Superbrain - Connectivity v1.0

This document shows the documentation for the Connectivity board.


The Connectivity board is a certified PCB that is used to connect on it the Neuron board in order to access to all the interfaces of the edge. The result of this union is a board very similar to the Hyperion board. This board by itself has no function since it has no Core or Master Module socket.

The next figure show a 3D view for the Connectivity board.

Connectivity 3D top v1.png Connectivity 3D bottom v1.png

As a summary, the following table indicates the main features:

Connectivity features
Ethernet 2x 10BASE-T and 100BASE-TX
USB USB type A 2.0


  • Neuron funcionality test

Board specifications

Key features

The Connectivity board has been designed to give access to all interfaces of the Neuron board in order to test all its functions. Connectivity board takes the most important signals of the Neuron edge and carries it to standard connectors. The following figure shows the block diagram.

Connectivity Block Diagram v1.png

The following figures identify the main parts of the board. The most important parts will be explained with more details in the next sections.

Connectivity Descripción Top v1.png Core

The Connectivity board has no core sockets. The board must be used with a Neuron board. Modules

The Connectivity board has no module sockets. The board must be used with a Neuron board.


The Connectivity board has no memory options. The board must be used with a Neuron board.



There are available 2 USB 2.0 ports on the Connectivity board. The first one is a USB B-Type with an USB to serial UART interface. The second one is a double USB A-Type connector working as a host, but in this version only is routed the bottom receptacle. To active the power signal (VBUS) of the USB ports, you have to bridge the solder pads SJ1 and SJ2.

It is also available two Ethernet port that can carry traffic at the nominal rate of 100Mbit/s, supporting full and half-duplex with flow control.

Connectivity Wired v1.png

Edge connector

The Connectivity board has an edge connector that allows to connect a Neuron board in order to access to their most important interfaces. The following table shows the pinout of the edge connector.

Edge connector pinout
Bottom Top
Pin Pin name Description Pin Pin name Description
1 GND Connected to GND 2 VBP Backplane 12V
3 Hot plug Present-detect 4 VBP
5 Hot plug 6 VBP
7 GND Connected to GND 8 VBP
9 LED error Hot swap error indicator 10 ETH1_BDD2_N Ethernet 1 port
11 GND Connected to GND 12 ETH1_BDD2_P
13 USB2_HOST_N USB 2.0 port 14 GND Connected to GND
15 USB2_HOST_P 16 ETH1_RX_N Ethernet 1 port
17 GND Connected to GND 18 ETH1_BDD1_N
19 GPIO30 GPIO port 20 GND Connected to GND
21 GPIO29 22 ETH1_BDD1_P Ethernet 1 port
23 GPIO28 24 ETH1_RX_P
25 GPIO27 26 GND Connected to GND
27 GPIO26 28 ETH1_TX_N Ethernet 1 port
29 GPIO25 30 ETH_TX_P
31 GPIO24 32 ETH_CT
33 GPIO23 34 GND Connected to GND
35 GND Connected to GND 36 ETH2_BDD2_N Ethernet 2 port
37 PCIE_CLK_N PCIe port 38 ETH2_BDD2_P
39 PCIE_CLK_P 40 GND Connected to GND
41 PCIE_TX_N 42 ETH2_RX_N Ethernet 2 port
45 PCIE_RX_N 46 GND Connected to GND
47 PCIE_RX_P 48 ETH2_BDD1_P Ethernet 2 port
51 GND Conected to GND 52 GND Connected to GND
53 XEINT13 Interrupt port, CEC_HDMI 54 ETH2_TX_N Ethernet 2 port
55 XEINT07 Interrupt port, HPD_HDMI 56 ETH2_TX_P
57 XEINT05 Interrupt port 58 ETH2_CT
59 XEINT04 60 GND Connected to GND
61 PWM_OUT3 PWM 3 out 62 ETH3_BDD2_N Ethernet 3 port
63 PWM_OUT2 PWM 2 out 64 ETH3_BDD2_P
65 GND Connected to GND 66 GND Connected to GND
67 HDMI_D2_P HDMI Data 68 ETH3_RX_N Ethernet 3 port
69 HDMI_D2_N 70 ETH3_BDD1_N
71 HDMI_D1_P 72 GND Connected to GND
73 HDMI_D1_N 74 ETH3_BDD1_P Ethernet 3 port
75 HDMI_D0_P 76 ETH3_RX_P
77 HDMI_D0_N 78 GND Connected to GND
79 HDMI_CLK_P 80 ETH3_TX_N Ethernet 3 port
83 GND Connected to GND 84 ETH3_CT
85 I2C1_SCL I2C 1 interface 86 GND Connected to GND
87 I2C1_SDA 88 ETH4_BDD2_N Ethernet 4 port
89 GND Connected to GND 90 ETH4_BDD"_P
91 UART3_TXD UART 3 interface 92 GND Connected to GND
93 UART3_RXD 94 ETH4_RX_N Ethernet 4 port
95 GND Connected to GND 96 ETH4_BDD1_N
97 UART2_TXD UART 2 interface 98 GND Connected to GND
99 UART2_RXD 100 ETH4_BDD1_P Ethernet 4 port
101 GND Connected to GND 102 ETH4_RX_P
103 UART1_CTSN UART 1 interface 104 GND Connected to GND
105 UART1_TXD 106 ETH4_TX_N Ethernet 4 port
107 UART1_RXD 108 ETH4_TX_P
109 UART1_RTSN 110 ETH4_CT
111 GND Connected to GND 112 GND Connected to GND
113 RFU Reserved 114 RFU Reserved
115 RFU 116 RFU
117 RFU 118 RFU
119 GND Connected to GND 120 GND Connected to GND


The Connectivity board has nos wireless interfaces.


The Connectivity board is fully compliant with the HDMI audio and video interface if there is a Neuron board plugged on the edge connector. The next figure shows where the HDMI type A connector is placed on the board.

Connectivity VideoAudio v1.png

LEDs and Button

2 LEDs are assembled on the Connectivity board in order to give status feedback to the user. The yellow LED blinks when the USB to UART converter uses the TX line, and the green LED blinks when uses the RX line.

The Connectivity board has no buttons.

Connectivity LEDsandButton v1.png



The Connectivity board doesn't use any GPIO from the edge connector.


The following table summarizes the signals that can cause interrupts from the edge connector.

XEINT Signal Description
7 HPD_HDMI HDMI hot plug detect
13 CEC_HADMI HDMI Consumer Electronics Control

Serial interfaces

The following table indicates the use of the available serial interfaces on the edge connector.

Interface Used by
Host_2 USB-A connector


The Connectivity board has no SDIO interface.


The Block Diagram shows that the supply power comes from a DC barrel connector. The input must be 12V.

Secondary signals

The Connectivity board doesn't use Analog to Digital, PWM and CLK signals.


[This documentation is under construction. Please, be patient. We are working hard for bringing to you the best experience.]

Bill of materials

[This documentation is under construction. Please, be patient. We are working hard for bringing to you the best experience.]

Gerber files

[This documentation is under construction. Please, be patient. We are working hard for bringing to you the best experience.]

Mechanical specifications


Connectivity Dimensions v1.png


  • Precaution against Electrostatic Discharge. When handling products, ensure that the environment is protected against static electricity. Follow the next recommendations:
  1. The users should wear anti-static clothing and use earth band when manipulating the device.
  2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
  3. Equipment and work table must be earthed.
  4. Ionizer is recommended to remove electron charge.
  • Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
  • Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
  • Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
  • Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
  • Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
  • Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
  • EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

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