S200 Master - STM32L476
The S200 Master - STM32L476 is a certified Rhomb.io module that includes the STM32L476 MCU, which is one of the ST Electronics ultra-low-power microcontrollers based on the high-performance ARM Cortex-M4 32-bit RISC core operating at a frequency of up to 80 MHz. The Cortex-M4 core features a Floating Point Unit (FPU) single precision which supports all ARM single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The next figure show a 3D view for the S200 Master - STM32L476.
- Industrial automation
- Audio processing
The S200 Master - STM32L476 mounts the STM32L476, a microcontroller of the ST STM32L4 series that performs an ARM Cortex-M4 with DSP instructions. This microcontroller can work in ultra-low-power at 1.8 V, at 2.8 V or at full usage at 3.3 V depending which solder-jumper is closed.
As stated above, it is implemented a full set of DSP instructions so this microcontroller can be used as a signal processor too. Also this microcontroller implements a CRC calculation unit that can be used as a memory protection unit for security applications, a random generator unit and a DMA controller. It has up to 1 MB flash memory and a SRAM memory up to 128 KB. Another external QSPI memory is added bring the module 16 MB of extra storage that can be used for firmware or data logging (this memory works between 2.7 V to 3.6 V, so if the 1.8 V solder-jumper is closed, it will not work. There are also a cryptoautentification memory used to give a security layer to all communications encrypting all the information that receives via I2C interface, and a 1-Wire EEPROM memory to give a unique ID to the module.
The communications interfaces that we can find at S200 Master - STM32L476 are: SDIO, CAN, SPI and QSPI, USB and OTG, UART, I2C, SAI, 1-Wire and JTAG. All of them are included in the Master module an can be used in a Rhomb.io Motherboard. Also this microcontroller counts with up 4 INT, 5 PWM, 26 GPIO and 8 AD.
An USB switch allows you to select between the USB port used in the communication with the computer through a Motherboard or the USB OTG port used to communicate with Slave modules in Class 2 Motherboard.
A 10 pin connector in added on the board to get access to the JTAG/SWDIO signals to program the uController and to flashing/debugging.
The following figure identifies the main components onboard.
The next figure shows the block diagram for the S200 Master - STM32L476.
|S200 Master - STM32L476 Features|
|Microcontroller||STSTM32L476VGT6, 32-bit ARM Cortex-M4 & FPU, 80 MHz & 32 KHz|
|Internal Memory||1 MB Flash, 128 KB SRAM,|
|External Memory||16 MB QSPI Flash Memory|
|Encryption Memory||16 Keys/ECDSA/ECDH/SHA-256/SMAC/NIST|
|ID Memory||64-bit Unique-ID Memory with 112 B User EEPROM|
|Other||Native USB OTG & USB switch; JTAG/SWD micro connector|
|Rhomb.io Config.||2xUSB, 3xUART, SPI, 2xI2C, SDIO, QSPI, SAI, CAN, 4xINT, 5xPWM, 26xGPIO, 8xAD|
|MCU I/O||82xI/O (12xPWM, 16xADC, 16xINT, 2xSAI, SDIO, QSPI, CAN)|
|Op. Voltage||1.8 V / 2.8 V / 3.3 V|
|Op. Temperature||-40 ºC to +85 ºC|
The following table indicates the available serial interfaces of the Rhomb.io Standard used in this module. This table relates the interfaces of the Rhomb.io Standard with the net names of the schematic and with the components to which they are connected.
|Rhomb.io Interface||Schematic Signal||Component||Component Pin||Comments|
|Crypto Memory (U4)||SCL|
|Crypto Memory (U4)||SDA|
|Debug Connector (J1)||9|
|Debug Connector (J1)||8|
|QSPI Memory (U5)||CLK|
|QSPI Memory (U5)||/CS|
|Debug Connector (J1)||8|
|Debug Connector (J1)||4|
|Debug Connector (J1)||5|
|Debug Connector (J1)||6|
|Debug Connector (J1)||7|
|USB||USB_N||STM32L476 (U1)||PA11|| USB_SW line (PE1)|
must be LOW
|OTG||OTG_N||STM32L476 (U1)||PA11|| USB_SW line (PE1)|
must be HIGH
- I2C-B: "I2C_SCL" and "I2C_SDA" are connected to "SPI-A_CS2" and "SPI-A_CS1" respectively through 0R0 resistors. Make sure these lines are not used at the same time.
- JTAG: ·JTAG_TDI", "JTAG_TDO" and "JTAG_TRST" share line with "INT2", "INT0" and "IO1" signals.
- UART-C & UART-D: These interface are connected to the same pins of the STM32L476.
GPIOs and Control Signals
The following table summarizes the GPIOs and Control Signals used on the S200 Master - ETM32L476. This table relates the signals of the Rhomb.io standard with the net names of the schematic and with the components to which they are connected.
|Rhomb.io Signal||Schematic Signal||Component||Component Pin||Comments|
|Debug Connector (J1)||10|
|ID Memory (U2)||IO|
|CLK32K||CLK32K||STM32L476 (1)||PC14-OSC32_IN||R13 must be assembled|
|User LED (LED)||-|
- CAPT: Input Capture share lines with "IO14" and "IO15"
- CLK32K: This line is connected to the oscilator input of the microcontroller. To avoid interferences with the onboard oscilator, you can disassemble a 0R0 resistor (R13)
- JTAG: "INT2", "INT0" and "IO1" signals share line with "JTAG_TDI", "JTAG_TDO" and "JTAG_TRST" signals.
The S200 Master - STM32L476 can use the 1.8 V, the 2.8 V rail or the 3.3 V rail. You can choose the voltage shorting the corresponding solder-jumper. Make sure this rail is enabled on the motherboard you are going to plug this module.
The power consumption varies with different power modes and work statuses of functional modules. Find more information in STM32L476 datasheet.
Bill Of Materials
- Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:
- The users should wear anti-static clothing and use earth band when manipulating the device.
- All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
- Equipment and work table must be earthed.
- Ionizer is recommended to remove electron charge.
- Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
- Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
- Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
- Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
- Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
- Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
- EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.
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