Testpad Keyring

Overview

The Testpad Keyring is a certified Rhomb.io board designed to have access to the most important lines of the Rhomb.io Standard of the Slave sockets. The main purpose of this module is test if signals from Core or Master modules arrive correctley to the Slave sockets or to prototyping electronic devises by soldering cables in the test-pads. It is usually used for marketing.

The next figure shows a 3D view for the Testpad Keyring.

Testpad Keyring Top.png

           Testpad Keyring Bottom.png

Applications:

  • Testing
  • Prototyping
  • Marketing

Module specification

The Testpad Keyring has up to 43 1.5 mm test-pads to measure the Rhomb.io signals or to work with them. It also includes a LED that will light up when the module is plugged on a Rhomb.io Motherboard.

The following table shows all signal accessible with test-pads:

Interfaces Signals Power
I2C I2C_SCL #NMI #NMI GND GND
I2C_SDA AD AD VBAT VBAT
SDIO-A SDIO-A_CDN PWM PWM 1V8 1V8
SDIO-A_CMD CLK32K CLK32K 2V8 2V8
SDIO-A_CLK INT INT 3V3 3V3
SDIO-A_DATA0 IO IO0 VIN_REG VIN_REG
SDIO-A_DATA1 IO1 VIO_IN VIO_IN
SDIO-A_DATA2 IO2 VRTC VRTC
SDIO-A_DATA3 IO3 VRTC VRTC
SPI SPI_MISO IO4 VSYS VSYS
SPI_MOSI IO5
SPI_CLK IO6
SPI_CS0 IO7
UART-A UART-A_RXD
UART-A_TXD
UART-A_CTS
UART-A_RTs
USB USB_N
USB_P

Mechanical specifications

Testpad Keyring Dimensions.png

Warranty

  • Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:
  1. The users should wear anti-static clothing and use earth band when manipulating the device.
  2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
  3. Equipment and work table must be earthed.
  4. Ionizer is recommended to remove electron charge.
  • Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
  • Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
  • Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
  • Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
  • Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
  • Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
  • EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

Disclaimer

Rhomb.io reserves the right to make corrections, enhancements, improvements and other changes to its products and services, and to discontinue any product or service. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All the hardware products are sold subject to the Rhomb.io terms and conditions of sale supplied at the time of order acknowledgment.

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