S200 Master - Kinetis K8x

Overview

The S200 Master Module - Kinetis K81 v2.0 is a certified Rhomb.io master module that contains a 32 bit ARM MCU. It can be mounted whith Kinetis K80, K81, K82 and KL82 MCUs from NXP, all of them with advanced security capabilities. For more information look at NXP web: (K8x) and (KL8x)

The different variants of the S200 Master Module - Kinetis K81 v2.0 use the same MCU packaging, the '121 XFBGA'(K8X) or the '121 MAPBGA' (KL8X). The Bottom part of the Module provides the information to know which variant is being used. The images below show the Top and Bottom view of the S200 Master Module - Kinetis K81 v2.0:

TOP VIEW:

BOTTOM VIEW:

Applications

• Point-of-sale (POS)
• Smart Watches
• Smart Metering
• Building control
• Home automation and security
• loT data concentrators
• Portable healthcare
• Smart energy gateways
• Wearable Healthcare Patch

Module specification

Key Features

The table below shows the main features of the S200 Master Module - Kinetis K81 v2.0:

Kinetis K8x/KL8x Key Features
Microcontroller: NXP Kinetis MK8xFN256VDC15/MKL8xZ128VMC7, 32-bit ARM Cortex-M4 & FPU, 48-150 MHz & 32 KHz
Up to 256 KB Flash, up to 256 KB SRAM, 32 KB ROM
Up to 16 KB QSPI Flash Memory
JTAG/SWD micro connector
Native USB OTG & USB switch
MCU security: Anti-Tamper (K81 and KL81) Unique ID/AES/DES/2ES/RSA/ECC/SHA/HRNG/TRNG
Encryption Memory: 16 Keys/ECDSA/ECDH/SHA-256/SMAC/NIST
64-bit Unique-ID Memory with 112 B User EEPROM
MCU I/O: up to 87xI/O (up to 16xPWM, up to 24xADC, up to 85xINT, SAI, SDIO, QSPI)
Rhomb.io config.: 2xUSB, 4xUART, SPI, 2xI2C, SDIO, QSPI, SAI, 5xINT, 4xPWM, up to 33xGPIO, 7xAD, DAC
Op. Voltage: 1.8 V / 2.8 V / 3.3 V
Op. Temperature: -40 ºC to +85 ºC

MCU

As we can see in the table above, the S200 Master Module - Kinetis K81 v2.0 has 76 digital input/output pins (most of them used as analog inputs, PWM, I2C, LPUART, I2S, etc.) and a USB 2.0 OTG interface which can be used, for example, to control some slave modules, to program the MCU, to read/write a USB memory, to communicate with a host computer (or a RHOMB core), etc.

Main clock uses the onboard 12 MHz resonator in combination with the internal PLL/FLL to generate the system clock, several frequencies supported.

This MCU contains 121 pins. The Pin Mapping is the next:

PROCESSOR

The S200 Master Module - Kinetis K81 v2.0 includes a low-power microcontroller which uses an ARM Cortex M4 processor. The Cortex-M4 processor is developed to address digital signal control markets that demand an efficient, easy-to-use blend of control and signal processing capabilities. The combination of high-efficiency signal processing functionality with the low-power, low cost and easy-of-use benefits of the Cortex-M family of processors is designed to satisfy the emerging category of flexible solutions specifically targeting the motor control, automotive, power management, embedded audio and industrial automation markets. These are the main features of this processor:

-Architecture Armv7E-M Harvard.

-ISA Support: Thumb/Thumb-2.

-Pipeline : 3Stage + branch speculation

-DSP Extensions : Single cycle 16/32-bit MAC || Single cycle dual 16-bit MAC || 8/16-bit SIMD arithmetic || Hardware Divide (2-12 Cycles).

-Floating-Point Unit: Optional single precision floating point unit IEE 754 compliant.

-Memory Protection: Optional 8 region MPU with sub regions and background region.

-Interrupts: Non-Maskable Interrupt (NMI+ 1 to 240 physical interrupts).

-Debug: Optional JTAG and Serial Wire Debug ports. Up to 8 breakpoints and 4 watchpoints.

MCU FEATURES

This MCU is able to use :

- FlexBus external bus interface and SDRAM controller.

-Dual QuadSPI with OTF decryption and XIP

-Two 6-bit DAC and one 12-bit DAC.

-USB full-/low-speed On-the-Go controller

-Secure Digital Host Controller and FlexIo

-One I2S Module, Three SPI, four I2C and five LPUART modules.

-32kHz and 3 to 32 MHz crystal oscillators.

-Timers, interruptions, PWMs.

POWER

Regarding the power supply, the device has several different power supply pins:

-Vdd: Supply voltage.

-Vddio_e: Independet Supply voltage for PORT_E.

-Vdda: Analog supply voltage.

-Vbat: RTC battery supply voltage.

The Voltage Range of these power supply sources is 1.71V to 3.6V. Vdda must be connected to VDD potential.

-Vss: Ground.

-Vssa: Analog ground. It must be conected to Vss.

There is also:

-USB_Vdd (Vout33): It depends on the Kinetis K8x or KL8x family. In this module, it is an output voltage.

-USB_Vss: Connected to Vss.

VDDIO_E is independent of the VDD domain and can operate at a voltage independet of VDD. However, it is required that the VDD comain be powered up before VDDIO_E. VDDIO_E must never be higher than VDD. They may ramp together if are tied to the same power supply.

Input Voltage supply includes ADC, CMP and RESET_b inputs.

PORT_E analog input voltages cannot exceed VDD supply.

VBAT domain pins include EXTAL32, XTAL32, RTC_WAKEUP_b and Tamper pins.

In the S200 Master Module - Kinetis K81 v2.0 the power source comes from the Rhomb.io module connectors. The source used is DVCC. To supply "DVCC", we can use "3V3", "2V8" or "1V8". Each power source is connected by a solder jumper so you can choose "DVCC" by soldering one of the solder jumpers,"3V3", "2V8" or "1V8". By default the solder jumper of the 3V3 power source is soldered, so the entire Module is powered at 3V3.

BLOCK DIAGRAM

The next figure shows the Block Diagram for the S200 Master Module - Kinetis K81 v2.0.

(Under construction)

Solder Jumpers

There are three Solder Jumpers used to choose the power source for "DVCC", as it was mentioned before. There are three options :

-"1V8"(SJ3)

-"2V8"(SJ2)

-"3V3"(SJ1)

As we can see in the image below:

Pin Mapping

The MCU pins have more than one configuration. In the table below we show the posible functions:

Pin	Functions	Pin	Function	Pin	Function
A1-PTD7	CMT/UART0_TX/FTM0_CH7/SDRAM_CKE/SPI1_SIN	D8-PTC1	LLWU_P6/ADC0_SE15/SPI0_CS3/I2S0_TXD0/FXIO0_D13	H4-PTD15	SPI2_CS1/FXIO0_D31
A2-PTD5	ADC0_SE6B/SPI0_CS2/UART0_CTS/FTM0_CH5/FB_AD1/SPI1_SCK	D9-PTB18	I2S0_TX_BCLK/FXIO0_D6	H5-TAMPER4	TAMPER4
A3-PTD4	LLWU_P14/SPI0_CS1/UART0_RTS/FTM0_CH4/FB_AD2/EWM_IN	D10-PTB10	SPI1_CS0/UART3_RX/I2C2_SCL/FXIO0_D4	H6-TAMPER3	TAMPER3
A4-PTC19	UART3_CTS/FB/SDRAM_DQM0	D11-PTB8	EMVSIM1_RST/FB/SDRAM	H7-PTA11	LLWU_P23/I2C2_SCL/FXIO0_D17
A5-PTC14	UART4_RX/FB_AD25/SDRAM_D25/FXIO0_D20	E1-PTE6	LLWU_P16/I2S0_MCLK/QSPI0B_D3/SDHC0_D4	H8-PTA1	JTAG_TDI/UART0_RX/I2C/FXIO0_D11
A6-PTC13	UART4_CTS/FTM_CLKIN1/FB_AD26/SDRAM_D26/TPM_CLKIN1	E2-PTE5	SPI1_CS0/UART3_RX/SDHC0_D2/QSPI0A_SS	H9-PTA3	JTAG_TMS_SWDIO/FXIO0_D13/EMVSIM_RST
A7-PTC8	CMP0_IN2/I2S0_MCLK/FB_AD7/SDRAM_A16/FIO0_D15	E3-PTD11	SPI2_CS0/FXIO0_D27	H10-PTA17	I2S0_MCLK/FXIO0_D23/SPI0
A8-PTC4	LLWU_P8/SPI0_CS0/UART1_TX/FTM0_CH3	E4-PTD10	FXIO0_D26/FB	H11-PTA29	FB
A9-PTD9	I2C0_SDA/FB/FXIO0_D25	E5-VDDIO_E	VDDIO_E	J1-VOUT33	VOUT33
A10-PTD8	LLWU_P24/I2C0_SCL/FB/FXIO0_D24	E6-VDD	VDD	J2-VREGIN	VREGIN
A11	NC	E7-VDD	VDD	J3-TAMPER6	TAMPER6
B1-PTE0	SPI1_CS1/UART1_TX_SDHC0_D1/QSPIOA_D3/I2C1_SDA/RTC_CLKOUT	E8-PTB23	SPI2_SIN/FB/FXIO0_D11	J4-TAMPER2	TAMPER2
B2-PTD6	LLWU_P15/ADC0_SE7B/SPI0_CS3/UART0_RX/FB_AD0	E9-PTB17	UART0_TX/SPI1_SIN/FB/SDRAM/TPM	J5-TAMPER1	TAMPER1
B3-PTD3	UART2_TX/FTM3_CH3/FB_AD3/I2C0_SDA	E10-PTB9	SPI1_CS1/FB/SDRAM	J6-TAMPER5	TAMPER5
B4-PTC18	UART3_RTS/FB/SDRAM_DQM1	E11-PTB7	EMVSIM1_PD/FB/SDRAM	J7-PTA2	JTAG_TDO_SWO/UART0_TX
B5-PTC15	UART4_TX/FB/FXIO0_D21	F1-PTE9	LLWU_P17/I2S0_TXD1/I2S0_RX_BCLK/QSPI0B_D2/SDHC0	J8-PTA4	LLWU_P3/#NMI_b/FXIO0_D14
B6-PTC12	UART4_RTS/FTM_CLKIN0/FB/TPM_CLKIN0	F2-PTE8	I2S0_RXD1/SPI2_SOUT/I2S0_RX_FS/QSPI0B_D0/SDHC0	J9-PTA10	LLWU_P22/I2C2_SDA/FXIO0_D16
B7-PTC7	UART3_TX/FB/SDRAM_DQM3	F3-PTE7	SPI2_SCK/I2S0_RXD0/QSPI0B_SCLK/QSPI0A_SS	J10-PTA16	I2S0_RX_FS/FXIO0_D22/SPI0_OUT
B8-PTC3	LLWU_P7/SPI0_CS1/UART1_RX/I2S0_TX_BCLK	F4-PTD12	SPI2_SCK/FB/FXIO0_D28	J11-RESET_b	RESET_b
B9-PTC0	ADC0_SE14/SPI0_CS4/USB0_SOF_OUT/I2S_TXD1/FXIO0	F5-VDDA	VDDA	K1-ADC0_DM0	ADC0_DM0
B10-PTB16	SPI1_SOUT/UART0_RX/FB/SDRAM/EWM	F6-VSSA	VSSA	K2-ADC0_DP0	ADC0_DP0
B11-PTB4	EMVSIM1_IO/SDRAM_CS1/FTM1_FLT0	F7-VSS	VSS	K3-TAMPER7	TAMPER7
C1-PTE2	LLWU_P1/SPI1_OUT/UART1_CTS/SDHC0/QSPI0A_D0	F8-PTB22	SPI2_SOUT/FB(SDRAM/FXIO0_D10	K4-DAC0_OUT	DAC0_OUT
C2-PTE1	LLWU_P0/SPI_SCK/UART1_RX/SDHC_D0/QSPI0A_SCLK/I2C1_SCL	F9-PTB21	SPI2_SCK/FB/SDRAM/CMP1:OUT/FXIO0_D9	K5-TAMPER0	TAMPER0
C3-PTD2	LLWU_P13/SPI0_OUT/UART2_RX/FTM3_CH2/I2C0_SCL	F10-PTB20	SPI2_CS/FB/SDRAM/CMP0_OUT/FXIO0_D8	K6-VBAT	VBAT
C4-PTC17	UART3_TX/FB/SDRAM	F11-PTB6	EMVSIM1_VCCEN/FB/SDRAM	K7-PTA5	I2C/EIC/SCOM1PAD0+/TC2
C5-PTC11	LLWU_P11/I2C1_SDA/I2S0_RXD1/FXIO0_D19	G1-PTE11	I2C3_SCL/SPI2_CS/I2S0_TX_FS/QSPI0B_SS	K8-PTA12	FXIO0_D18/I2S0_TXD0
C6-PTC10	I2C1_SCL/I2S0_RX_FS/FB/SDRAM/FIO0_D18	G2-PTE10	LLWU_P18/I2C3_SDA/I2S0_TXD0/SPI2/QSPI0B_D1/SDHC0_D7	K9-PTA14	SPI0_CS/UART0_TX/FXIO0_D20/I2S0_BCLK
C7-PTC6	LLWU_P10/SPI0_SOUT/I2S_RX_BCLK/FXIO_D14	G3-PTD13	SPI2_SOUT/FB/FXIO0_D29	K10-VSS	VSS
C8-PTC2	ADC0_SE4B/SPI0_CS2/UART1_CTS/FTM0_CH1/I2S_TX_FS	G4-PTD14	SPI2_SIN/FB/FXIO0_D30	K11-PTA19	XTAL0
C9-PTB19	I2S_TX_FS/FB/FXIO0_D7	G5-VREFH	VREFH	L1-ADC0_DM1	ADC0_DM1
C10-PTB11	SPI1_SCK/UART3_TX/I2C2_SDA/FXIO0_D5	G6-VREFL	VREFL	L2-ADC0_DP1	ADC0_DP1
C11-PTB5	EMVSIM1_CLK/FTM2	G7-VSS	VSS	L3-VREF_OUT	VREF_OUT
D1-PTE4	LLWU_P2/SPI1_SIN/UART3_TX/SDHC0_D3/QSPI0A_D1	G8-PTB3	ADC0_SE13/I2C0_SDA/SDRAM/FXIO0_D3	L4- XTAL32	XTAL32
D2-PTE3	SPI1_CS2/UART1_RTS/SDHC0_CMD/QSPI0A_D2	G9-PTB2	ADC0_SE12/I2C0_SCL/SDRAM/FXIO0_D2	L5-EXTAL_32	EXTAL_32
D3-PTD1	ADC0_SE5B/SPI0_SCK/UART2_CTS/FB/FXIO0_D23	G10-PTB1	ADC0_SE9/I2C0_SDA/SDRAM/FXIO0_D1	L6-VSS	VSS
D4-PTD0	LLWU_P12/SPI0_CS0/UART2_RTS/FB/FXIO0_D22	G11-PTB0	ADC0_SE8/LLWU_P5/I2C0_SCL/SDRAM/FXIO0_D0	L7-PTA0	JTAG_CLK/FXIO0_D10
D5-PTC16	UART3_RX/FB/SDRAM	H1-USB0_DM	USB0_DM	L8-PTA13	LLWU_P14/FXIO0_D19/I2S0_TX_FS
D6-PTC9	CMP0_IN3/I2S0_RX_BCLK/FB/FXIO0_D17	H2-USB0_DP	USB0_DP	L9-PTA15	SPI0_SCK/UART0_RX/FXIO0_D21/I2S0_RXD0
D7-PTC5	LLWU_P9/SPI0_SCK/I2S0_RXD0	H3- VSS	VSS	L10-VDD	VDD
				L11-PTA18	EXTAL0

In The S200 Master Module – Kinetis K81 v2.0 the pin configuration is the next:

Functionality	Signal	MCU Pin	Functionality	Signal	MCU Pin
UART	UART-A_TXD	K9	SPI-A	MISO	B3
	UART-A_RXD	B10		MOSI	C3
	UART-B_RXD	B8		CLK	D3
	UART-B_TXD	A8		CSN(CS0)	D4
	UART-C_RXD	D5		CSN(CS1)	A3
	UART-C_TXD	C4		CSN(CS2)	C8 **
	UART-D_RXD	A5	INT	INT0	E3
	UART-D_TXD	B5		INT1	E4
I2C-A	SDA	A9		INT2	H4
	SCL	A10		INT3	A6
I2C-B	SDA	C5	PWM	PWM0	J9
	SCL	C6		PWM1	H7
#NMI	#NMI	J8		PWM2	K8
JTAG	SWCLK	L7		PWM3	L8
	SWDIO	H9	XTAL	XTAL-IN	L4
	SWO	J7		XTAL-OUT	L5
	TDI	H8		XTAL0-IN	K11
	TRST	K7		XTAL0-OUT	L11
QSPI	CLK	F3	SDIO	CLK	C1
	Data0	F2		CMD	D2
	Data1	G2		Data0	C2
	Data2	F1		Data1	B1
	Data3	D1		Data2	E2
	CS0	G1		Data3	D1
	CS1	C8**	LED	LED1	H11
	CS2	D9
GPIO-A	IO0	E8	GPIO-B	IO8	A4
	IO1	E9		IO9	C11
	IO2	F9		IO10	B11
	IO3	F10		IO11	B9
	IO4	G11		IO12	D11
	IO5	G10		IO13	D10
	IO6	G9		IO14	C10
	IO7	G8		IO15	E11
GPIO-C	IO16	D7	RESET	RST	J11
	IO17	J10		RST_OUT	A1
	IO18	E10	IO	1WIRE	C9
	IO19	H10	USB	USB_SW	F11
SAI(I2S)	SAI_MCLK	A7		USB_P	H2**
	SAI_BCLK	C7		USB_N	H1**
	SAI_LRCLK	B7		OTG_N	H1**
	SAI_SDO	D8		OTG_P	H2**
	SAI_SDI	L9		OTG_ID	F8
AD	DAC0	K4	AD	AD3	K2
	AD0	B2		AD4	L1
	AD1	A2		AD5	L3
	AD2	K1		AD6	L2
GND	GND	F7	GND	AGND	F6
	GND	G7		AGND	G6
	GND	H3		GND	L6
				GND	K10
POWER	VDD	E5	POWER	USB_VDD (3V3)	J1
	VDD	E6		VREG	J2
	VDD	E7		AREF	G5
	VDDA	F5		VRTC	K6

It is important to mention that some pins of the MCU are being shared by more than one signal. These pins are:

-C8: This pin is used by the SPI-A_CS2 and the QSPI-A_CS1. These signals are connected by a Resistor bridge.

See the image below:

-H1: This pin's function is only for USB_N/OTG_N.

-H2: This pin's function is only for USB_P/OTG_N.

In the Rhomb.io "S200 Master Module - Kinetis K81 v2.0" it is possible to use two USB connections. The first USB is used to work as a normal USB connection. The second USB makes it possible to work as a USB host (OTG). This MCU only has one USB port so the "S200 Master Module - Kinetis K81 v2.0" includes a UART SWITCH to make it possible change the USB to OTG.

See the image below:

As we can see in the images below:
PWR_VREF_CLK

PORT A-B

PORT C-D

PORT USB_AD

LED

There is a green LED on the board assembled for user purposes. As it can be seen on the Schematics, the anode is connected to the power Source (DVCC) by a 75 Ohm Resistor. The cathode is connected to Q1(the transistor). There is a GPIO signal (LED1) connected to the Gate G of the transistor, this GPIO is used to turn on or turn off the LED.

ID Memory

The DS28E05 is a 112-byte user-programmable EEPROM organized as 7 pages of 16 bytes each. Memory pages can be individually set to write protected or EPROM emulation mode through protection byte settings. Each part has its own guaranteed unique 64-bit ROM identification number (ROM ID) that is factory programmed into the chip.

Applications:

• Accessory/PCB Identification
• Medical Sensor Calibration Data Storage
• Analog Sensor Calibration
• Aftermarket Management of consumables

Features:

• Single-contact 1-Wire Interface
• 112 Bytes User EEPROM with 1k Write Cycles
• Programmable Write Protection and OTP EPROM Emulation Modes for User Memory
• Unique Factory-Programmed 64-Bit ROM ID Number
• Operating Range: 1.71V to 3.63V, -40ºC to +85ºC

The configuration in the S200 Master Module – Kinetis K8x is shown in the next image:

Security

The S200 Master Module – Kinetis K81 has a Cryptographic Co-processor with Secure Hardware-based Key Storage. It is the ATECC508A. It has a 2.0V to 5.5V Supply Voltage Range, and a 1.8V to 5.5V IO levels range. Its configuration is shown in the image below:

QSPI Memory

The "S200 Master Module - Kinetis K81 v2.0" includes a QSPI memory. The W25Q128JVPIQTR is the chosen memory. It is a 3V 128M-Bit Serial Flash Memory with Dual/Quad SPI. It is ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI(XIP) and storing voice, text and data.

Its array is organized into 65.536 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128(32KG block erase), groups of 256(64KB block erase) or the entire chip.

The SPI clock frequencies of this device up to 133 MHz are supported allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHZ (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O.

The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 1uA for power-down.

The memory connection is shown in the image below:

The Power supply of the memory in this module is "DVCC", so the memory would only work if "DVCC" is 3.3V

Connections

GPIO

The following table summarizes the GPIOs used on the S200 Master Module - Kinetis K81 v2.0. It is also indicated the possible functions that these GPIOs are able to have.

Rhomb.io pinout	Signal	Module Signal	Fuctions	Rhomb.io pinout	Signal	Module Signal	Functions
GPIO-A	IO0	IO0	SPI2_SIN/FB/FXIO0_D11	GPIO-B	IO0	IO8	UART3_CTS/FB/SDRAM_DQM0
	IO1	IO1	UART0_TX/SPI1_SIN/FB/SDRAM/TPM		IO1	IO9	EMVSIM1_CLK/FTM2
	IO2	IO2	SPI2_SCK/FB/SDRAM/CMP1:OUT/FXIO0_D9		IO2	IO10	EMVSIM1_IO/SDRAM_CS1/FTM1_FLT0
	IO3	IO3	SPI2_CS/FB/SDRAM/CMP0_OUT/FXIO0_D8		IO3	IO11	ADC0_SE14/SPI0_CS4/USB0_SOF_OUT/I2S_TXD1/FXIO0
	IO4	IO4	ADC0_SE8/LLWU_P5/I2C0_SCL/SDRAM/FXIO0_D0		IO4	IO12	EMVSIM1_RST/FB/SDRAM
	IO5	IO5	ADC0_SE9/I2C0_SDA/SDRAM/FXIO0_D1		IO5	IO13	SPI1_CS0/UART3_RX/I2C2_SCL/FXIO0_D4
	IO6	IO6	ADC0_SE12/I2C0_SCL/SDRAM/FXIO0_D2		IO6	IO14	SPI1_SCK/UART3_TX/I2C2_SDA/FXIO0_D5
	IO7	IO7	ADC0_SE13/I2C0_SDA/SDRAM/FXIO0_D3		IO7	IO15	EMVSIM1_PD/FB/SDRAM
GPIO-C	IO0	IO16	LLWU_P9/SPI0_SCK/I2S0_RXD0
	IO1	IO17	I2S0_RX_FS/FXIO0_D22/SPI0_OUT
	IO2	IO18	SPI1_CS1/FB/SDRAM
	IO3	IO19	I2S0_MCLK/FXIO0_D23/SPI0

These are the different types of interrupt functions:

-NVIC: Nested Vectored Interrupt Controller. -AWIC: Asynchronous Wakeup Interrupt Controller. -NMI: Non Maskarable Interrupt. -LLWU: Low-Leakable Wakeup Unit.

For more details, look at the module specifications for the Rhomb.io standard.

Serial interfaces

The following table indicates the available serial interfaces on the Rhomb.io standard and which of them are in use. The table also shows the nomenclature used on the Rhomb.io standard for auxiliary connections and its corresponding on the schematic.

Signal (Rhomb.io)	Signal (module)	Used by	Signal (Rhomb.io)	Signal (module)	Used by
I2C-A			SPI
I2C-A_SDA		all MCUs	SPI_MISO		all MCUs
I2C-A_SCL		all MCUs	SPI_MOSI		all MCUs
I2C-B			SPI_CLK		all MCUs
I2C-B_SDA		all MCUs	SPI_CS0		all MCUs
I2C-B_SCL		all MCUs	SPI_CS1		all MCUs
			SPI_CS2		all MCUs
UART-A				USB
UART-A_RXD		all MCUs	USB_DATA_N	USB slaves	all MCUs
UART-A_TXD		all MCUs	USB_DATA_P	USB slaves	all MCUs
UART-B				USB
UART-B_RXD		all MCUs	OTG_P	USB host	all MCUs
UART-B_TXD		all MCUs	OTG_N	USB host	all MCUs

The I2C pull-ups resistors (4K7) are mounted on the Rhomb.io Motherboards. For more details, look at the module specifications for the Rhomb.io standard.

S200 Master Module - Kinetis K81 v2.0 implements an USB switch selector controled by the uC that allows to connect with slaves modules(default) or computer host.

OTHER INTERFACEs

The next table shows the nomenclature used on the schematic and its corresponding on the rhomb standard for the Secure Digital Input Output (SDIO) and SPI Flash Interface (QSPI).

NOTE: SDIO interface is only available on K8x versions. In KL82 are just GPIOs.

Signal (Rhomb.io)	Signal (module)	Used by	Signal (Rhomb.io)	Signal (module)	Used by
SDIO			QSPI
SDIO_CMD	SDIO_CMD	K8x versions	QSPI_CS0	QSPI_CS0	all MCUs
SDIO_CLK	SDIO_CLK	K8x versions	QSPI_CLK	QSPI_CLK	all MCUs
SDIO_DATA0	SDIO_DATA0	K8x versions	QSPI_IO0	QSPI_IO0	all MCUs
SDIO_DATA1	SDIO_DATA1	K8x versions	QSPI_IO1	QSPI_IO1	all MCUs
SDIO_DATA2	SDIO_DATA2	K8x versions	QSPI_IO2	QSPI_IO2	all MCUs
SDIO_DATA3	SDIO_DATA3	K8x versions	QSPI_IO3	QSPI_IO3	all MCUs
SDIO_CDN	NC	NC	QSPI_CS1	QSPI_CS1	all MCUs

The next table shows the nomenclature used on the schematic and its corresponding on the rhom standard for the Integrated Interchip Sound (I2S) interface.

NOTE: SAI interface is hardware supported on K8x versions and emulated throught FLEXIO lines on KL82.

Signal (Rhomb.io)	Used by	Signal (Rhomb.io)	Used by
SAI
SAI-A_SDI	K8x MCUs	FLEXIO	KL8x MCUs
SAI-A_SDO	K8x MCUs	FLEXIO	KL8x MCUs
SAI-A_BCLK	K8x MCUs	FLEXIO	KL8x MCUs
SAI-A_LRCLK	K8x MCUs	FLEXIO	KL8x MCUs
SAI-A_MCLK	K8x MCUs	FLEXIO	KL8x MCUs

For more details, look at the module specifications for the Rhomb.io standard.

The FlexIO is a highly configurable module providing a wide range of protocols including, but not limited to LPUART, I2C, SPI, I2S, Camera IF, LCD RGB, PWM/Waveform generation. The module supports programmable baud rates independent of bus clock frequency, with automatic start/stop bit generation. It also supports to work in VLPR, VLPW, Stop, and VLPS modes when clock source remains enabled.

Power

As per the supply lines used on the board, there is a summary on the next table.

Signal (Rhomb.io)	Signal (module)	Voltage (V)	Used
1V8 150mA	1V8	1.8	Selectable
2V8 150mA	2V8	2.8	Selectable
5V_USB	USB/OTG	5	Selectable
VSYS	VSYS	3 - 5.5	Yes
VBAT	VBAT	VBAT	RTC power supply

PWM

Signal (Rhomb.io)	Used by	Pin
PWM
PWM0	ALL MCUs	[J9] PTA10
PWM1	ALL MCUs	[H7] PTA11
PWM2	ALL MCUs	[K8] PTA12
PWM3	ALL MCUs	[L8] PTA13

Other signals

On the following table it is shown the remaining signals from the Rhomb.io module connectors standard.

Signal (Rhomb.io)	Signal (module)	Used by
CLK_32KH	CLK_32KH	Selectable as RTC CLK input
AD_OUT	NC	NC
PWM_INT	NC	NC

For more details, look at the module specifications for the Rhomb.io standard.

S200 Master Module - Kinetis K81 v2.0 has an onboard RTC oscillator, but it can be removed and use the 32KH signal from Rhomb connector

KINETIS K8x & KL8x Differences

Here it is a summary of the main differences between all Rhomb.io Kinetis Modules.

Types & Visual Differentiation

There are other Rhomb.io Kinetis Modules.

It can be mounted whith Kinetis K80, K81, K82 and KL82 MCUs from NXP, all of them with advanced security capabilities. For more information look at NXP web: (K8x) and (KL8x)

The different variants of the S200 Master Module - Kinetis K81 v2.0 use the same MCU packaging, the '121 XFBGA'(K8X) or the '121 MAPBGA' (KL8X).

The design of these modules allows the production of any of the Kinetis K8x and KL8x series with no physical difference between the Module except for the MCU of the PCB. To differentiate any of the different modules you can check the bottom part of the PCB.

MCU

In each part of this document you can find the specific difference between the different Modules. Here there is a summary of all the differences they have:

Comparative
	K80	K81	K82	KL81/KL82
MCU	ARM Cortex-M4			ARM Cortex-M0
Max. Operating Frequency	150 MHz			74 MHz
Flash Memory	256 KB			128 KB
SRAM Memory	256 KB			96 KB
Operating voltage	1.7 - 3.6 V
Onboard system oscillator	12 MHz
Onboard RTC oscillator	32.768 KHz
I2C	2
SPI	1
QSPI	1
LPUART	4			2
I2S (SAI)	1			1 (Emulated)
SDIO	4 data bits			not supported
Interrupt pins	3
PWM outputs	4
Analog Inputs	15	14	15	14
Digital I/O	76
USB	USB 2.0 OTG

POWER

The main Power supply conditions are the same for every Module, but there are some important differences:

USB

- Pin J1 --> VOUT33 (voltaje output) in K8x 10k pull-down resistor is required. --> USB_VDD (USB PWR suppy). 2.2uF & 01.uF decoupling capacitors are required. - Pin J2 --> VREGIN (voltage input) in K8x 2.2uF & 01.uF decoupling capacitors are required. --> NC in KL8x

SIGNALS

SAI

I2S/SAI is no hardware supported on KL8x versions but it's routed to FLEXIO configurable lines which can emulate it. This lines are controlled by DMA so it doesn't consume core resources but data BUS and DMA.

UART

UART-C & UART-D are not available on KL8x version, so this lines are used as GPIO.

SDIO

KL8x version has no SDHC support, so this lines are just GPIO for that version.

Schematics

Click the image below to download the schematic files.

Bill of materials

Click the image below to download the BOM files.

Fabrication files

Click the image below to download the fabrication files.

Mechanical specifications

Board

Warranty

• Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:

1. The users should wear anti-static clothing and use earth band when manipulating the device.
2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
3. Equipment and work table must be earthed.
4. Ionizer is recommended to remove electron charge.

• Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.

• Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.

• Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.

• Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.

• Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.

• Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.

• EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

Disclaimer

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