STM32L476 Master Module

This document shows the documentation for the Rhomb.io STM32L476 Master Module. Preliminary version, use only for data updating or corrections.

Overview

The Rhomb.io STM32L476 Master Module is a certified Rhomb.io module that includes a ST Microelectronics STM32L476 microcontroller. The STM32L476 devices are the ultra-low-power microcontrollers based on the high performance Arm® Cortex®-M4 32-bit RISC core operating at a frequency of up to 80 MHz. The Cortex-M4 core features a Floating point unit (FPU) single precision which supports all Arm® single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

The STM32L476 Master Module embed high-speed memories (1 Mbyte flash memory, 128 Kbyte of SRAM), a flexible external memory controller (FSMC) for static memories and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses and a 32-bit multi-AHB bus matrix.

The next figures show a 3D view for the STM32L476 Master Module.
Front render.jpgBack render.jpg

Applications:

  • Industrial automation
  • Internet of Things
  • Low-Power

Module specification

Key features

As stated above, this module sports a ST Microelectronics STM32L476 microcontroller, ultra-low-power device based on the high performance Arm® Cortex®-M4 32-bit.

This module can be powered from either a 3V3 supply, a 2V8 or a 1V8 one in order to improve power consumption rates. It's able to control any class 2 or 3 Rhomb.io motherboard with up to 3 module sockets, plus it has memory capabilities.

It has a built-in analog switch that allows the user to switch between connecting the USB port to the connector J2 or J4.

Interface JTAG SWD USB/OTG SPI I2C SDIO SWP LPUART UART CAN SAI
Nº of buses 11 11 22 2 2 1 1 13 33 1 1

1JTAG and SWD are internally muxed in the microcontroller.
2User can choose where the USB I/F is connected in the module, either to the USB pins on the J2 connector or in the J4.
3UART1 can be used either as a LPUART or standard UART.

...The following figure identifies the main Integrated Circuits (IC) onboard.
ICs STM32.png


The next figure shows the Block Diagram for the STM32L476 Master Module. STM32L476 BD.PNG

STM32L476 Master Module features
Microcontroller STM32L476QGI6
CPU Arm® Cortex®-M4 32-bit
Operating voltage 1.8V, 2.8V or 3.3V
Digital I/O pins 24
High speed internal RC oscillator 16MHz
Multispeed internal RC oscillator 100kHz to 48MHz
External Clock 48MHz, 32.768kHz
SDIO I/F 4-bit
ADC pins 15
USB USB OTG Full Speed 2.0

User interfaces

The user can choose wether this master module is supplied by a 3.3V, 2.8V or a 1.8V source simply by closing or opening the solder jumpers at the top-right corner of the module. 1.8V supply is recommended for applications requiring a lower power consumption.

There is a LED controlled by the controller on port PF15 for whatever the user might need, debugging, visual validation...

USB Switching

Users can choose between having the USB connected to J2 or J4 pins simply by setting PE11 signal from the controller HIGH or LOW.

Connections

GPIO

The following table summarizes the GPIOs used on the Renesas Synergy master module.

Rhomb.io pinout Port Rhomb.io pinout Port
IO0 PA1 IO13 PE0
IO1 PB0 IO14 PE5
IO2 PA6 IO15 PC13
IO3 PA3 IO16 PG4
IO4 PA0 IO17 PG2
IO5 PC3 IO18 PD14
IO6 PA2 IO19 PD13
IO7 PC2 IO20 PB15
IO8 PA7 IO21 PB13
IO9 PF5 IO22 PB14
IO10 PF4 IO23 PB11
IO11 PE6 IO24 PB10
IO12 PF3

ANALOG

The following table summarizes the analog ports used on the Renesas Synergy master module.

ADC
Rhomb.io pinout Port Rhomb.io pinout Port
AD0 PE4 AD8 PA9
AD1 PE3 AD9 PG0
AD2 PB7 AD10 PG1
AD3 PB6 AD11 PG3
AD4 PB5 AD12 PB9
AD5 PG12 AD13 PB8
AD6 PC7 AD14 PE1
AD7 PC6

Serial interfaces

The following table indicates the available serial interfaces on the Rhomb.io standard and which of them are in use. The table also shows the nomenclature used on the Rhomb.io standard and its corresponding on the schematic.

Signal (Rhomb.io) Signal (STM32) Port Signal (Rhomb.io) Signal (STM32) Port
I2C0 SPI0
I2C0_SDA I2C1_SDA PG13 SPI0_MISO SPI1_MISO PE14
I2C0_SCL I2C1_SCL PG14 SPI0_MOSI SPI1_MOSI PE15
I2C1 SPI0_SCK SPI1_SCK PE13
I2C1_SDA I2C2_SDA PF0 SPI0_CS SP1_NSS PE12
I2C1_SCL I2C2_SCL PF1 SPI1
CAN0 SPI1_MISO SPI3_MISO PG10
CAN0_RX CAN1_RX PD0 SPI1_MOSI SPI3_MOSI PG11
CAN0_TX CAN1_TX PD1 SPI1_SCK SPI3_SCK PG9
UART0 SPI1_CS SPI3_NSS PA4
UART0_RXD LPUART1_RX PC0 USB1
UART0_TXD LPUART1_TX PC1 USB_N USB_DATA_N (Through switch) PA11
UART1 USB_P USB_DATA_P (Through switch) PA12
UART1_RXD USART2_RX PD6 OTG1
UART1_TXD USART2_TX PD5 OTG_N USB_D_N (Through switch) PA11
UART2 OTG_P USB_D_P (Through switch) PA12
UART2_RXD USART3_RX PD9 SWP
UART2_TXD USART3_TX PD8 SWP_IO SWPMI1_IO PB12

1USB can be connected to the OTG or USB0 pins simply by setting PE11 signal from the controller HIGH for USB(J2) or LOW for OTG(J4). Default: LOW

SDIO

The next table shows the nomenclature used on the schematic and its corresponding on the rhomb standard for the Secure Digital Input Output (SDIO) interface.

SDIO1
Signal (Rhomb.io) Signal (STM32) Port
SDIO1_CMD SDMMC1_CMD PD2
SDIO1_CDn SDMMC1_CDN PD15
SDIO1_CLK SDMMC1_CK PC12
SDIO1_DATA0 SDMMC1_D0 PC8
SDIO1_DATA1 SDMMC1_D1 PC9
SDIO1_DATA2 SDMMC1_D2 PC10
SDIO1_DATA3 SDMMC1_D3 PC11


For more details, look at the module specifications for the Rhomb.io standard.

Debug

Debugging is to be done by using the SWD or the JTAG interface.

JTAG
Rhomb.io pinout Signal (module) Port
JTAG_TDI JTDI PA15
JTAG_TDO JTDO PB3
JTAG_TCK JTCK-SWCLK PA14
JTAG_TMS JTMS-SWDIO PA13
JTAG_TRST NJTRST PB4
SWD
Rhomb.io pinout Signal (module) Port
SWCLK JTCK-SWCLK PA14
SWDIO JTMS-SWDIO PA13

Power

As per the supply lines used on the board, there is a summary on the next table.

Signal (Rhomb.io) Signal (STM32) Voltage (V)
VDD VDD1 1.8V / 2.8V / 3.3V
VIO_IN VDD_IO2 External
AREF0 VDDA3 External

1VDD voltage level can be selected through the solder jumpers on the board, 1.8V, 2.8V and 3.3V can be selected. It is the voltage at which the whole module is powered. 1.8V level recommended for power efficient applications.
2VDD_IO is a power input pin that is used as pull up voltage for the eeprom memory.
3AREF is an external power input that setS the high voltage reference level of the analog converters.

For more details, look at the module specifications for the Rhomb.io standard.

Other signals

On the following table it is shown the remaining signals from the Rhomb.io module connectors standard,and other module-specific signals.

Signal (Rhomb.io) Signal (module) Port
USB_SW USB_SWITCH PE11
RESET NRST1 NRST
BOOT0 BOOT02 BOOT0

1RESET signal is connected to an internal pull-up resistor and will reset the device on a LOW level event.
2This pin is used to select one of three boot options: Boot from flash, system memory or embedded SRAM.
For more details, look at the module specifications for the Rhomb.io standard.

Schematics

The schematics are available here.

Bill of materials

The BOM is available here.

Fabrication files

The fabrication files are available here.

Mechanical specifications

Board


Dimesions.png

Warranty

  • Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:
  1. The users should wear anti-static clothing and use earth band when manipulating the device.
  2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
  3. Equipment and work table must be earthed.
  4. Ionizer is recommended to remove electron charge.
  • Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
  • Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
  • Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
  • Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
  • Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
  • Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
  • EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

Disclaimer

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