Qualcomm Snapdragon 410E

This document shows the documentation for the Qualcomm Snapdragon 410E Rhomb.io Core.

Overview

The Qualcomm Snapdragon 410E Core is a certified Rhomb.io Core Module based on the Qualcomm Snapdragon 410E System on a Chip (SoC). This thin and small board is easily pluggable on the Standard Rhomb.io Core Sockets of the series S400 and has been designed to be the brain of a Rhomb.io Modular System. It mainly accomplishes two different roles: power supply management and computing.

The main characteristic of this core (as well as the other Rhomb.io Cores) is the full integration in such a small board of all the essential components to make the system work: CPU, GPU, RAM and power management. Users that mount this core on a Rhomb.io Motherboard (or on a well-designed custom board) will find that the only thing they should provide is a proper power source and a mass storage device with an installed OS.

The processor embedded in this core is a high performance compact SoC, designed to meet the demanding requirements of embedded computing applications with its high performance, energy efficiency, multimedia features, integrated connectivity and long-term support. The Qualcomm Snapdragon 410E core is an ideal solution for Internet of Things (IoT) applications requiring computing horsepower and integrated Wi-Fi and Bluetooth connectivity such as connected homes, building automation, industrial control, digital signage, smart surveillance and other IoT devices.

The next table summarizes the main features of the Rhomb.io Qualcomm Snapdragon 410E Core.

Qualcomm Snapdragon 410E Core features
CPU: Quad-core ARM Cortex A53 @ 1.2GHz
Memory: LPDDR3 @ 533MHz (1GB or 2GB)
GPU: Adreno A306
DSP: Hexagon QDSP6 v5 core @ 691MHz
Wi-Fi and Bluetooth connectivity
TNFG uOMIC system power management
Off board program and storage memory
Unique Factory-Programmed 64-Bit ROM ID Number
CryptoAuthentication Device (performs ECDSA & ECDH)
100% Rhomb.io S400 Socket compatible


Qualcomm Snapdragon 410E top v1.pngQualcomm Snapdragon 410E bot v1.png


Core specifications

The Qualcomm Snapdragon 410E is a core integrated into the the Rhomb.io platform, and it has been developed with the IoT and Embedded Computing in mind. It integrates more and increasingly complex functions, while providing high performance, rich multimedia, low power consumption and support for multiple operating systems.

This board mounts a Qualcomm Snapdragon 410E SoC capable of deliver great computing capabilities with very low power consumption. Its high performance is achieved by four ARM Cortex A53 cores runnning at 1.2GHz, based on the architecture ARMv8-A, who offers an efficient 32-bit and 64-bit instruction set. The memory options include 1GB or 2GB high efficient LPDDR3 @ 533MHz.

The graphic core embedded in the SoC is the Adreno A306, and efficient GPU working at 400MHz with support of multiple APIs including OpenGL ES 3.0/2.0/1.1, OpenCL 1.1e for Android and DirectX 9.3 for Windows 10. It can manage MIPI displays with resolutions up to 1900x1200 and HDMI displays up to 1080p. The Miracast protocol is supported too, with resolutions up to 720p.

The tasks involving signal processing are runned by the Hexagon QDSP6 v5 core. Working at 691MHz, this DSP can handle significant compute workloads for image processing applications such as virtual reality, augmented reality, image processing, video processing, and computer vision in a very efficient way. Besides, it acts inside the SoC as a low power island for "always on" sensor-aware applications.

Two MIPI-CSI interfaces allows the Qualcomm Snapdragon 410E core to support two cameras. The integrated Image Sensor Processor is capable to work with images up to 13MP, and the multimedia features include 1080p video capture at 30 FPS and H.264 Codec playback.

Unlike other Rhomb.io Cores, the Qualcomm Snapdragon 410E core integrates a full Wi-Fi and Bluetooth interface with its own antenna connector. No external circuits or modules are required to provide wireless connectivity to this Core, making it particularly suitable for IoT and portable designs.

The power solution to this core is provided by the uOMIC, a power management micro-module of TNFG. The uOMIC generates all voltages needed by the SoC, the memory and all other ICs in the Core. It also deliver multiple LDOs and BUCKs rails that can be used freely by the designers and users to power any other circuits on their motherboard designs.

The Qualcomm Snapdragon 410E core shares two more characteristics with all other Core Modules in Rhomb.io Ecosystem: a 1-Wire factory-programmed ROM (with a unique 64-bit ID number) and a crypto-authentication device that ensures that the core and the firmware it runs are not cloned, counterfeited, or tampered with.

Finally, the versatility of this core is reflected in its multiple operating system support: Linux, Android and Windows 10.


Qualcomm Snapdragon 410E Block Diagram v1.jpg


Qualcomm Snapdragon 410E Description top v1 .png
Qualcomm Snapdragon 410E Description bot v1 .png

Connectors

The following table indicates the pinout of each one of the ten connectors. The signals have been grouped according to their functionality and according to the Rhomb.io Standard. Each pin on the connector supports a maximum of 300 mA.


J401 Connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 GND GND 26 GND GND
2 CAN-A_TXD NOT AVAILABLE CAN interface 27 UART-C_RTSN NOT AVAILABLE UART-B interface
3 CAN-A_RXD 28 SPI-B_CSN GPIO_10 (BLSP 3) SPI-B interface
4 I2S_SCLK GPIO_113 I2S interface 29 UART-A_TXD GPIO_0 (BLSP 1) UART-A interface
5 CAN-B_TXD NOT AVAILABLE CAN interface 30 PWM outputs NOT AVAILABLE PWM outputs
6 CAN-B_RXD 31 SPI-A_CLK GPIO_19 (BLSP 5) SPI-A interface
7 I2S_LRCK GPIO_110 I2S interface 32 PWM outputs NOT AVAILABLE PWM outputs
8 I2S_CDCLK NOT AVAILABLE 33 UART-D_RXD NOT AVAILABLE UART-D interface
9 I2S_SDO GPIO_114 34 I2C-B_SCL GPIO_15 (BLSP 4) I2C-B interface
10 I2S_SDI NOT AVAILABLE 35 GND GND
11 I2C-A_SCL GPIO_23 (BLSP 6) I2C-A interface 36
12 UART-B_RXD GPIO_5 (BLSP 2) UART-B interface 37
13 SPI-B_CLK GPIO_11 (BLSP 3) SPI-B interface 38 UART-A_RTSN GPIO_3 (BLSP 1) UART-A interface
14 GND GND 39 SPI-B_MISO GPIO_9 (BLSP 3) SPI-B interface
15 40 SPI-A_MISO GPIO_17 (BLSP 5) SPI-A interface
16 41 UART-C_CTSN NOT AVAILABLE UART-C interface
17 PWM_OUT2 NOT AVAILABLE PWM 2 output 42 I2C-A_SDA GPIO_22 (BLSP 6) I2C-A interface
18 PWM_OUT3 NOT AVAILABLE PWM 3 output 43 UART-B_CTSN GPIO_6 (BLSP 2) UART-B interface
19 SPI-A_MOSI GPIO_16 (BLSP 5) SPI-A interface 44 UART-A_CTSN GPIO_2 (BLSP 1) UART-A interface
20 UART-C_RXD NOT AVAILABLE UART-C interface 45 UART-D_TXD NOT AVAILABLE UART-D interface
21 SPI-B_MOSI GPIO_8 (BLSP 3) SPI-B interface 46 UART-A_RXD GPIO_1 (BLSP 1) UART-A interface
22 UART-B_TXD GPIO_4 (BLSP 2) UART-B interface 47 UART-B_RTSN GPIO_7 (BLSP 2) UART-B interface
23 I2C-B_SDA GPIO_14 (BLSP 4) I2C-B interface 48 UART-C_TXD NOT AVAILABLE UART-C interface
24 SPI-A_CSN GPIO_18 (BLSP 5) SPI-A interface 49 RFU NOT AVAILABLE Reserved
25 GND GND 50 GND GND
J402 Connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 GND GND 26 GND GND
2 27 VIDEO_VD15 NOT AVAILABLE RGB video output
3 VIDEO_VD16 NOT AVAILABLE RGB video output 28 VIDEO_VD00
4 VIDEO_VD22 29 VIDEO_CLK
5 VIDEO_VD13 30 VIDEO_VD18
6 VIDEO_VD01 31 VIDEO_SYS_OE
7 VIDEO_VD04 32 VIDEO_VD11
8 VIDEO_VD09 33 VIDEO_VSYNC
9 VIDEO_VSYNC_LDI 34 VIDEO_VD06
10 VIDEO_VD23 35 VIDEO_HSYNC
11 VIDEO_VD14 36 VIDEO_VD12
12 GND GND 37 VIDEO_VD03
13 38 VIDEO_VD17
14 VIDEO_VD05 NOT AVAILABLE RGB video output 39 SWDIO_CLK uOMIC SWDCLK SWD interface
15 VIDEO_VD10 40 SWDIO_DATA uOMIC SWDDIO
16 VIDEO_EN 41 GND GND
17 VIDEO_VD20 42 HDMI_D2_P HDMI Bridge TX2+ HDMI interface
18 VIDEO_VD07 43 HDMI_D2_N HDMI Bridge TX2-
19 VIDEO_VD08 44 HDMI_D1_P HDMI Bridge TX1+
20 VIDEO_VD02 45 HDMI_D1_N HDMI Bridge TX1-
21 VIDEO_VD21 46 HDMI_D0_P HDMI Bridge TX0+
22 VIDEO_VD19 47 HDMI_D0_N HDMI Bridge TX0-
23 LDO-A_2V8 uOMIC OUT04 uOMIC OUT04 LDO 48 HDMI_CLK_P HDMI Bridge TXC+
24 LDO-B uOMIC OUT05 uOMIC OUT05 LDO 49 HDMI_CLK_N HDMI Bridge TXC-
25 GND GND 50 GND GND
J403 Connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 RXER NOT AVAILABLE MII interface 26 GND GND
2 GND GND 27 GPIO01 GPIO_57 GPIOs
3 HSIC_DATA NOT AVAILABLE HSIC interface 28 GPIO02 GPIO_55
4 HSIC_STROBE NOT AVAILABLE 29 GND GND
5 GND GND 30
6 XEINT15 GPIO_68 Interruptions 31 GPIO03 GPIO_58 GPIOs
7 XEINT14 GPIO_66 32 GPIO00 GPIO_59
8 XEINT13 HDMI Bridge CEC 33 HSIC_OC NOT AVAILABLE HSIC interface
9 XEINT12 GPIO_120 34 JTAG_TMS TMS JTAG interface
10 XEINT11 GPIO_52 35 GPIO04 GPIO_53 GPIOs
11 XEINT10 GPIO_49 36 GPIO05 GPIO_56
12 XEINT09 GPIO_108 37 JTAG_TRSTN TRST_N JTAG interface
13 XEINT08 GPIO_69 38 HSIC_PWREN NOT AVAILABLE HSIC interface
14 XEINT07 HDMI Bridge HPD 39 JTAG_TDI TDI JTAG interface
15 XEINT06 GPIO_54 40 JTAG_CLK TCK
16 XEINT05 GPIO_62 41 JTAG_TDO TDO
17 XEINT04 GPIO_34 42 GND GND
18 XEINT03 GPIO_35 43 USB_OTG_P USB_SOC_P (Device) USB OTG interface
19 XEINT02 GPIO_36 44 USB_OTG_N USB_SOC_N (Device)
20 XEINT01 GPIO_12 45 GND GND
21 RST_OUT RESOUT_N Reset output 46 USB_OTG_DRVBUS NOT AVAILABLE USB OTG interface
22 XEINT00 GPIO_13 Interruptions 47 JTAG_NRST SRST_N JTAG interface
23 RST_CPU uOMIC GPIO1 CPU reset 48 USB_OTG_VBUS GPIO_121 USB OTG interface
24 GND GND 49 USB_OTG_ID NOT AVAILABLE
25 50 TXER NOT AVAILABLE MII interface
J404 Connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 GND GND 26 GND GND
2 GPIO06 GPIO_24 GPIOs 27 QSPI_CS1 NOT AVAILABLE QSPI interface
3 GND GND 28 MIPI_DSI_D0_N MIPI_DSI0_LN0_N MIPI display interface
4 LDO-C uOMIC OUT17 uOMIC OUT17 LDO 29 MIPI_DSI_D0_P MIPI_DSI0_LN0_P
5 GND GND 30 MIPI_DSI_D1_N MIPI_DSI0_LN1_N
6 AD_IN3 NOT AVAILABLE ADC inputs 31 MIPI_DSI_D1_P MIPI_DSI0_LN1_P
7 AD_IN0 32 MIPI_DSI_CLK_N MIPI_DSI0_CLK_N
8 AD_IN2 33 MIPI_DSI_CLK_P MIPI_DSI0_CLK_P
9 AD_IN1 34 MIPI_DSI_D2_N MIPI_DSI0_LN2_N
10 GND GND 35 MIPI_DSI_D2_P MIPI_DSI0_LN2_P
11 RFU NOT AVAILABLE Reserved 36 MIPI_DSI_D3_N MIPI_DSI0_LN3_N
12 RFU 37 MIPI_DSI_D3_P MIPI_DSI0_LN3_P
13 RFU 38 GND GND
14 LVDS_TX0_P NOT AVAILABLE LVDS interfae 39 MIPI_CSI-A_D0_N MIPI_CSI0_LN0_N MIPI camera interface A
15 LVDS_TX_N 40 MIPI_CSI-A_D0_P MIPI_CSI0_LN0_P
16 LVDS_TX1_N 41 MIPI_CSI-A_D1_N MIPI_CSI0_LN1_N
17 LVDS_TX1_P 42 MIPI_CSI-A_D1_P MIPI_CSI0_LN1_P
18 LVDS_TX2_N 43 MIPI_CSI-A_CLK_N MIPI_CSI0_CLK_N
19 LVDS_TX2_P 44 MIPI_CSI-A_CLK_P MIPI_CSI0_CLK_P
20 LVDS_CLK_N 45 MIPI_CSI-A_D2_N MIPI_CSI0_LN2_N
21 LVDS_CLK_P 46 MIPI_CSI-A_D2_P MIPI_CSI0_LN2_P
22 LVDS_TX3_P 47 MIPI_CSI-A_D3_N MIPI_CSI0_LN3_N
23 LVDS_TX3_N 48 MIPI_CSI-A_D3_P MIPI_CSI0_LN3_P
24 GND GND 49 QSPI_CS2 NOT AVAILABLE QSPI interface
25 50 GND GND
J405 Connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 GND GND 26 GND GND
2 PCIE-B_RX_N NOT AVAILABLE PCIE-B interface 27 TXCLK NOT AVAILABLE MII port
3 PCIE-B_RX_P 28 TXD0
4 PCIE-B_WAKE 29 TXD1
5 GND GND 30 TXD2
6 31 TXD3
7 SATA-B_RX_N GNSS_BB_QN GNSS interface 32 TXDEN
8 SATA-B_RX_P GNSS_BB_QP 33 INT/COL
9 GND GND 34 GND GND
10 SATA-A_RX_N NOT AVAILABLE SATA-A interface 35 PCIE-A_CLK_N NOT AVAILABLE PCIE-A interface
11 SATA-A_RX_P 36 PCIE-A_CLK_P
12 GND GND 37 PCIE-A_TX_N
13 PCIE-A_RX_N NOT AVAILABLE PCIE-A interface 38 PCIE-A_TX_P
14 PCIE-A_RX_P 39 GND GND
15 PCIE-A_WAKE 40 SATA-A_TX_N NOT AVAILABLE SATA-A interface
16 MDC NOT AVAILABLE MII interface 41 SATA-A_TX_P
17 MDIO 42 GND GND
18 REFCLK/CRS 43 SATA-B_TX_N GNSS_BB_IN GNSS interface
19 RXDV 44 SATA-B_TX_P GNSS_BB_IP
20 RXD3 45 GND GND
21 RXD2 46 PCIE-B_CLK_N NOT AVAILABLE PCIE-B interface
22 RXD1 47 PCIE-B_CLK_P
23 RXD0 48 PCIE-B_TX_N
24 RXCLK 49 PCIE-B_TX_P
25 GND GND 50 GND GND
J406 Connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 BUCK-A_3V3 uOMIC BUCK8 uOMIC BUCK8 26 GND GND
2 27 GPIO07 GPIO_116 GPIOs
3 BUS_1WIRE GPIO_101 1-Wire bus 28 GPIO08 GPIO_106
4 GND GND 29 GPIO09 GPIO_75
5 GPIO40 GPIO_26 GPIOs 30 GPIO10 GPIO_105
6 GPIO39 GPIO_33 31 GPIO11 GPIO_93
7 GPIO38 GPIO_28 32 GPIO12 GPIO_94
8 LDO-D uOMIC OUT14 uOMIC OUT14 LDO 33 GPIO13 GPIO_99
9 GND GND 34 GPIO14 GPIO_88
10 GPIO37 GPIO_30 GPIOs 35 GPIO15 GPIO_89
11 GPIO36 GPIO_27 36 GPIO16 GPIO_100
12 GPIO35 GPIO_29 37 GPIO17 GPIO_87
13 GPIO34 GPIO_84 38 GPIO18 GPIO_91
14 GPIO33 GPIO_85 39 GPIO19 GPIO_104
15 GPIO32 GPIO_79 40 GPIO20 GPIO_64
16 GPIO31 GPIO_78 41 GPIO21 GPIO_63
17 GPIO30 GPIO_77 42 GPIO22 GPIO_65
18 GND GND 43 GPIO23 GPIO_61
19 MIPI_CSI-B_D1_P MIPI_CSI1_LN1_P MIPI camera interface B 44 GPIO24 GPIO_67
20 MIPI_CSI-B_D1_N MIPI_CSI1_LN1_N 45 GPIO25 GPIO_70
21 MIPI_CSI-B_CLK_P MIPI_CSI1_CLK_P 46 GPIO26 GPIO_71
22 MIPI_CSI-B_CLK_N MIPI_CSI1_CLK_N 47 GPIO27 GPIO_74
23 MIPI_CSI-B_D0_P MIPI_CSI1_LN0_P 48 GPIO28 GPIO_76
24 MIPI_CSI-B_D0_N MIPI_CSI1_LN0_N 49 GPIO29 GPIO_73
25 GND GND 50 GND GND
J407 Connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 GND GND 26 GND GND
2 27 SDIO-B_DATA1 SDC1_DATA_5 SDIO-B interface
3 LDO-Q_1V8 uOMIC OUT13 uOMIC OUT13 LDO 28 AUX_CLK NOT AVAILABLE
4 LDO-R_2V8 uOMIC OUT22 uOMIC OUT22 LDO 29 SDIO-B_DATA2 SDC1_DATA_6
5 SDIO-D_CMD NOT AVAILABLE SDIO-D interface 30 AUX_CDN NOT AVAILABLE
6 SDIO-D_CLK 31 SDIO-B_DATA0 SDC1_DATA_4
7 SDIO-D_DATA2 32 AUX_CMD NOT AVAILABLE
8 SDIO-D_CDN 33 SDIO-B_DATA3 SDC1_DATA_7
9 SDIO-D_DATA1 34 SDIO-A_DATA0 SDC1_DATA_0 SDIO-A interface
10 SDIO-D_DATA0 35 SDIO-A_DATA1 SDC1_DATA_1
11 SDIO-D_DATA3 36 SDIO-A_CLK SDC1_CLK
12 GND Connected to GND 37 SDIO-A_DATA2 SDC1_DATA_2
13 uOMIC_1WIRE uOMIC 1WIRE uOMIC 1-Wire bus 38 SDIO-A_DATA3 SDC1_DATA_3
14 USB-C_HOST_OC NOT AVAILABLE USB-C interface 39 SDIO-A_CDN NOT AVAILABLE
15 USB-C_HOST_EN NOT AVAILABLE 40 SDIO-A_CMD SDC1_CMD
16 GND GND 41 SDIO-C_DATA3 SDC2_DATA_3 SDIO-C interface
17 USB-B_HOST_N USBDN2_DN USB-B interface 42 SDIO-C_CLK SDC2_CLK
18 USB-B_HOST_P USBDN2_DP 43 SDIO-C_DATA1 SDC2_DATA_1
19 GND GND 44 SDIO-C_DATA2 SDC2_DATA_2
20 USB-C_HOST_N USBDN3_DN USB-C interface 45 SDIO-C_CMD SDC2_CMD
21 USB-C_HOST_P USBDN3_DP 46 SDIO-C_DATA0 SDC2_DATA_0
22 GND GND 47 SDIO-C_CDN NOT AVAILABLE
23 USB-A_HOST_N USBDN1_DN USB-A interface 48 VSYS uOMIC power input
24 USB-A_HOST_P USBDN1_DP 49
25 GND GND 50
J408 Connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 GND GND 26 VSYS uOMIC power input
2 27
3 BAT_RTC uOMIC VCOIN uOMIC RTC power input 28
4 RFU NOT AVAILABLE Reserved 29
5 30 LDO-E uOMIC OUT25 uOMIC OUT25 LDO
6 31 LDO-F uOMIC OUT21 uOMIC OUT21 LDO
7 32 LDO-G uOMIC OUT26 uOMIC OUT26 LDO
8 CLK32K_1_REF uOMIC V32KHO1 CLK32K_0 reference voltage input 33 LDO-H uOMIC OUT19 uOMIC OUT19 LDO
9 CLK32K_2_REF uOMIC V32KHO2 CLK32K_1 reference voltage input 34 LDO-I uOMIC OUT23 uOMIC OUT23 LDO
10 CLK32K_0 uOMIC 32KHO1 32.768 KHz CLK output 0 35 LDO-J_3V0 uOMIC OUT12 uOMIC OUT12 LDO
11 CLK32K_1 uOMIC 32KHO2 32.768 KHz CLK output 1 36 LDO-K uOMIC OUT24 uOMIC OUT24 LDO
12 PWR_ON uOMIC #PWRON System power ON 37 LDO-L uOMIC OUT16 uOMIC OUT16 LDO
13 GND GND 38 LDO-M_1V8 uOMIC OUT20 uOMIC OUT20 LDO
14 39 LDO-N uOMIC OUT09 uOMIC OUT09 LDO
15 PMIC_RST_2 uOMIC #RESET uOMIC reset 40 LDO-O_1V8 uOMIC OUT11 uOMIC OUT11 LDO
16 PMIC_RST_1 uOMIC #RESET 41 BUCK-A_3V3 uOMIC BUCK8 uOMIC BUCK8
17 BOOT_SW1 GPIO_81 Boot lines 42
18 BOOT_SW5 GPIO_86 43
19 BOOT_SW3 GPIO_83 44 LDO-P uOMIC OUT10 uOMIC OUT10 LDO
20 BOOT_SW2 GPIO_82 45 VDDIO uOMIC OUT03 uOMIC OUT03 LDO
21 BOOT_SW4 GPIO_37 46 BUCK-B_3V3 uOMIC BUCK9 uOMIC BUCK9
22 BOOT_SW0 GPIO_80 47
23 GND GND 48
24 49
25 VSYS uOMIC power input 50

Power

The next table shows the features of each one of the power outputs pins on the Rhomb.io Core Connectors. The pinout corresponds to the Rhomb.io Standard.

Power outputs
Power supply Connector Pin Def. Voltage (V) Max. Current (mA) Def. State Type
VDDIO J408 45 1.8 300 ON Fixed
LDO-A_2V8 J402 23 2.8 150 ON Fixed
LDO-B J402 24 1.8 150 ON Regulable
LDO-C J404 4 1.2 300 OFF Regulable
LDO-D J406 8 1.8 150 ON Regulable
LDO-E J408 30 3.0 150 OFF Regulable
LDO-F J408 31 2.8 300 ON Regulable
LDO-G J408 32 3.0 150 OFF Regulable
LDO-H J408 33 1.8 150 OFF Regulable
LDO-I J408 34 3.0 300 OFF Regulable
LDO-J_3V0 J408 35 3.0 150 ON Fixed
LDO-K J408 36 3.0 150 OFF Regulable
LDO-L J408 37 1.8 150 ON Regulable
LDO-M_1V8 J408 38 1.8 150 ON Fixed
LDO-N J408 39 1.8 150 OFF Regulable
LDO-O_1V8 J408 40 1.8 150 ON Fixed
LDO-P J408 30 1.8 300 ON Regulable
LDO-Q_1V8 J407 3 1.8 150 ON Fixed
LDO-R_2V8 J407 4 2.8 300 ON Fixed
BUCK-A_3V3 J406 1 3.3 1500 OFF Fixed
2
J408 41
42
43
BUCK-B_REG J408 46 3.3 1500 OFF Regulable
47
48
49
50


The next table shows the features of each one of the power input pins on the Rhomb.io Core Connectors. The pinout corresponds to the Rhomb.io Standard.

Power inputs
Power input Connector Pin Min Voltage (V) Max Voltage (V) Max Current (A)
VSYS J407 48 3.7 5.5 2.4
49
50
J408 25
26
27
28
29

Note that each pin on the connectors supports a maximum of 300 mA.

Mechanical specifications

Qualcomm Snapdragon 410E Dimensions v1.png

Warranty

  • Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:
  1. The users should wear anti-static clothing and use earth band when manipulating the device.
  2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
  3. Equipment and work table must be earthed.
  4. Ionizer is recommended to remove electron charge.
  • Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
  • Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
  • Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
  • Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
  • Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
  • Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
  • EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

Disclaimer

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