Renesas RZ/A1H - RZ/A1M

This document shows the documentation for the Renesas RZ/A1H - RZ/A1M Rhomb.io Core Module.

Overview

The Renesas RZ/A1H - RZ/A1M is a certified Rhomb.io Core Module based on the Renesas RZ/A1H and RZ/A1M System on Chip (SoC). Those processors are pin to pin compatible and the only difference in between them is that the RZ/A1H has 10MB of RAM and the RZ/A1M has 5MB of RAM.

This single-chip SoC includes an ARM Cortex A9 processor able to support both Linux, RTO or bare-metal programming. With 2D graphics accelerator, LVDS output and a wide variety of communications buses such as USB, CAN, I2C, I2S, Ethernet, SPI, QSPI, etc, this Rhomb.io Core is the ideal solution for IoT and HMI applications.

As the Rhomb.io Standard specifies, the Renesas RZ/A1H - RZ/A1M Core Module also integrates the power control and offers a wide amount of interfaces ready to fit in your modular-based product. Look at the following table to see the main capabilities.

Renesas RZ/A1H - RZ/A1M Core features
CPU: ARM Cortex A-9 @ 400MHz, 32 bits
RAM: 10MB (RZ/A1H) or 5MB (RZ/A1M)
Graphics: 2D acceleration supporting OpenVG
Flash memory: up to 2xQSPI 64 or 128 MB
LVDS port for display connection
TNFG uOMIC system power management
Off-and-On board program and storage memory
Unique Factory-Programmed 64-Bit ROM ID Number
CryptoAuthentication Device (performs ECDSA & ECDH)
100% Rhomb.io S400 Socket compatible


Renesas RZA1H-RZA1M Top v2.png
Core Renesas RZA1H-RZA1M bottom v2.png

Core specifications

The Renesas RZ/A1H - RZ/A1M Core assembles a single-chip SoC which includes an ARM Cortex A9 processor with 32-KByte L1 instruction cache, a 32-Kbyte L1 data cache, and a 128-Kbyte L2 cache. This SoC also includes on-chip peripheral functions necessary for system configuration, such as 10-MByte (RZ/A1H) or 5-MByte (RZ/A1M) large-capacity RAM (128 Kbytes are shared by the data-retention RAM), data-retention RAM, 2D graphics accelerator based on OpenVG, and a wide amount of port interconnections.

For the user program, the board embeds two Flash memories available in 16MB and 32MB. The system booting can be done through one of those onboard Flash memories or through external memories connected to the eMMC or SD interfaces available on the standard Rhomb.io Connectors.

Enabled for support with Linux, RTOS or bare-metal, this Rhomb.io Core Module is the ideal device for designing modular and intelligent IoT and Human Interface (HMI) devices with compactness and high performance. It also manages the power supply for complete modular systems and is easily pluggable on the standard Rhomb.io Core Sockets. Look at the following table to see the complete capabilities according to the Rhomb.io Standard.

Rhomb.io available interfaces
Video HDMI No USB HSIC No SATA SATA-A No Ethernet RGMII No
LVDS Yes OTG Yes SATA-B No RMII No
RGB No USB-A Yes PCIE PCIE-A No MII Yes
MIPI DSI No USB-B Yes PCIE-B No Clocks CLK32K_0 Yes
CSI No USB-C Yes 1WIRE BUS Yes CLK32K_1 Yes
SDIO SDIO-A Yes UART UART-A Yes uOMIC Yes CAN CAN-A Yes
SDIO-B Yes UART-B Yes QSPI Yes CAN-B Yes
SDIO-C Yes UART-C Yes I2S Yes GPIO 18
SDIO-D No UART-D Yes A/D 2
SPI SPI-A Yes I2C I2C-A Yes PWM 4 XINT 6
SPI-B Yes I2C-B Yes

The power solution for this Core is provided by the Tecnofingers uOMIC, an integrated Power Managemet Integrated Circuit (PMIC) that contains 9 high efficient buck converters, 26 LDOs, RTC, 3-channel 32kHz clock output, backup battery charger, manual reset and shutdown inputs, reset output, input and output interrupts and UART serial interface to program individual regulator output voltages and on/off control. All this for having a complete and eficient power management of the entyre modular system.

The Renesas RZ/A1H - RZ/A1M core also integrates a 1-Wire factory-programmed ROM (with a unique 64-bit ID number) and a crypto-authentication device that ensures that the core and the firmware it runs are not cloned, counterfeited, or tampered with.

The following image shows the Block Diagram.


Renesas RZA1H-RZA1M BlockDiagram v03.JPG


Renesas RZA1H-RZA1M DescriptionTop v2.png Renesas RZA1H-RZA1M DescriptionBottom v2.png

Flash Memories

As it has been indicated above, the Renesas RZ/A1H - RZ/A1M core module assembles two Flash memories with two capacity available: 2x16MB or 2x32MB. Those two flash memories are controlled trough QSPI and all the signals are available on the connectors Aux1 and Aux2 for programming them. The following diagram specifies the flash memories interconnections with the SoC.


Renesas RZA1H-RZA1M FlashMemDiagram v1.JPG

It is possible to use the Flash Memory 1 for system booting. Look at the Bootloader section for more details.

UART Switch

The Renesas RZ/A1H - RZ/A1H Rhomb.io Core Module includes a 1x2 double pole analog switch for allowing UART communication in between the SoC and the Tecnofingers uOMIC PMIC. The same UART port can be switched to connect with the UART-D port on the Rhomb.io Standard Connectors (J401).

The switching can be done by driving high or low the pin P6_15 on the SoC according to the following table.

P6_15 status Description
'0' Default status. The SoC UART port connects to the Rhomb UART-D port
'1' The SoC UART port connects to the PMIC

On the default status (low level), the SoC UART port connects with the Rhomb.io UART port D (UART-D, connector J401). When the pin P6_15 is at high level, the SoC UART port connects to the PMIC UART port for power management. In this mode, any change in the PMIC default configuration may cause system failures or even irreversible damage.

Step Up

There is a low noise and low ripple 5V-output Step-Up IC for the USB2.0. This switched power supply can provide a maximum of 240 mA to the OTG VBUS. Take care to not connect any device on the VBUS line that may overcome this value.

Bootloader

The Renesas RZ/A1H - RZ/A1M offers three modes for booting the system: through the onboard Flash memory 1 or through external memories connected to the eMMC or SD interfaces available on the standard Rhomb.io Connectors. For doing so, the signals BOOT_SW0 to BOOT_SW5 should be configured as indicated on the next table. Those signals are available on the J408 connector.

Booting configuration
BOOT_ Mode Description
SW0 SW1 SW2 SW3 SW4 SW5
1 1 X 0 X 0 SPI Flash memory 1 booting
1 1 X 1 X 0 eMMC SDIO-A Rhomb.io channel
1 0 X 1 X 0 SD SDIO-C Rhomb.io channel

Auxiliar connectors

The Auxiliar connector 1 and Auxiliar connector 2 give access to the Flash Memory 1 and the Flash Memory 2 in order to program them.

The Auxiliar connector 2 also allows to program the Tecnofingers uOMIC power management circuit (PMIC). This feature is only for firmware updating and any change on it may cause serious damage on the Renesas RZ/A1H - RZ/A1M Rhomb.io Core and the entire system where it is connected. Only for Rhomb.io usage.

The next table identifies the signals connected to the Auxiliar connector 1 and the Auxiliar connector 2.

Auxiliar connectors pinout
Connector 1 Connector 2
Pin Signal Pin Signal Pin Signal Pin Signal
1 Memories Vcc 6 Mem. 1 Data2 1 Memories Vcc 6 Mem. 2 Data2
2 Mem. CLK 7 Mem. 1 Data3 2 Mem. CLK 7 Mem. 2 Data3
3 Mem. #CS 8 Unused 3 Mem. #CS 8 SWDIO_DATA
4 Mem. 1 Data0 9 Memories #RST 4 Mem. 2 Data0 9 SWDIO_CLK
5 Mem. 1 Data1 10 VSYS 5 Mem. 2 Data1 10 PMIC #RST

Connectors

The following table indicates the pinout of each one of the eight Rhomb.io Standard connectors. It has been grouped the signals according to its functionality and according to the Rhomb.io Standard. Each pin on the connector supports a maximum of 300 mA.

J401 Connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 GND GND 26 GND GND
2 CAN-A_TXD P7_9 CAN interface 27 UART-C_RTSN P7_7 UART-B interface
3 CAN-A_RXD P7_8 28 SPI-B_CSN P8_4 SPI-B interface
4 I2S_SCLK P4_4 I2S interface 29 UART-A_TXD P6_6 UART-A interface
5 CAN-B_TXD P5_10 CAN interface 30 PWM_OUT0 P3_2 PWM 0 output
6 CAN-B_RXD P1_4 31 SPI-A_CLK P2_12 SPI-A interface
7 I2S_LRCK P4_5 I2S interface 32 PWM_OUT1 P3_0 PWM output 1
8 I2S_CDCLK NOT AVAILABLE 33 UART-D_RXD P6_2* UART-D interface
9 I2S_SDO P2_11 34 I2C-B_SCL P1_2 I2C-B interface
10 I2S_SDI P4_6 35 GND GND
11 I2C-A_SCL P1_0 I2C-A interface 36
12 UART-B_RXD P6_13 UART-B interface 37
13 SPI-B_CLK P8_3 SPI-B interface 38 UART-A_RTSN NOT AVAILABLE UART-A interface
14 GND GND 39 SPI-B_MISO P8_6 SPI-B interface
15 40 SPI-A_MISO P2_15 SPI-A interface
16 41 UART-C_CTSN P7_6 UART-C interface
17 PWM_OUT2 P4_7 PWM 2 output 42 I2C-A_SDA P1_1 I2C-A interface
18 PWM_OUT3 P3_3 PWM 3 output 43 UART-B_CTSN NOT AVAILABLE UART-B interface
19 SPI-A_MOSI P2_14 SPI-A interface 44 UART-A_CTSN NOT AVAILABLE UART-A interface
20 UART-C_RXD P7_5 UART-C interface 45 UART-D_TXD P3_1* UART-D interface
21 SPI-B_MOSI P8_5 SPI-B interface 46 UART-A_RXD P6_7 UART-A interface
22 UART-B_TXD P6_12 UART-B interface 47 UART-B_RTSN NOT AVAILABLE UART-B interface
23 I2C-B_SDA P1_3 I2C-B interface 48 UART-C_TXD P7_4 UART-C interface
24 SPI-A_CSN P2_13 SPI-A interface 49 RFU NOT AVAILABLE Reserved
25 GND GND 50 GND GND
J402 Connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 GND GND 26 GND GND
2 27 VIDEO_VD15 NOT AVAILABLE RGB video output
3 VIDEO_VD16 NOT AVAILABLE RGB video output 28 VIDEO_VD00
4 VIDEO_VD22 29 VIDEO_CLK
5 VIDEO_VD13 30 VIDEO_VD18
6 VIDEO_VD01 31 VIDEO_SYS_OE
7 VIDEO_VD04 32 VIDEO_VD11
8 VIDEO_VD09 33 VIDEO_VSYNC
9 VIDEO_VSYNC_LDI 34 VIDEO_VD06
10 VIDEO_VD23 35 VIDEO_HSYNC
11 VIDEO_VD14 36 VIDEO_VD12
12 GND GND 37 VIDEO_VD03
13 38 VIDEO_VD17
14 VIDEO_VD05 NOT AVAILABLE RGB video output 39 SWDIO_CLK uOMIC SWDCLK SWD interface
15 VIDEO_VD10 40 SWDIO_DATA uOMIC SWDDIO
16 VIDEO_EN 41 GND GND
17 VIDEO_VD20 42 HDMI_D2_P NOT AVAILABLE HDMI interface
18 VIDEO_VD07 43 HDMI_D2_N
19 VIDEO_VD08 44 HDMI_D1_P
20 VIDEO_VD02 45 HDMI_D1_N
21 VIDEO_VD21 46 HDMI_D0_P
22 VIDEO_VD19 47 HDMI_D0_N
23 LDO-A_2V8 uOMIC OUT04 uOMIC OUT04 LDO 48 HDMI_CLK_P
24 LDO-B uOMIC OUT05 uOMIC OUT05 LDO 49 HDMI_CLK_N
25 GND GND 50 GND GND
J403 Connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 RXER P3_5 Ethernet interface 26 GND GND
2 GND GND 27 GPIO01 NOT AVAILABLE GPIOs
3 HSIC_DATA NOT AVAILABLE HSIC interface 28 GPIO02
4 HSIC_STROBE 29 GND GND
5 GND GND 30
6 XEINT15 NOT AVAILABLE Interruptions 31 GPIO03 P1_11 GPIOs
7 XEINT14 32 GPIO00 P1_10
8 XEINT13 P6_1 33 HSIC_OC NOT AVAILABLE HSIC interface
9 XEINT12 NOT AVAILABLE 34 JTAG_TMS TMS/SWDIO JTAG interface
10 XEINT11 35 GPIO04 P0_5 GPIOs
11 XEINT10 36 GPIO05 NOT AVAILABLE
12 XEINT09 37 JTAG_TRSTN #TRST JTAG interface
13 XEINT08 38 HSIC_PWREN NOT AVAILABLE HSIC interface
14 XEINT07 P6_8 39 JTAG_TDI JP0_0 JTAG interface
15 XEINT06 NOT AVAILABLE 40 JTAG_CLK TCK/SWDCLK
16 XEINT05 41 JTAG_TDO JP0_1
17 XEINT04 42 GND GND
18 XEINT03 P6_9 43 USB_OTG_P DP1 USB OTG interface
19 XEINT02 P6_10 44 USB_OTG_N DM1
20 XEINT01 P6_11 45 GND GND
21 RST_OUT NOT AVAILABLE Reset output 46 USB_OTG_DRVBUS NOT AVAILABLE USB OTG interface
22 XEINT00 P1_15 Interruptions 47 JTAG_NRST #RST_SoC JTAG interface
23 RST_CPU NOT AVAILABLE CPU reset 48 USB_OTG_VBUS USB_OTG_VBUS USB OTG

interface

24 GND GND 49 USB_OTG_ID NOT AVAILABLE
25 50 TXER P2_1 Ethernet interface
J404 Connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 GND GND 26 GND GND
2 GPIO06 NOT AVAILABLE GPIOs 27 QSPI_CS1 NOT AVAILABLE QSPI interface
3 GND GND 28 MIPI_DSI_D0_N NOT AVAILABLE MIPI display interface
4 LDO-C uOMIC OUT17 OUT17 29 MIPI_DSI_D0_P
5 GND GND 30 MIPI_DSI_D1_N
6 AD_IN3 P1_12 ADC inputs 31 MIPI_DSI_D1_P
7 AD_IN0 P1_13 32 MIPI_DSI_CLK_N
8 AD_IN2 NOT AVAILABLE 33 MIPI_DSI_CLK_P
9 AD_IN1 34 MIPI_DSI_D2_N
10 GND GND 35 MIPI_DSI_D2_P
11 RFU NOT AVAILABLE Reserved 36 MIPI_DSI_D3_N
12 37 MIPI_DSI_D3_P
13 38 GND GND
14 LVDS_TX0_P P5_6 LVDS interface 39 MIPI_CSI-A_D0_N NOT AVAILABLE MIPI camera interface A
15 LVDS_TX0_N P5_7 40 MIPI_CSI-A_D0_P
16 LVDS_TX1_N P5_5 41 MIPI_CSI-A_D1_N
17 LVDS_TX1_P P5_4 42 MIPI_CSI-A_D1_P
18 LVDS_TX2_N P5_3 43 MIPI_CSI-A_CLK_N
19 LVDS_TX2_P P5_2 44 MIPI_CSI-A_CLK_P
20 LVDS_CLK_N P5_1 45 MIPI_CSI-A_D2_N
21 LVDS_CLK_P P5_0 46 MIPI_CSI-A_D2_P
22 LVDS_TX3_P NOT AVAILABLE 47 MIPI_CSI-A_D3_N
23 LVDS_TX3_N 48 MIPI_CSI-A_D3_P
24 GND GND 49 QSPI_CS2 NOT AVAILABLE QSPI interface
25 50 GND GND
J405 Connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 GND GND 26 GND GND
2 PCIE-B_RX_N NOT AVAILABLE PCIE-B interface 27 TXCLK P2_0 Ethernet interface
3 PCIE-B_RX_P 28 TXD0 P2_4
4 PCIE-B_WAKE 29 TXD1 P2_5
5 GND GND 30 TXD2 P2_6
6 31 TXD3 P2_7
7 SATA-B_RX_N NOT AVAILABLE SATA-B interface 32 TXDEN P2_2
8 SATA-B_RX_P 33 INT/COL P1_14
9 GND GND 34 GND GND
10 SATA-A_RX_N NOT AVAILABLE SATA-B interface 35 PCIE-A_CLK_N NOT AVAILABLE PCIE-A interface
11 SATA-A_RX_P 36 PCIE-A_CLK_P
12 GND GND 37 PCIE-A_TX_N
13 PCIE-A_RX_N NOT AVAILABLE PCIE-A interface 38 PCIE-A_TX_P
14 PCIE-A_RX_P 39 GND GND
15 PCIE-A_WAKE 40 SATA-A_TX_N NOT AVAILABLE SATA-A interface
16 MDC P5_9 Ethernet interface 41 SATA-A_TX_P
17 MDIO P7_13 42 GND GND
18 REFCLK/CRS P2_3 43 SATA-B_TX_N NOT AVAILABLE SATA-B interface
19 RXDV P3_6 44 SATA-B_TX_P
20 RXD3 P7_12 45 GND GND
21 RXD2 P2_10 46 PCIE-B_CLK_N NOT AVAILABLE PCIE-B interface
22 RXD1 P2_9 47 PCIE-B_CLK_P
23 RXD0 P2_8 48 PCIE-B_TX_N
24 RXCLK P3_4 49 PCIE-B_TX_P
25 GND GND 50 GND GND
J406 Connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 BUCK-A_3V3 uOMIC BUCK8 uOMIC BUCK8 26 GND GND
2 27 GPIO07 P7_3 GPIOs
3 BUS_1WIRE BUS_1WIRE 1-WIRE interface 28 GPIO08 P7_1
4 GND GND 29 GPIO09 P7_11
5 GPIO40 NOT AVAILABLE GPIOs 30 GPIO10 P3-9
6 GPIO39 31 GPIO11 P0_4
7 GPIO38 32 GPIO12 NOT AVAILABLE
8 LDO-D uOMIC OUT14 uOMIC OUT14 LDO 33 GPIO13
9 GND GND 34 GPIO14
10 GPIO37 NOT AVAILABLE GPIOs 35 GPIO15 P1_6
11 GPIO36 36 GPIO16 P1_7
12 GPIO35 37 GPIO17 P7_10
13 GPIO34 38 GPIO18 P7_14
14 GPIO33 39 GPIO19 P8_1
15 GPIO32 40 GPIO20 NOT AVAILABLE
16 GPIO31 41 GPIO21
17 GPIO30 42 GPIO22
18 GND GND 43 GPIO23 P8_2
19 MIPI_CSI-B_D1_P NOT AVAILABLE MIPI camera

interface B

44 GPIO24 P8_0
20 MIPI_CSI-B_D1_N 45 GPIO25 P7-15
21 MIPI_CSI-B_CLK_P 46 GPIO26 P8_7
22 MIPI_CSI-B_CLK_N 47 GPIO27 P4_9
23 MIPI_CSI-B_D0_P 48 GPIO28 NOT AVAILABLE
24 MIPI_CSI-B_D0_N 49 GPIO29
25 GND GND 50 GND GND
J407 Connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 GND GND 26 GND GND
2 27 SDIO-B_DATA1 P4_1 SDIO-B interface
3 LDO-Q_1V8 uOMIC OUT13 uOMIC OUT13 LDO 28 AUX_CLK NOT AVAILABLE
4 LDO-R_2V8 uOMIC OUT22 uOMIC OUT22 LDO 29 SDIO-B_DATA2 P4_2
5 SDIO-D_CMD NOT AVAILABLE SDIO-D interface 30 AUX_CDN NOT AVAILABLE
6 SDIO-D_CLK 31 SDIO-B_DATA0 P4_0
7 SDIO-D_DATA2 32 AUX_CMD NOT AVAILABLE
8 SDIO-D_CDN 33 SDIO-B_DATA3 P4_3
9 SDIO-D_DATA1 34 SDIO-A_DATA0 P3_11 SDIO-A interface
10 SDIO-D_DATA0 35 SDIO-A_DATA1 P3_10
11 SDIO-D_DATA3 36 SDIO-A_CLK P3_12
12 GND GND 37 SDIO-A_DATA2 P3_15
13 uOMIC_1WIRE uOMIC_1WIRE uOMIC 1-WIRE bus 38 SDIO-A_DATA3 P3_14
14 USB-C_HOST_OC NOT AVAILABLE USB interface C 39 SDIO-A_CDN P3_8
15 USB-C_HOST_EN 40 SDIO-A_CMD P3_13
16 GND GND 41 SDIO-C_DATA3 P4_14 SDIO-C interface
17 USB-B_HOST_N USBDN2_DN USB interface B 42 SDIO-C_CLK P4_12
18 USB-B_HOST_P USBDN2_DP 43 SDIO-C_DATA1 P4_10
19 GND GND 44 SDIO-C_DATA2 P4_15
20 USB-C_HOST_N USBDN3_DN USB interface C 45 SDIO-C_CMD P4_13
21 USB-C_HOST_P USBDN3_DP 46 SDIO-C_DATA0 P4_11
22 GND GND 47 SDIO-C_CDN P4_8
23 USB-A_HOST_N USBDN1_DN USB interface A 48 VSYS VSYS uOMIC power input
24 USB-A_HOST_P USBDN1_DP 49
25 GND GND 50
J408 Connector
Pin Nº Pin name IC Signal Description Pin Nº Pin name IC Signal Description
1 GND GND 26 VSYS VSYS uOMIC power input
2 27
3 BAT_RTC BAT_RTC uOMIC RTC power input 28
4 RFU NOT AVAILABLE Reserved 29
5 30 LDO-E uOMIC OUT25 uOMIC OUT25 LDO
6 31 LDO-F uOMIC OUT21 uOMIC OUT21 LDO
7 32 LDO-G uOMIC OUT26 uOMIC OUT26 LDO
8 CLK32K_0_REF CLK32K_0_REF CLK32K_0 reference voltage input 33 LDO-H uOMIC OUT19 uOMIC OUT19 LDO
9 CLK32K_1_REF CLK32K_1_REF CLK32K_1 reference voltage input 34 LDO-I uOMIC OUT23 uOMIC OUT23 LDO
10 CLK32K_0 CLK32K_0 32.768 KHz CLK output 0 35 LDO-J_3V0 uOMIC OUT12 uOMIC OUT12 LDO
11 CLK32K_1 CLK32K_1 32.768 KHz CLK output 1 36 LDO-K uOMIC OUT24 uOMIC OUT24 LDO
12 PWR_ON PWR_ONr System power ON 37 LDO-L uOMIC OUT16 uOMIC OUT16 LDO
13 GND GND 38 LDO-M_1V8 uOMIC OUT20 uOMIC OUT20 LDO
14 39 LDO-N uOMIC OUT09 uOMIC OUT09 LDO
15 #PMIC_RST_1 #PMIC_RST_1 uOMIC reset 40 LDO-O_1V8 uOMIC OUT11 uOMIC OUT11 LDO
16 #PMIC_RST_0 #PMIC_RST_0 41 BUCK-A_3V3 uOMIC BUCK8 uOMIC BUCK8
17 BOOT_SW1 P7_0 Booting interface 42
18 BOOT_SW5 BSCANP 43
19 BOOT_SW3 P0_1 44 LDO-P uOMIC OUT10 uOMIC OUT10 LDO
20 BOOT_SW2 P0_3 45 VDDIO uOMIC OUT12 uOMIC OUT12 LDO
21 BOOT_SW4 P0_2 46 BUCK-B_3V3 uOMIC BUCK9 uOMIC BUCK9
22 BOOT_SW0 P0_0 47
23 GND GND 48
24 49
25 VSYS VSYS uOMIC power input 50


Power

For the Renesas RZ/A1H - RZ/A1M power management has been used the Tecnofingers uOMIC Integrated Circuit. This powerful and tinny Power Management Integrated Circuit (PMIC) is configured for both supply all the needed power lines for accomplishing the Rhomb.io S400 Standard, and also to provide to the system the required power for the internal chips. The PMIC power input is provided through VSYS, a signal available on the Rhomb.io Standard connectors J407 and J408.

More details regarding the Tecnofingers uOMIC IC can be found at the manufacturer documentation.

This Rhomb.io Core Module also includes a low noise and low ripple 5V-output Step-Up IC for the USB2.0. This switched power supply can provide a maximum of 240 mA to the OTG VBUS. Take care to not connect any device on the VBUS line that may overcome this value.

The next table shows the features of each one of the power supply signals that are available on the Rhomb.io Core Connectors J402, J404, J406, J407 and J408. Pinout according to the Rhomb.io Standard.

Power outputs
Power supply Connector Pin Def. Voltage (V) Max. Current (mA) Def. State Type
VDDIO J408 45 3.3 300 ON Fixed
LDO-A_2V8 J402 23 2.8 150 ON Fixed
LDO-B J402 24 1.8 150 ON Regulable
LDO-C J404 4 1.2 300 OFF Regulable
LDO-D J406 8 1.8 150 ON Regulable
LDO-E J408 30 3.0 150 OFF Regulable
LDO-F J408 31 2.8 300 ON Regulable
LDO-G J408 32 3.0 150 OFF Regulable
LDO-H J408 33 1.8 150 OFF Regulable
LDO-I J408 34 3.0 300 OFF Regulable
LDO-J_3V0 J408 35 3.0 150 ON Fixed
LDO-K J408 36 3.0 150 OFF Regulable
LDO-L J408 37 1.8 150 ON Regulable
LDO-M_1V8 J408 38 1.8 150 ON Fixed
LDO-N J408 39 1.8 150 OFF Regulable
LDO-O_1V8 J408 40 1.8 150 ON Fixed
LDO-P J408 30 3.0 300 ON Regulable
LDO-Q_1V8 J407 3 1.8 150 ON Fixed
LDO-R_2V8 J407 4 2.8 300 ON Fixed
BUCK-A_3V3 J406 1 3.3 1500 OFF Fixed
2
J408 41
42
43
BUCK-B_REG J408 46 3.3 1500 OFF Regulable
47
48
49
50

Note that each pin on the Rhomb.io Standard connector supports a maximum of 300 mA. The VSYS signal is the PMIC input, while the other signals are all outputs.

The next table shows the features of each one of the power input pins on the Rhomb.io Core Connectors. The pinout corresponds to the Rhomb.io Standard.

Power inputs
Power input Connector Pin Min Voltage (V) Max Voltage (V) Max Current (A)
VSYS J407 48 3.3 5.5 2.4
49
50
J408 25
26
27
28
29

Finally, the following table summarises the different power rails used internally on the Renesas RZ/A1H - RZ/A1M Rhomb.io Core.

Core internal power
Voltage (V) Device Power pin Current (mA) Test conditions uOMIC output Total max. current (mA)
3.3 SoC PVcc 100 Max. BUCK5 543.71
AVcc 4 During A/D conversion
AVref 1
LVDSAPVcc 48 During LVDS transfer
USBAPVcc 4 USB in use
VDAVcc 60 Max.
Flash memory 1 Vcc 100 Max.
Flash memory 2 Vcc 100 Max.
Reset Vcc 0.0025 Max.
Oscil 12MHz Vcc 4.5 Max.
UART switch Vcc 50 Max.
USB Hub VBAT 72 Max.
Pull-ups 0.2 Max.
1.18 SoC Vcc 850 Max. BUCK3 866.5
PLLVcc 8 Max.
LVDSPLLVcc 2.5 Max.
USBAVcc 6 USB in use
1.8 Step-up EN NA LDO03 72.35
Pull-ups 0.34 Max.
USB hub VDD_CORE_REG 72 Max.
2 uOMIC INL2 750 Max. BUCK7 750
uOMIC INL5 750 Max. BUCK1 750
3 - 5.5 Step-up VIN 140 Max. VSYS 8150.55
uOMIC INB1 750 Max.
INB3 866.5 Max.
INB5 543.71 Max.
INB7 1050.34 Max.
INB8 1500 Max.
INB9 1500 Max.
INL4 750 Max.
INL6 900 Max.
INL7 150 Max.

Mechanical specifications


RENCOREv1 dimensions.JPG

Warranty

  • Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:
  1. The users should wear anti-static clothing and use earth band when manipulating the device.
  2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
  3. Equipment and work table must be earthed.
  4. Ionizer is recommended to remove electron charge.
  • Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
  • Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
  • Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
  • Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
  • Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
  • Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
  • EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

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