S100 Master - EZ-BLE PRoC v1.0

This document shows the documentation for the Rhomb.io S100 Master - EZ-BLE PRoC Module.

Overview

The S100 Master - EZ-BLE PRoC Module is a Rhomb.io platform compatible module that allows wireless communications through Bluetooth Low Energy (BLE), one of the most used wireless technology standard widely spread on the consumer electronics industry and focused on the low power consumption. The device is BLE 4.1 compliant and includes an ARM Cortex M0 microcontroller with 128KB of flash memory. It can work as Master Module or as Slave Module. It also includes two voltage translators (FXMA108), which are used to reconfigure the signals that the EZ-PRoC receives.

The next figure show a 3D view for the S100 Master - EZ-BLE PRoC Module.

EZ-BLE PRoC11 3D Top.png EZ-BLE PRoC11 3D Bottom.png


There are available three variants of the Rhomb.io S100 Master - EZ-BLE PRoC Module. The next table highlights the main differences in between them.

S100 Master - EZ-BLE PRoC Module variants
Part Number Flash (KB) Certified
CYBLE-022001-00 128 4.1
CYBLE-222005-00 256 4.1
CYBLE-222014-01 256 4.2

Applications:

  • Wireless communications
  • IoT
  • Wearables
  • User interface
  • Education

Module specification

Key features

The Bluetooth Low Energy (BLE) is a wireless communication technology that works on the 2.4 GHz range and is focused on low power consumption. This technology is included on the most of the smartphones and tablets on the market, and is compatible with the Bluetooth former versions. The S100 Master - EZ-BLE PRoC Module is based on the Cypress System on Chip (SoC) EZ-PRoC. This is a programmable radio-on-chip fully certified and qualified for supporting BLE 4.1. It includes a 32-bit ARM Cortex-M0 microcontroller operating at 48MHz and with 128KB or 256KB of flash memory and 16KB or 32KB of SRAM, depending on the chosen module variation. The next table summarizes the mentioned features.

S100 Master - EZ-BLE PRoC Module features
Bluetooth 4.1/4.2 [1]
Microcontroller ARM Cortex M-0
Flash memory 128KB/256KB [1]
SRAM 16KB/32KB [1]

The S100 Master - EZ-BLE PRoC Module has been conceived for working as Master Module, but it could also work as a Slave Module. For doing so, the user should design a chip-to-chip protocol for maintaining the communication in between the master IC and the Bluetooth module. It also should be mentioned that, although some guidelines about the used SoC are explained on this document, it is quite recommended to consult for more specific information the Cypress official documentation (Cypress documentation).

Regarding the power supply, the block diagram shows that it comes from the Rhomb.io Module Connectors. Concretely two sources can be used: "3V3" and "2V8". Each power source is connected by a solder jumper so you can choose "DVCC" by soldering one of the solder jumpers,"3V3" or "2V8". By default the solder jumper of the 3V3 power source is soldered.

S100 Master - EZ-BLE PRoC Module BLOCKDIAGRAM.PNG

Three serial communication ports are used on the module: UART, SPI and I2C. All of them cross a voltage translator before they arrive to EZ-PRoC.

The next figure identifies the main parts of the S100 Master - EZ-BLE PRoC Module. It can be found specific information for some of those parts on the following sections.

EZ-BLE PRoC11 Description.png

Solder Jumpers

There are six solder jumpers in the S100 Master - EZ-BLE PRoC Module.

Three of them are used to choose the "GPIO_AUX" function from EZ-BLE PRoC: "#NMI", "1WIRE" and "RESET_OUT".

Two solder jumpers are used to choose the supply voltage of the module. With them, you can make "DVCC" be "3V3" or "2V8".

The last one is used to enable or disable the user LED, witch is connected to PWM0 signal.

PSoC pin mapping

The EZ-PRoC SoC allows port mapping on compiling time. The configuration should be done as the table below describes.

Functionality Signal SoC Pin Functionality Signal SoC Pin
UART TX 3 (P5.1) SPI MISO 9 (P0.5)
RX 4 (P5.0) MOSI 8 (P0.4)
CTS 2 (P4.1) CLK 12 (P1.7)
RTS 21 (P4.0) CSN(CS0) 6 (P1.6)
I2C SDA 16 (P3.4) INT 17 (P3.7)
SCL 15 (P3.5) PWM0/LED Anhode 18 (P1.4)
I2C-INT(#NMI) 19 (P1.5) AD AD0 20 (P3.6)
GPIO/SWD IO0/SWDIO 11(P0.6) GND GND 10
IO1/SWDCLK 7(P0.7) GND 1
POWER VDD(DVCC) 13 XRES RESET 14
VDDR(DVCC) 5

As we can see in the image below:
S100 Master - EZ-BLE PRoC Module PRoCpins.JPG

LED

There is a green LED on the board assembled for user purposes. As it can be seen on the Schematics, the anode is connected to the pin 18 (P1.4) on the SoC and to the pin 7 (PWM0/LED) on the FXMA108 trough a 220Ω resistor. The cathode is connected to ground which makes the led be always turned on, so for connecting and disconnecting the Led there is a solder jumper.


S100 Master - EZ-BLE PRoC Module LED.PNG


SWDIO

The Serial Wire Debug Input Output (SWDIO) is an interface used for flashing and debugging the EZ-PRoC SoC. This interface uses two pins for programming/debugging (SWDIO and SWDCLK). The board gives easy access to those signals and also to the SoC hardware reset pin, to the main supply and to GND. The next figure identifies each one of the signals on the board.



S100 Master - EZ-BLE PRoC Module CONNECTIONS.PNG

Connections

GPIO

The following table summarizes the GPIOs used on the S100 Master - EZ-BLE PRoC Module.

Rhomb.io pinout Signal (module) Device Interruption
GPIO-A_00 GPIO0 SoC
GPIO1-A_01 GPIO1 SoC


Serial interfaces

The following table indicates the available serial interfaces on the Rhomb.io standard. The table shows the nomenclature used on the Rhomb.io standard and its corresponding on the schematic. Note that the USB bus is not in use.

Signal (Rhomb.io) Signal (module) Used by Signal (Rhomb.io) Signal (module) Used by
I2C SPI
I2C-A_SDA I2C_SDA SoC SPI-A_MISO SPI_MISO SoC
I2C-A_SCL I2C_SCL SPI-A_MOSI SPI_MOSI
#NMI I2C-INT SPI-A_CLK SPI_CLK
UART SPI-A_CSn SPI_CS0
UART-A_RTSN UART_RTSN SoC SPI_INT INT0
UART-A_RXD UART_RX USB
UART-A_TXD UART_TX USB_DATA_N Unused
UART-A_CTSN UART_CTSN USB_DATA_P
AD PWM
AD-A AD0 SoC PWM PWM0/LED SoC / LED



SDIO

The Secure Digital Input Output (SDIO) interfaces are not used on the S100 Master - EZ-BLE PRoC Module.

Power

As per the supply lines used on the board, there is a summary on the next table.

Signal (Rhomb.io) Signal (module) Voltage (V) Used
1V8 150mA 1.8 No
2V8 150mA DVCC 2.8 Yes/No
3V3 DVCC 3.3 Yes/No
VSYS No
VBAT No

The SoC has two inputs for the power supply: the general source (VDD) and the radio source (VDDR'). It is possible to supply power to the radio subsystem separately. In this module, both of them are supplied by the same power source "DVCC". Also, "DVCC" can be supplied by "3V3" or "2V8", as it was mentioned in "KEY FEATURES". By default, "3V3" is connected, so the entire EZ-PRoC SoC is powered at 3.3V. More details can be found at the Cypress official documentation (Cypress documentation) and at the module specifications documentation for the Rhomb.io standard.

Other signals

The CLK_32KH and PWM_INT signals are not used on the S100 Master - EZ-BLE PRoC Module. More information regarding these signals can be found at the specifications for the Rhomb.io standard.

Schematics

Click the image below to download the schematic files.

Bill of materials

Click the image below to download the BOM files.

Fabrication files

Click the image below to download the fabrication files.

Part number package marking

[Under construction]

Mechanical specifications

Board


S100MechanicalSpecifications.jpg

Connector

[Under construction]

Warranty

  • Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:
  1. The users should wear anti-static clothing and use earth band when manipulating the device.
  2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
  3. Equipment and work table must be earthed.
  4. Ionizer is recommended to remove electron charge.
  • Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
  • Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
  • Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
  • Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
  • Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
  • Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
  • EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

Disclaimer

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  1. 1.0 1.1 1.2 Depends on the chosen module variation