S200 Master - Kinetis K8x
Contents
Overview
The S200 Master Module - Kinetis K81 v2.0 is a certified Rhomb.io master module that contains a 32 bit ARM MCU. It can be mounted whith Kinetis K80, K81, K82 and KL82 MCUs from NXP, all of them with advanced security capabilities. For more information look at NXP web: (K8x) and (KL8x)
The different variants of the S200 Master Module - Kinetis K81 v2.0 use the same MCU packaging, the '121 XFBGA'(K8X) or the '121 MAPBGA' (KL8X). The Bottom part of the Module provides the information to know which variant is being used.
The images below show the Top and Bottom view of the S200 Master Module - Kinetis K81 v2.0:
TOP VIEW:
BOTTOM VIEW:
Applications
- Point-of-sale (POS)
- Smart Watches
- Smart Metering
- Building control
- Home automation and security
- loT data concentrators
- Portable healthcare
- Smart energy gateways
- Wearable Healthcare Patch
Module specification
Key Features
The table below shows the main features of the S200 Master Module - Kinetis K81 v2.0:
Kinetis K8x/KL8x Key Features |
---|
Microcontroller: NXP Kinetis MK8xFN256VDC15/MKL8xZ128VMC7, 32-bit ARM Cortex-M4 & FPU, 48-150 MHz & 32 KHz |
Up to 256 KB Flash, up to 256 KB SRAM, 32 KB ROM |
Up to 16 KB QSPI Flash Memory |
JTAG/SWD micro connector |
Native USB OTG & USB switch |
MCU security: Anti-Tamper (K81 and KL81) Unique ID/AES/DES/2ES/RSA/ECC/SHA/HRNG/TRNG |
Encryption Memory: 16 Keys/ECDSA/ECDH/SHA-256/SMAC/NIST |
64-bit Unique-ID Memory with 112 B User EEPROM |
MCU I/O: up to 87xI/O (up to 16xPWM, up to 24xADC, up to 85xINT, SAI, SDIO, QSPI) |
Rhomb.io config.: 2xUSB, 4xUART, SPI, 2xI2C, SDIO, QSPI, SAI, 5xINT, 4xPWM, up to 33xGPIO, 7xAD, DAC |
Op. Voltage: 1.8 V / 2.8 V / 3.3 V |
Op. Temperature: -40 ºC to +85 ºC |
MCU
As we can see in the table above, the S200 Master Module - Kinetis K81 v2.0 has 76 digital input/output pins (most of them used as analog inputs, PWM, I2C, LPUART, I2S, etc.) and a USB 2.0 OTG interface which can be used, for example, to control some slave modules, to program the MCU, to read/write a USB memory, to communicate with a host computer (or a RHOMB core), etc.
Main clock uses the onboard 12 MHz resonator in combination with the internal PLL/FLL to generate the system clock, several frequencies supported.
This MCU contains 121 pins. The Pin Mapping is the next:
PROCESSOR
The S200 Master Module - Kinetis K81 v2.0 includes a low-power microcontroller which uses an ARM Cortex M4 processor. The Cortex-M4 processor is developed to address digital signal control markets that demand an efficient, easy-to-use blend of control and signal processing capabilities. The combination of high-efficiency signal processing functionality with the low-power, low cost and easy-of-use benefits of the Cortex-M family of processors is designed to satisfy the emerging category of flexible solutions specifically targeting the motor control, automotive, power management, embedded audio and industrial automation markets. These are the main features of this processor:
-Architecture Armv7E-M Harvard.
-ISA Support: Thumb/Thumb-2.
-Pipeline : 3Stage + branch speculation
-DSP Extensions : Single cycle 16/32-bit MAC || Single cycle dual 16-bit MAC || 8/16-bit SIMD arithmetic || Hardware Divide (2-12 Cycles).
-Floating-Point Unit: Optional single precision floating point unit IEE 754 compliant.
-Memory Protection: Optional 8 region MPU with sub regions and background region.
-Interrupts: Non-Maskable Interrupt (NMI+ 1 to 240 physical interrupts).
-Debug: Optional JTAG and Serial Wire Debug ports. Up to 8 breakpoints and 4 watchpoints.
MCU FEATURES
This MCU is able to use :
- FlexBus external bus interface and SDRAM controller.
-Dual QuadSPI with OTF decryption and XIP
-Two 6-bit DAC and one 12-bit DAC.
-USB full-/low-speed On-the-Go controller
-Secure Digital Host Controller and FlexIo
-One I2S Module, Three SPI, four I2C and five LPUART modules.
-32kHz and 3 to 32 MHz crystal oscillators.
-Timers, interruptions, PWMs.
POWER
Regarding the power supply, the device has several different power supply pins:
-Vdd: Supply voltage.
-Vddio_e: Independet Supply voltage for PORT_E.
-Vdda: Analog supply voltage.
-Vbat: RTC battery supply voltage.
The Voltage Range of these power supply sources is 1.71V to 3.6V. Vdda must be connected to VDD potential.
-Vss: Ground.
-Vssa: Analog ground. It must be conected to Vss.
There is also:
-USB_Vdd (Vout33): It depends on the Kinetis K8x or KL8x family. In this module, it is an output voltage.
-USB_Vss: Connected to Vss.
VDDIO_E is independent of the VDD domain and can operate at a voltage independet of VDD. However, it is required that the VDD comain be powered up before VDDIO_E. VDDIO_E must never be higher than VDD. They may ramp together if are tied to the same power supply.
Input Voltage supply includes ADC, CMP and RESET_b inputs.
PORT_E analog input voltages cannot exceed VDD supply.
VBAT domain pins include EXTAL32, XTAL32, RTC_WAKEUP_b and Tamper pins.
In the S200 Master Module - Kinetis K81 v2.0 the power source comes from the Rhomb.io module connectors. The source used is DVCC. To supply "DVCC", we can use "3V3", "2V8" or "1V8". Each power source is connected by a solder jumper so you can choose "DVCC" by soldering one of the solder jumpers,"3V3", "2V8" or "1V8". By default the solder jumper of the 3V3 power source is soldered, so the entire Module is powered at 3V3.
BLOCK DIAGRAM
The next figure shows the Block Diagram for the S200 Master Module - Kinetis K81 v2.0.
Solder Jumpers
There are three Solder Jumpers used to choose the power source for "DVCC", as it was mentioned before. There are three options :
-"1V8"(SJ3)
-"2V8"(SJ2)
-"3V3"(SJ1)
As we can see in the image below:
Pin Mapping
The MCU pins have more than one configuration. In the table below we show the posible functions:
Pin | Functions | Pin | Function | Pin | Function |
---|---|---|---|---|---|
A1-PTD7 | CMT/UART0_TX/FTM0_CH7/SDRAM_CKE/SPI1_SIN | D8-PTC1 | LLWU_P6/ADC0_SE15/SPI0_CS3/I2S0_TXD0/FXIO0_D13 | H4-PTD15 | SPI2_CS1/FXIO0_D31 |
A2-PTD5 | ADC0_SE6B/SPI0_CS2/UART0_CTS/FTM0_CH5/FB_AD1/SPI1_SCK | D9-PTB18 | I2S0_TX_BCLK/FXIO0_D6 | H5-TAMPER4 | TAMPER4 |
A3-PTD4 | LLWU_P14/SPI0_CS1/UART0_RTS/FTM0_CH4/FB_AD2/EWM_IN | D10-PTB10 | SPI1_CS0/UART3_RX/I2C2_SCL/FXIO0_D4 | H6-TAMPER3 | TAMPER3 |
A4-PTC19 | UART3_CTS/FB/SDRAM_DQM0 | D11-PTB8 | EMVSIM1_RST/FB/SDRAM | H7-PTA11 | LLWU_P23/I2C2_SCL/FXIO0_D17 |
A5-PTC14 | UART4_RX/FB_AD25/SDRAM_D25/FXIO0_D20 | E1-PTE6 | LLWU_P16/I2S0_MCLK/QSPI0B_D3/SDHC0_D4 | H8-PTA1 | JTAG_TDI/UART0_RX/I2C/FXIO0_D11 |
A6-PTC13 | UART4_CTS/FTM_CLKIN1/FB_AD26/SDRAM_D26/TPM_CLKIN1 | E2-PTE5 | SPI1_CS0/UART3_RX/SDHC0_D2/QSPI0A_SS | H9-PTA3 | JTAG_TMS_SWDIO/FXIO0_D13/EMVSIM_RST |
A7-PTC8 | CMP0_IN2/I2S0_MCLK/FB_AD7/SDRAM_A16/FIO0_D15 | E3-PTD11 | SPI2_CS0/FXIO0_D27 | H10-PTA17 | I2S0_MCLK/FXIO0_D23/SPI0 |
A8-PTC4 | LLWU_P8/SPI0_CS0/UART1_TX/FTM0_CH3 | E4-PTD10 | FXIO0_D26/FB | H11-PTA29 | FB |
A9-PTD9 | I2C0_SDA/FB/FXIO0_D25 | E5-VDDIO_E | VDDIO_E | J1-VOUT33 | VOUT33 |
A10-PTD8 | LLWU_P24/I2C0_SCL/FB/FXIO0_D24 | E6-VDD | VDD | J2-VREGIN | VREGIN |
A11 | NC | E7-VDD | VDD | J3-TAMPER6 | TAMPER6 |
B1-PTE0 | SPI1_CS1/UART1_TX_SDHC0_D1/QSPIOA_D3/I2C1_SDA/RTC_CLKOUT | E8-PTB23 | SPI2_SIN/FB/FXIO0_D11 | J4-TAMPER2 | TAMPER2 |
B2-PTD6 | LLWU_P15/ADC0_SE7B/SPI0_CS3/UART0_RX/FB_AD0 | E9-PTB17 | UART0_TX/SPI1_SIN/FB/SDRAM/TPM | J5-TAMPER1 | TAMPER1 |
B3-PTD3 | UART2_TX/FTM3_CH3/FB_AD3/I2C0_SDA | E10-PTB9 | SPI1_CS1/FB/SDRAM | J6-TAMPER5 | TAMPER5 |
B4-PTC18 | UART3_RTS/FB/SDRAM_DQM1 | E11-PTB7 | EMVSIM1_PD/FB/SDRAM | J7-PTA2 | JTAG_TDO_SWO/UART0_TX |
B5-PTC15 | UART4_TX/FB/FXIO0_D21 | F1-PTE9 | LLWU_P17/I2S0_TXD1/I2S0_RX_BCLK/QSPI0B_D2/SDHC0 | J8-PTA4 | LLWU_P3/#NMI_b/FXIO0_D14 |
B6-PTC12 | UART4_RTS/FTM_CLKIN0/FB/TPM_CLKIN0 | F2-PTE8 | I2S0_RXD1/SPI2_SOUT/I2S0_RX_FS/QSPI0B_D0/SDHC0 | J9-PTA10 | LLWU_P22/I2C2_SDA/FXIO0_D16 |
B7-PTC7 | UART3_TX/FB/SDRAM_DQM3 | F3-PTE7 | SPI2_SCK/I2S0_RXD0/QSPI0B_SCLK/QSPI0A_SS | J10-PTA16 | I2S0_RX_FS/FXIO0_D22/SPI0_OUT |
B8-PTC3 | LLWU_P7/SPI0_CS1/UART1_RX/I2S0_TX_BCLK | F4-PTD12 | SPI2_SCK/FB/FXIO0_D28 | J11-RESET_b | RESET_b |
B9-PTC0 | ADC0_SE14/SPI0_CS4/USB0_SOF_OUT/I2S_TXD1/FXIO0 | F5-VDDA | VDDA | K1-ADC0_DM0 | ADC0_DM0 |
B10-PTB16 | SPI1_SOUT/UART0_RX/FB/SDRAM/EWM | F6-VSSA | VSSA | K2-ADC0_DP0 | ADC0_DP0 |
B11-PTB4 | EMVSIM1_IO/SDRAM_CS1/FTM1_FLT0 | F7-VSS | VSS | K3-TAMPER7 | TAMPER7 |
C1-PTE2 | LLWU_P1/SPI1_OUT/UART1_CTS/SDHC0/QSPI0A_D0 | F8-PTB22 | SPI2_SOUT/FB(SDRAM/FXIO0_D10 | K4-DAC0_OUT | DAC0_OUT |
C2-PTE1 | LLWU_P0/SPI_SCK/UART1_RX/SDHC_D0/QSPI0A_SCLK/I2C1_SCL | F9-PTB21 | SPI2_SCK/FB/SDRAM/CMP1:OUT/FXIO0_D9 | K5-TAMPER0 | TAMPER0 |
C3-PTD2 | LLWU_P13/SPI0_OUT/UART2_RX/FTM3_CH2/I2C0_SCL | F10-PTB20 | SPI2_CS/FB/SDRAM/CMP0_OUT/FXIO0_D8 | K6-VBAT | VBAT |
C4-PTC17 | UART3_TX/FB/SDRAM | F11-PTB6 | EMVSIM1_VCCEN/FB/SDRAM | K7-PTA5 | I2C/EIC/SCOM1PAD0+/TC2 |
C5-PTC11 | LLWU_P11/I2C1_SDA/I2S0_RXD1/FXIO0_D19 | G1-PTE11 | I2C3_SCL/SPI2_CS/I2S0_TX_FS/QSPI0B_SS | K8-PTA12 | FXIO0_D18/I2S0_TXD0 |
C6-PTC10 | I2C1_SCL/I2S0_RX_FS/FB/SDRAM/FIO0_D18 | G2-PTE10 | LLWU_P18/I2C3_SDA/I2S0_TXD0/SPI2/QSPI0B_D1/SDHC0_D7 | K9-PTA14 | SPI0_CS/UART0_TX/FXIO0_D20/I2S0_BCLK |
C7-PTC6 | LLWU_P10/SPI0_SOUT/I2S_RX_BCLK/FXIO_D14 | G3-PTD13 | SPI2_SOUT/FB/FXIO0_D29 | K10-VSS | VSS |
C8-PTC2 | ADC0_SE4B/SPI0_CS2/UART1_CTS/FTM0_CH1/I2S_TX_FS | G4-PTD14 | SPI2_SIN/FB/FXIO0_D30 | K11-PTA19 | XTAL0 |
C9-PTB19 | I2S_TX_FS/FB/FXIO0_D7 | G5-VREFH | VREFH | L1-ADC0_DM1 | ADC0_DM1 |
C10-PTB11 | SPI1_SCK/UART3_TX/I2C2_SDA/FXIO0_D5 | G6-VREFL | VREFL | L2-ADC0_DP1 | ADC0_DP1 |
C11-PTB5 | EMVSIM1_CLK/FTM2 | G7-VSS | VSS | L3-VREF_OUT | VREF_OUT |
D1-PTE4 | LLWU_P2/SPI1_SIN/UART3_TX/SDHC0_D3/QSPI0A_D1 | G8-PTB3 | ADC0_SE13/I2C0_SDA/SDRAM/FXIO0_D3 | L4- XTAL32 | XTAL32 |
D2-PTE3 | SPI1_CS2/UART1_RTS/SDHC0_CMD/QSPI0A_D2 | G9-PTB2 | ADC0_SE12/I2C0_SCL/SDRAM/FXIO0_D2 | L5-EXTAL_32 | EXTAL_32 |
D3-PTD1 | ADC0_SE5B/SPI0_SCK/UART2_CTS/FB/FXIO0_D23 | G10-PTB1 | ADC0_SE9/I2C0_SDA/SDRAM/FXIO0_D1 | L6-VSS | VSS |
D4-PTD0 | LLWU_P12/SPI0_CS0/UART2_RTS/FB/FXIO0_D22 | G11-PTB0 | ADC0_SE8/LLWU_P5/I2C0_SCL/SDRAM/FXIO0_D0 | L7-PTA0 | JTAG_CLK/FXIO0_D10 |
D5-PTC16 | UART3_RX/FB/SDRAM | H1-USB0_DM | USB0_DM | L8-PTA13 | LLWU_P14/FXIO0_D19/I2S0_TX_FS |
D6-PTC9 | CMP0_IN3/I2S0_RX_BCLK/FB/FXIO0_D17 | H2-USB0_DP | USB0_DP | L9-PTA15 | SPI0_SCK/UART0_RX/FXIO0_D21/I2S0_RXD0 |
D7-PTC5 | LLWU_P9/SPI0_SCK/I2S0_RXD0 | H3- VSS | VSS | L10-VDD | VDD |
L11-PTA18 | EXTAL0 |
In The S200 Master Module – Kinetis K81 v2.0 the pin configuration is the next:
Functionality | Signal | MCU Pin | Functionality | Signal | MCU Pin |
---|---|---|---|---|---|
UART | UART-A_TXD | K9 | SPI-A | MISO | B3 |
UART-A_RXD | B10 | MOSI | C3 | ||
UART-B_RXD | B8 | CLK | D3 | ||
UART-B_TXD | A8 | CSN(CS0) | D4 | ||
UART-C_RXD | D5 | CSN(CS1) | A3 | ||
UART-C_TXD | C4 | CSN(CS2) | C8 ** | ||
UART-D_RXD | A5 | INT | INT0 | E3 | |
UART-D_TXD | B5 | INT1 | E4 | ||
I2C-A | SDA | A9 | INT2 | H4 | |
SCL | A10 | INT3 | A6 | ||
I2C-B | SDA | C5 | PWM | PWM0 | J9 |
SCL | C6 | PWM1 | H7 | ||
#NMI | #NMI | J8 | PWM2 | K8 | |
JTAG | SWCLK | L7 | PWM3 | L8 | |
SWDIO | H9 | XTAL | XTAL-IN | L4 | |
SWO | J7 | XTAL-OUT | L5 | ||
TDI | H8 | XTAL0-IN | K11 | ||
TRST | K7 | XTAL0-OUT | L11 | ||
QSPI | CLK | F3 | SDIO | CLK | C1 |
Data0 | F2 | CMD | D2 | ||
Data1 | G2 | Data0 | C2 | ||
Data2 | F1 | Data1 | B1 | ||
Data3 | D1 | Data2 | E2 | ||
CS0 | G1 | Data3 | D1 | ||
CS1 | C8** | LED | LED1 | H11 | |
CS2 | D9 | ||||
GPIO-A | IO0 | E8 | GPIO-B | IO8 | A4 |
IO1 | E9 | IO9 | C11 | ||
IO2 | F9 | IO10 | B11 | ||
IO3 | F10 | IO11 | B9 | ||
IO4 | G11 | IO12 | D11 | ||
IO5 | G10 | IO13 | D10 | ||
IO6 | G9 | IO14 | C10 | ||
IO7 | G8 | IO15 | E11 | ||
GPIO-C | IO16 | D7 | RESET | RST | J11 |
IO17 | J10 | RST_OUT | A1 | ||
IO18 | E10 | IO | 1WIRE | C9 | |
IO19 | H10 | USB | USB_SW | F11 | |
SAI(I2S) | SAI_MCLK | A7 | USB_P | H2** | |
SAI_BCLK | C7 | USB_N | H1** | ||
SAI_LRCLK | B7 | OTG_N | H1** | ||
SAI_SDO | D8 | OTG_P | H2** | ||
SAI_SDI | L9 | OTG_ID | F8 | ||
AD | DAC0 | K4 | AD | AD3 | K2 |
AD0 | B2 | AD4 | L1 | ||
AD1 | A2 | AD5 | L3 | ||
AD2 | K1 | AD6 | L2 | ||
GND | GND | F7 | GND | AGND | F6 |
GND | G7 | AGND | G6 | ||
GND | H3 | GND | L6 | ||
GND | K10 | ||||
POWER | VDD | E5 | POWER | USB_VDD (3V3) | J1 |
VDD | E6 | VREG | J2 | ||
VDD | E7 | AREF | G5 | ||
VDDA | F5 | VRTC | K6 |
It is important to mention that some pins of the MCU are being shared by more than one signal.
These pins are:
-C8: This pin is used by the SPI-A_CS2 and the QSPI-A_CS1. These signals are connected by a Resistor bridge.
See the image below:
-H1: This pin's function is only for USB_N/OTG_N.
-H2: This pin's function is only for USB_P/OTG_N.
In the Rhomb.io "S200 Master Module - Kinetis K81 v2.0" it is possible to use two USB connections. The first USB is used to work as a normal USB connection. The second USB makes it possible to work as a USB host (OTG). This MCU only has one USB port so the "S200 Master Module - Kinetis K81 v2.0" includes a UART SWITCH to make it possible change the USB to OTG.
See the image below:
As we can see in the images below:
PWR_VREF_CLK
PORT C-D
PORT USB_AD
LED
There is a green LED on the board assembled for user purposes. As it can be seen on the Schematics, the anode is connected to the power Source (DVCC) by a 75 Ohm Resistor. The cathode is connected to Q1(the transistor). There is a GPIO signal (LED1) connected to the Gate G of the transistor, this GPIO is used to turn on or turn off the LED.
ID Memory
The DS28E05 is a 112-byte user-programmable EEPROM organized as 7 pages of 16 bytes each. Memory pages can be individually set to write protected or EPROM emulation mode through protection byte settings. Each part has its own guaranteed unique 64-bit ROM identification number (ROM ID) that is factory programmed into the chip.
Applications:
- Accessory/PCB Identification
- Medical Sensor Calibration Data Storage
- Analog Sensor Calibration
- Aftermarket Management of consumables
Features:
- Single-contact 1-Wire Interface
- 112 Bytes User EEPROM with 1k Write Cycles
- Programmable Write Protection and OTP EPROM Emulation Modes for User Memory
- Unique Factory-Programmed 64-Bit ROM ID Number
- Operating Range: 1.71V to 3.63V, -40ºC to +85ºC
The configuration in the S200 Master Module – Kinetis K8x is shown in the next image:
Security
The S200 Master Module – Kinetis K81 has a Cryptographic Co-processor with Secure Hardware-based Key Storage. It is the ATECC508A. It has a 2.0V to 5.5V Supply Voltage Range, and a 1.8V to 5.5V IO levels range. Its configuration is shown in the image below:
QSPI Memory
The "S200 Master Module - Kinetis K81 v2.0" includes a QSPI memory. The W25Q128JVPIQTR is the chosen memory. It is a 3V 128M-Bit Serial Flash Memory with Dual/Quad SPI. It is ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI(XIP) and storing voice, text and data.
Its array is organized into 65.536 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128(32KG block erase), groups of 256(64KB block erase) or the entire chip.
The SPI clock frequencies of this device up to 133 MHz are supported allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHZ (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O.
The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 1uA for power-down.
The memory connection is shown in the image below:
The Power supply of the memory in this module is "DVCC", so the memory would only work if "DVCC" is 3.3V
SWDIO
Connections
GPIO
The following table summarizes the GPIOs used on the S200 Master Module - Kinetis K81 v2.0. It is also indicated the possible functions that these GPIOs are able to have.
Rhomb.io pinout | Signal | Module Signal | Fuctions | Rhomb.io pinout | Signal | Module Signal | Functions |
---|---|---|---|---|---|---|---|
GPIO-A | IO0 | IO0 | SPI2_SIN/FB/FXIO0_D11 | GPIO-B | IO0 | IO8 | UART3_CTS/FB/SDRAM_DQM0 |
IO1 | IO1 | UART0_TX/SPI1_SIN/FB/SDRAM/TPM | IO1 | IO9 | EMVSIM1_CLK/FTM2 | ||
IO2 | IO2 | SPI2_SCK/FB/SDRAM/CMP1:OUT/FXIO0_D9 | IO2 | IO10 | EMVSIM1_IO/SDRAM_CS1/FTM1_FLT0 | ||
IO3 | IO3 | SPI2_CS/FB/SDRAM/CMP0_OUT/FXIO0_D8 | IO3 | IO11 | ADC0_SE14/SPI0_CS4/USB0_SOF_OUT/I2S_TXD1/FXIO0 | ||
IO4 | IO4 | ADC0_SE8/LLWU_P5/I2C0_SCL/SDRAM/FXIO0_D0 | IO4 | IO12 | EMVSIM1_RST/FB/SDRAM | ||
IO5 | IO5 | ADC0_SE9/I2C0_SDA/SDRAM/FXIO0_D1 | IO5 | IO13 | SPI1_CS0/UART3_RX/I2C2_SCL/FXIO0_D4 | ||
IO6 | IO6 | ADC0_SE12/I2C0_SCL/SDRAM/FXIO0_D2 | IO6 | IO14 | SPI1_SCK/UART3_TX/I2C2_SDA/FXIO0_D5 | ||
IO7 | IO7 | ADC0_SE13/I2C0_SDA/SDRAM/FXIO0_D3 | IO7 | IO15 | EMVSIM1_PD/FB/SDRAM | ||
GPIO-C | IO0 | IO16 | LLWU_P9/SPI0_SCK/I2S0_RXD0 | ||||
IO1 | IO17 | I2S0_RX_FS/FXIO0_D22/SPI0_OUT | |||||
IO2 | IO18 | SPI1_CS1/FB/SDRAM | |||||
IO3 | IO19 | I2S0_MCLK/FXIO0_D23/SPI0 |
These are the different types of interrupt functions:
-NVIC: Nested Vectored Interrupt Controller. -AWIC: Asynchronous Wakeup Interrupt Controller. -NMI: Non Maskarable Interrupt. -LLWU: Low-Leakable Wakeup Unit.
For more details, look at the module specifications for the Rhomb.io standard.
Serial interfaces
The following table indicates the available serial interfaces on the Rhomb.io standard and which of them are in use. The table also shows the nomenclature used on the Rhomb.io standard for auxiliary connections and its corresponding on the schematic.
Signal (Rhomb.io) | Signal (module) | Used by | Signal (Rhomb.io) | Signal (module) | Used by | |
---|---|---|---|---|---|---|
I2C-A | SPI | |||||
I2C-A_SDA | all MCUs | SPI_MISO | all MCUs | |||
I2C-A_SCL | all MCUs | SPI_MOSI | all MCUs | |||
I2C-B | SPI_CLK | all MCUs | ||||
I2C-B_SDA | all MCUs | SPI_CS0 | all MCUs | |||
I2C-B_SCL | all MCUs | SPI_CS1 | all MCUs | |||
SPI_CS2 | all MCUs | |||||
UART-A | USB | |||||
UART-A_RXD | all MCUs | USB_DATA_N | USB slaves | all MCUs | ||
UART-A_TXD | all MCUs | USB_DATA_P | USB slaves | all MCUs | ||
UART-B | USB | |||||
UART-B_RXD | all MCUs | OTG_P | USB host | all MCUs | ||
UART-B_TXD | all MCUs | OTG_N | USB host | all MCUs |
The I2C pull-ups resistors (4K7) are mounted on the Rhomb.io Motherboards. For more details, look at the module specifications for the Rhomb.io standard.
S200 Master Module - Kinetis K81 v2.0 implements an USB switch selector controled by the uC that allows to connect with slaves modules(default) or computer host.
OTHER INTERFACEs
The next table shows the nomenclature used on the schematic and its corresponding on the rhomb standard for the Secure Digital Input Output (SDIO) and SPI Flash Interface (QSPI).
NOTE: SDIO interface is only available on K8x versions. In KL82 are just GPIOs.
Signal (Rhomb.io) | Signal (module) | Used by | Signal (Rhomb.io) | Signal (module) | Used by |
---|---|---|---|---|---|
SDIO | QSPI | ||||
SDIO_CMD | SDIO_CMD | K8x versions | QSPI_CS0 | QSPI_CS0 | all MCUs |
SDIO_CLK | SDIO_CLK | K8x versions | QSPI_CLK | QSPI_CLK | all MCUs |
SDIO_DATA0 | SDIO_DATA0 | K8x versions | QSPI_IO0 | QSPI_IO0 | all MCUs |
SDIO_DATA1 | SDIO_DATA1 | K8x versions | QSPI_IO1 | QSPI_IO1 | all MCUs |
SDIO_DATA2 | SDIO_DATA2 | K8x versions | QSPI_IO2 | QSPI_IO2 | all MCUs |
SDIO_DATA3 | SDIO_DATA3 | K8x versions | QSPI_IO3 | QSPI_IO3 | all MCUs |
SDIO_CDN | NC | NC | QSPI_CS1 | QSPI_CS1 | all MCUs |
The next table shows the nomenclature used on the schematic and its corresponding on the rhom standard for the Integrated Interchip Sound (I2S) interface.
NOTE: SAI interface is hardware supported on K8x versions and emulated throught FLEXIO lines on KL82.
Signal (Rhomb.io) | Used by | Signal (Rhomb.io) | Used by |
---|---|---|---|
SAI | |||
SAI-A_SDI | K8x MCUs | FLEXIO | KL8x MCUs |
SAI-A_SDO | K8x MCUs | FLEXIO | KL8x MCUs |
SAI-A_BCLK | K8x MCUs | FLEXIO | KL8x MCUs |
SAI-A_LRCLK | K8x MCUs | FLEXIO | KL8x MCUs |
SAI-A_MCLK | K8x MCUs | FLEXIO | KL8x MCUs |
For more details, look at the module specifications for the Rhomb.io standard.
The FlexIO is a highly configurable module providing a wide range of protocols including, but not limited to LPUART, I2C, SPI, I2S, Camera IF, LCD RGB, PWM/Waveform generation. The module supports programmable baud rates independent of bus clock frequency, with automatic start/stop bit generation. It also supports to work in VLPR, VLPW, Stop, and VLPS modes when clock source remains enabled.
Power
As per the supply lines used on the board, there is a summary on the next table.
Signal (Rhomb.io) | Signal (module) | Voltage (V) | Used |
---|---|---|---|
1V8 150mA | 1V8 | 1.8 | Selectable |
2V8 150mA | 2V8 | 2.8 | Selectable |
5V_USB | USB/OTG | 5 | Selectable |
VSYS | VSYS | 3 - 5.5 | Yes |
VBAT | VBAT | VBAT | RTC power supply |
PWM
Signal (Rhomb.io) | Used by | Pin |
---|---|---|
PWM | ||
PWM0 | ALL MCUs | [J9] PTA10 |
PWM1 | ALL MCUs | [H7] PTA11 |
PWM2 | ALL MCUs | [K8] PTA12 |
PWM3 | ALL MCUs | [L8] PTA13 |
Other signals
On the following table it is shown the remaining signals from the Rhomb.io module connectors standard.
Signal (Rhomb.io) | Signal (module) | Used by |
---|---|---|
CLK_32KH | CLK_32KH | Selectable as RTC CLK input |
AD_OUT | NC | NC |
PWM_INT | NC | NC |
For more details, look at the module specifications for the Rhomb.io standard.
S200 Master Module - Kinetis K81 v2.0 has an onboard RTC oscillator, but it can be removed and use the 32KH signal from Rhomb connector
KINETIS K8x & KL8x Differences
Here it is a summary of the main differences between all Rhomb.io Kinetis Modules.
Types & Visual Differentiation
There are other Rhomb.io Kinetis Modules.
It can be mounted whith Kinetis K80, K81, K82 and KL82 MCUs from NXP, all of them with advanced security capabilities. For more information look at NXP web: (K8x) and (KL8x)
The different variants of the S200 Master Module - Kinetis K81 v2.0 use the same MCU packaging, the '121 XFBGA'(K8X) or the '121 MAPBGA' (KL8X).
The design of these modules allows the production of any of the Kinetis K8x and KL8x series with no physical difference between the Module except for the MCU of the PCB. To differentiate any of the different modules you can check the bottom part of the PCB.
MCU
In each part of this document you can find the specific difference between the different Modules. Here there is a summary of all the differences they have:
Comparative | ||||
---|---|---|---|---|
K80 | K81 | K82 | KL81/KL82 | |
MCU | ARM Cortex-M4 | ARM Cortex-M0 | ||
Max. Operating Frequency | 150 MHz | 74 MHz | ||
Flash Memory | 256 KB | 128 KB | ||
SRAM Memory | 256 KB | 96 KB | ||
Operating voltage | 1.7 - 3.6 V | |||
Onboard system oscillator | 12 MHz | |||
Onboard RTC oscillator | 32.768 KHz | |||
I2C | 2 | |||
SPI | 1 | |||
QSPI | 1 | |||
LPUART | 4 | 2 | ||
I2S (SAI) | 1 | 1 (Emulated) | ||
SDIO | 4 data bits | not supported | ||
Interrupt pins | 3 | |||
PWM outputs | 4 | |||
Analog Inputs | 15 | 14 [1] | 15 | 14 [1] |
Digital I/O | 76 | |||
USB | USB 2.0 OTG |
POWER
The main Power supply conditions are the same for every Module, but there are some important differences:
USB
- Pin J1 --> VOUT33 (voltaje output) in K8x 10k pull-down resistor is required. --> USB_VDD (USB PWR suppy). 2.2uF & 01.uF decoupling capacitors are required. - Pin J2 --> VREGIN (voltage input) in K8x 2.2uF & 01.uF decoupling capacitors are required. --> NC in KL8x
SIGNALS
SAI
I2S/SAI is no hardware supported on KL8x versions but it's routed to FLEXIO configurable lines which can emulate it. This lines are controlled by DMA so it doesn't consume core resources but data BUS and DMA.
UART
UART-C & UART-D are not available on KL8x version, so this lines are used as GPIO.
SDIO
KL8x version has no SDHC support, so this lines are just GPIO for that version.
Schematics
Click the image below to download the schematic files.
Bill of materials
Click the image below to download the BOM files.
Fabrication files
Click the image below to download the fabrication files.
Mechanical specifications
Board
Warranty
- Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:
- The users should wear anti-static clothing and use earth band when manipulating the device.
- All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
- Equipment and work table must be earthed.
- Ionizer is recommended to remove electron charge.
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- Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
- Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
- Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
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- Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
- EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.
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