ohm

The "on/off" header allows you to turn off the system while the battery is still charging.

The input voltage range for the DC connector is 3V to 40V.

The following table summarizes the power supply signals on the Helios board and indicates where are used.

Signal (Rhomb.io) Voltage (V) Device
5V 5 VSYS rail
5V_USB 5
VBAT VBAT VSYS rail, Rhomb.io module, H5 pin 40
VSYS 3 - 5.5 Rhomb.io modules, H1 pin 9, H6 pin 24
3V3 3.3 Rhomb.io modules, H1 pin 8, H6 pin 20
2V8 2.8 Rhomb.io modules, H6 pin 18
1V8 1.8 Rhomb.io modules, H6 pin 18

Schematics

Click the image below to download the schematic files.

Bill of materials

Click the image below to download the BOM files.

Gerber files

Click the image below to download the fabrication files.

Mechanical specifications

Board

Helios20 Dimensions v1.png

Warranty

  • Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:
  1. The users should wear anti-static clothing and use earth band when manipulating the device.
  2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
  3. Equipment and work table must be earthed.
  4. Ionizer is recommended to remove electron charge.
  • Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
  • Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
  • Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
  • Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
  • Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
  • Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
  • EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

Disclaimer

Rhomb.io reserves the right to make corrections, enhancements, improvements and other changes to its products and services, and to discontinue any product or service. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All the hardware products are sold subject to the Rhomb.io terms and conditions of sale supplied at the time of order acknowledgment.

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