S100 Slave - 3D gesture v1.2

This document shows the documentation for the rhomb S100 Slave - 3D gesture.

Overview

The S100 Slave - 3D gesture is a certified rhomb module with a 3D motion tracking based on the MGC3130 IC from Microchip. This IC uses the patented GestIC technology to sense motion and detect location in 3 dimensions.

Besides, this module counts with a PIC series microcontroller from Microchip. This is a reduced form factor microcontroller with low cost and low BOM to perform the gesture MGC3130 applications.

...The next figures show a 3D view for the S100 Slave - 3D gesture.

Bot.jpg    Top.jpg


Applications:

  • Audio Products
  • Notebooks/Keyboards/PC Peripherals
  • Home Automation
  • White Goods
  • Switches/Industrial Switches
  • Medical Products
  • Game Controllers
  • Audio Control

Module specification

Key features

The Rhomb.io S100 Slave - 3D gesture is a 3 dimensional motion tracking and position sensor based on the MGC3130 microcontroller from Microchip. Applying the principles of electrical near-field sensing, the MGC3130 contains all the building blocks to develop robust 3D gesture input sensing systems.

It has several power operation modes that include:

  • Processing mode: 20 mA.
  • Self Wake-up: 110 uA.
  • Deep Sleep: 9 uA.

It can detect hand gestures in x, y and z axis (up to 10 cm in z axis) and 150 dpi of spatial resolution. The sensor works with 4 or 5 receivers and 1 transmissor. The communication interface is I2C and SPI.

The other IC embebbed in the board is a PIC microcontroller. This controller is in the PIC18 family components. The communications with the MCG3X30 is with SPI, I2C and or GPIO. ...The following figure identifies the main Integrated Circuits (IC) onboard. Gesture ICs2.jpg

The next figure shows the Block Diagram for the S100 Slave - 3D gesture. Asdgsf.PNG

MGC3130 features
Carrier frequency 44 to 115 kHz
Operating voltage 2.5-3.5 V
Detection range 0 to 10 cm
Spatial resolution 150 dpi
Host interfaces SPI, I2C, IO

Interfacing

This module can be found in two different assemblies:

  • Only MGC3130
    • In this case the user will be able to access the gesture IC through I2C or SPI interface using the rhomb.io socket.
  • MGC3130 & PIC
    • In this case the user will be controlling the MGC3130 through the PIC microcontroller, via USB interface.

The sensing electrode can be directly soldered to the pads or plugged to the FPC connector on the module.

Connections

IO

The following table summarizes the GPIOs used on the S100 Slave - 3D gesture.

rhomb pinout Signal (module) Device Interruption
IO0 SI3 / EIO7 MGC3130 No
IO1 SI2 / EIO6 MGC3130 No
IO2 IRQ1 / EIO3 MGC3130 Yes
IO3 IRQ0 / EIO2 MGC3130 Yes
IO4 IS1 / EIO1 MGC3130 No


For more details, look at the module specifications for the rhomb standard.

Serial interfaces

The following table indicates the available serial interfaces on the rhomb standard and its been indicated the used ones. The table also shows the nomenclature used on the rhomb standard and its corresponding on the schematic.

Signal (rhomb) Signal (module) Used by Signal (rhomb) Signal (module) Used by
I2C SPI
I2C_SDA SI0 / EIO4 MGC3130 SPI_MISO AN9 / SDO / T1OSCO / RC7 PIC18F14
I2C_SCL SI1 / EIO5 MGC3130 SPI_MOSI IOCB4 / AN10 / SDI / SDA / RB4 PIC18F14
USB SPI_CLK IOCB6 / SCK / SCL / RB6 PIC18F14
USB_DATA_N RA1 / IOCA1 / D- / PGC PIC18F14 SPI_CSn AN8 / #SS / T13CKI / T1OSCI / RC6 PIC18F14
USB_DATA_P RA0 / IOCA0 / D+ / PGD PIC18F14

The I2C pull-ups resistors should be mounted on the bus, otherwise, the I2C bus will not work. For more details, look at the module specifications for the rhomb standard.

Power

As per the supply lines used on the board, there is a summary on the next table.

Signal (rhomb) Signal (module) Voltage (V)
3V3 VCC 3.3

For more details, look at the module specifications for the rhomb standard.

Other

This module must be connected to and external electrode which will be acting as the sensor. This electrode can be directly soldered onto the pads presented at the top-left side of the module, or connected via an FPC cable to the connector next to the pads.

The signals that can befound on the pad are the following, in order from top to bottom:

  1. TXD_E - Transmitting line.
  2. RX0_E - Receiveing line.
  3. RX1_E - Receiveing line.
  4. RX2_E - Receiveing line.
  5. RX3_E - Receiveing line.
  6. RX4_E - Receiveing line.
  7. GND - Ground reference.

The specifications of the FPC connector (P/N: AYF530835) on the board are the following:

  • Double-sided.
  • 8 positions.
  • 0.5mm pitch.
  • Surface mounting.
  • Right angle.

On the FPC connector, the order of signals is the following:

  1. GND - Ground reference.
  2. TXD_E - Transmitting line.
  3. RX0_E - Receiveing line.
  4. RX1_E - Receiveing line.
  5. RX2_E - Receiveing line.
  6. RX3_E - Receiveing line.
  7. RX4_E - Receiveing line.
  8. GND - Ground reference.

Getting started

A quick test guide can be found here.

Schematics

* The full schematics are available here.
* The schematics with no PIC are available here.

Bill of materials

* The full BOM is available here.
* The BOM with no PIC is available here.

Part number package marking

Mechanical specifications

Board

Gesture12 dimensions.PNG

Warranty

  • Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:
  1. The users should wear anti-static clothing and use earth band when manipulating the device.
  2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
  3. Equipment and work table must be earthed.
  4. Ionizer is recommended to remove electron charge.
  • Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
  • Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
  • Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
  • Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
  • Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
  • Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
  • EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

Disclaimer

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