S200 Master - Duino Mega

This document shows the documentation for the Rhomb.io S200 Master Module - Duino Mega. Preliminary version, use only for data updating or corrections.

Overview

The S200 Master Module - Duino Mega is a certified Rhomb.io module that contains an ATmega 2560 microcontroller, the IC in which the popular Arduino/Genuino Mega board is based. This IC is a low-power CMOS 8-bit microcontroller based on RISC architecture.

The module allows to program the microcontroller by using the Arduino IDE as it were a genuine Arduino/Genuino Mega board. This gives to the user the capability to export easily a project originally made for the Arduino platform and transform it in a modular, tiny, and powerful professional product.

By executing powerful instructions ina single clock cycle, the ATmega achieves throughputs approaching 1 MIPS per MHz allowing the system designer to optimize power consumption versus processing speed.

The next figures show a 3D view for the S200 Master Module - Duino Mega.

ATMEGA2560-3D-top.jpg ATMEGA2560-3D-bot.jpg

Applications:

  • Industrial automation
  • Sensing
  • Audio processing
  • IoT

Module specification

Key features

As it has been mentioned above, the S200 Master Module - Duino Mega contains an ATmega 2560/1280 microcontroller (it can be build both). This 8-bit RISC machine has 54 digital input/output pins (15 of them can be used as 8-bit PWM outputs), 16 analog inputs, 4 UARTs and a 16 MHz quartz crystal. More details can be found at the manufacturer documentation here (ATmega 2560).

As stated above this master module is ready to be used with the arduino IDE and it is designed to be compatible with the arduino board so the software designed for this board can be used in a "S200 Master Module - Duino Mega" with a Helios board.

The communication interfaces that we can find at S200 Master Module - Duino Mega are USB, UART, SPI, I2C, JTAG, QSPI and SDIO. The lines for QSPI and SDIO are connected via SPI, it can be used but not a full usage. It also counts with up to 5 PWM, 36 GPIOs, 16 ADs, 2 Capture, 7 interrupts, 2 reset lines and a NMI line. The following figure identifies the main Integrated Circuits (IC) onboard.

IC-On-Board-mega.jpg

(Arturo Vivó tiene que darles formato)

The next figure shows the Block Diagram for the XX YY Module.

Block-diagram-MEGA.JPG

(Arturo Vivó tiene que rehacerlas)


Duino Mega2560 module features
Microcontroller ATmega 2560-16CU
Operating voltage 4.5 - 5.5 V [1]
Digital I/O pins 54 (of which 15 can be PWM)
Analog Input pins 16
DC current per I/O pin 20 mA
Flash memory 128Mbit (IC) and 256 KB (8 KB for bootloader) (In the uController)
SRAM 8 KB
EEPROM 4 KB
Clock speed 16 MHz [1]
User LED 1
UART 4
SPI 1
I2C 1
QSPI 1
SDIO 1

User interfaces

There are different options for user customization of the board, all of them are explained below:

  • Solder jumpers: There are placed 4 Solder jumpers onboard, 3 for power supply and 1 to deactivate the led blinking.
  • 0R0: There are also in the board 0 Ohm resistors in case some lines want to be connected. These lines are AREF0 to VREF+, 3V3 to VDDUSB,CLK32K to OSC32_IN, SPI_CS [1,2] to I2C-B and IO[14,15] to CAPT[0,1].
  • Connector: There is a 10 pin connector in the board connected to the JTAG/SWDIO pins to program the uController and to the QSPI memory in case the user wants to flash it.
  • Test pads: There are placed test pads to give access to the QSPI mem, the I2C interface and the programming SWDIO pins to give other possibility to flash the ICs in the module. Also there are test pads connected to DVCC, GND, Reset and the boot pin in the microcontroller.

AUTHENTICATION CHIP I2C

The authentication chip is placed to give a security layer to all the communications that are uncrypted. This IC works with the I2C interface and encripts the information that receives.

FLASH 128MBIT

The QSPI memory gives to the board a 128 Mb storage that can be used for firmware, data logging... This module works between 2.7V to 3.6V so if soldered the 1.8 V solder jumper this IC won't work.

EEPROM 1-WIRE

An one-wire EEPROM memory is placed to give a unique ID to the module so it can be used as a logging USER.

Connections

GPIO

The following table summarizes the GPIOs used on the STM32L476 master module. Note that all of them can be configured as interrupt sources.

Rhomb.io pinout Port Rhomb.io pinout Port Rhomb.io pinout Port Rhomb.io pinout Port
IO0 PC1 IO8 PL2 IO16 PG2 IO24 PC2
IO1 PC4 IO9 PL7 IO17 PA3 IO25 PG1
IO2 PL5 IO10 PL4 IO18 PA2 IO26 PG0
IO3 PC1 IO11 PG5 IO19 PC7 IO27 PD7
IO4 PC3 IO12 PC5 IO20 PA6 IO28 PH2
IO5 PL6 IO13 PA4 IO21 PA1 IO32 PD6
IO6 PL3 IO14 PC6 IO22 PA7 IO34 PJ5
IO7 PL1 IO15 PA5 IO23 PA0 IO35 PJ7

For more details, look at the module specifications for the Rhomb.io standard.

ANALOG

The following table summarizes the analog ports used on the STM32L476 master module.

Rhomb.io pinout Port Rhomb.io pinout Port
AD0 PF0 AD9 PK4
AD1 PF1 AD10 PK3
AD2 PF2 AD11 PK1
AD3 PF3 AD12 PK0
AD4 PF7 AD13 PK5
AD5 PF5 AD14 PK2
AD6 PF6 AD15 PF4

Serial interfaces

The following table indicates the available serial interfaces on the Rhomb.io standard and which of them are in use. The table also shows the nomenclature used on the Rhomb.io standard and its corresponding on the schematic.

Signal (Rhomb.io) Signal (module) Used by Signal (Rhomb.io) Signal (module) Used by
I2C-A SPI-A
I2C-A_SDA PB9 ATMEGA2560 SPI-A_MISO PB3 ATMEGA2560
I2C-A_SCL PB8 ATMEGA2560 SPI-A_MOSI PB2 ATMEGA2560
UART-A SPI-A_CLK PB1 ATMEGA2560
UART-A_TXD PA2 ATMEGA2560 SPI-A_CS PBB0 ATMEGA2560
UART-A_RXD PA3 ATMEGA2560 QSPI
UART-A_CTS PD3 ATMEGA2560 QSPI_CLK PB1 ATMEGA2560
UART-A_RTS PD4 ATMEGA2560 QSPI_IO0 PB2 ATMEGA2560
UART-B QSPI_IO1 PB3 ATMEGA2560
UART-B_TXD PD5 ATMEGA2560 QSPI_IO2 - UNUSED
UART-B_RXD PD6 ATMEGA2560 QSPI_IO3 - UNUSED
UART-C QSPI_CS PE11 ATMEGA2560
UART-C_TXD PD5 ATMEGA2560 SDIO-A
UART-C_RXD PD6 ATMEGA2560 SDIO-A_CDN - UNUSED
UART-D SDIO-A_CMD PB2 ATMEGA2560
UART-D_TXD PD8 ATMEGA2560 SDIO-A_DATA0 PB3 ATMEGA2560
UART-D_RXD PD9 ATMEGA2560 SDIO-A_DATA1 - UNUSED
USB SDIO-A_DATA2 - UNUSED
USB_N USBDM USB to UART SDIO-A_DATA3 PD5 ATMEGA2560
USB_P USBDP USB to UART SDIO-A_CLK PB1 ATMEGA2560
OTG SAI-A
OTG_ID - UNUSED SAI-A_MCLK - UNUSED
OTG_N - UNUSED SAI-A_SDO - UNUSED
OTG_P - UNUSED SAI-A_LRCLK - UNUSED
CAN-A SAI-A_BCLK - UNUSED
CAN-A_TX - UNUSED SAI-A_SDI - UNUSED
CAN-A_RX - UNUSED

The I2C pull-ups resistors should be mounted on the bus, otherwise, the I2C bus will not work. For more details, look at the module specifications for the Rhomb.io standard.

Power

As per the supply lines used on the board, there is a summary on the next table.

Signal (Rhomb.io) Signal (module) Voltage (V) Used
1V8 150mA - 1.8 No
2V8 150mA - 2.8 No
Vbat - 5 No
VSYS DVCC 3 - 5.5 Yes
3V3 DVCC 3.3 Yes

For more details, look at the module specifications for the Rhomb.io standard.

Arduino IDE

There can be found the lines that uses the Arduino IDE and its equivalences at the rhomb pinout page at the S200 Master Module - Duino Mega page.

http://rhomb.io/pins

Getting started

Schematics

The schematics are available here [link].

Bill of materials

The BOM is available here [link].

Fabrication files

The fabrication files are available here [link].

Part number package marking

Mechanical specifications

Board

[PONER VISTAS CON ACOTACIONES. Indicar tolerancias]
Procedimiento con DesignSpark (nota: este software no está pensado para obtener las vistas con acotaciones a partir de una pieza. Ahún así, se puede hacer de una manera "casera":)
1) Abrir el step del proyecto. Esto abre la PCB con los componentes por partes. Unificar todas las partes en un único objeto seleccionando todas las partes y, con el botón derecho, seleccionar "Mover a nuevo comoponente". Nombrar el objeto resultante como "Alzado".
2) Abrir otra vez el step del proyecto y nombrarlo "Planta". Esto se logra haciendo click en el botón "Archivo" dentro del menú "Diseñar".
3) Abrir otra vez el step del proyecto y nombrarlo "Perfil". En este punto ya tenemos 3 objetos iguales del proyecto, pero con nombre distinto.
4) Situar cada uno de los objetos en su posición correspondiente de modo que se vea el alzado, la planta y el perfil del proyecto.
5) Realizar las cotas, para ello hay que definir un plano de cotas o de anotación. Es recomendable elegir como plano de cotas el que forma la PCB del objeto "Planta".
6) Normalmente el texto de las cotas es de 3.5mm, mejor reducirlo a 2.5mm. Para ello darle doble click en el número en cuestión. Si nos sale una cifra con 3 decimales y/o muy próxima a un número redondo, hay que redondearla. Para ello, click sobre la cifra y botón derecho sobre ella. Seleccionar la opción "Separar de dimensión". Ahora hay que introducir el número manualmente.
7) Eliminar la visualización del plano de cotas. Con la herramienta "Seleccionar" hacer click en el plano de anotación. En propiedades, seleccionar "Sin esquema" y "Sin relleno".
8) Eliminar los ejes de referencia globales, o el origen mundial como lo denomina el software. En el menú "Mostrar" hacer click sobre el botón "Mostrar" y desmarcar "Origen mundial".
9) Realizar captura y nombrar la imagen como "Nombre Dimensions v?.jpg". El resultado debe ser similar al que se observa a continuación.


Expansion Dimensions v2.JPG

Connector

[Under construction]

Warranty

  • Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:
  1. The users should wear anti-static clothing and use earth band when manipulating the device.
  2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
  3. Equipment and work table must be earthed.
  4. Ionizer is recommended to remove electron charge.
  • Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
  • Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
  • Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
  • Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
  • Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
  • Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
  • EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

Disclaimer

Rhomb.io reserves the right to make corrections, enhancements, improvements and other changes to its products and services, and to discontinue any product or service. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All the hardware products are sold subject to the Rhomb.io terms and conditions of sale supplied at the time of order acknowledgment.

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We are constantly striving to improve the quality of our technical notes. If you find an error or omission please let us know.

Email us at: info@rhomb.io
  1. 1.0 1.1 For working at 16 MHz, the supply should be in between 4.5 V and 5.5 V. When the power supply is below 4.5 V, the clock speed decreases