WiFi/BLE R078B


centro
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This sheet shows the documentation for the rhomb WiFi/BLE R078B Module. Preliminary version, use only for data updating or corrections.

Overview

The WiFi/BLE R078B Module is a fabulous device that brings to the user the capacity to use the most common and widely used wireless communication interfaces such as WiFi, Bluetooth (BT) and Bluetooth Low Energy (BLE). This is a certified rhomb slave module that uses as interfaces the UART and the Secure Digital Input Output (SDIO) bus. The module has been assembled with a 2.4 GHz ceramic antenna, so the user only needs plug it on a compatible rhomb board and use it.

The next two figures shows the top and the bottom side of the WiFi/BLE R078B Module.

(Arturo Vivó tiene que sustituir estas imágenes por renders)
WiFiBLE R078B 3D view Top v2.jpg WiFiBLE R078B 3D view Bottom v2.jpg

Applications:

  • Internet of things (IoT).
  • BLE to WiFi / WiFi to BLE bridge.
  • Mobile.

Module specifications

This module is a powerful wireless communication module that integrates Bluetooth (BT), Bluetooth Low Energy (BLE) and WiFi in a single device. The WiFi/BLE R078B Module is built around the R078(WL1837)/D7020 chipset, a device based on Texas Instruments WL1837 IC. The device contains all the circuitry needed to integrate all the wireless interfaces bringing to the user a highly embedded solution. As a summary, the following table shows the main features for the WiFi/BLE R078B Module. More information about this IC can be found at the Manufacturer documentation here: R078(WL1837)/D7020.

WiFi/BLE R078B Module features
WLAN Supports: 802.11A, 802.11B, 802.11G and 802.11N
2.4 GHz (also 5GHz supported[1])
Bluetooth Protocol concurrent operation and built-in coexistence and prioritization handling
Dedicated audio processor [2]
BLE Fully compliant with BLE 4.0 dual mode standard
Supports up to 10 BLE connections
Support for all roles and its combinations

The next figure identifies the main parts of the board.


WiFiBLE R078B module description Top v3.jpg

This rohmb module acts as a slave so a host is needed in order to explode all the capabilities of the board. For the WLAN, the interface used in order to maintain the communication with the host is the SDIO. As it is shown on the block diagram and on the schematics, the SDIO port used is the number 0. On the other hand, the Bluetooth and the BLE shares the Host Controller Interface (HCI) over UART as a communication interface with the host.

The next figure shows the Block Diagram for the WiFi/BLE R078B Module.


WiFiBLE R078B Block Diagram v3.jpg

As it is shown, the Wireless IC is powered through the rhomb standard supplies named VSYS and 1V8_150mA. Note that there are two signal clocks: a slow one and a fast one. The slow clock signal could be provided by the onboard assembled oscillator or trough the CLK_32KH standard rohmb signal. For doing so, the resistor R12 should be removed and the R13 assembled. For more information look at the "Other signals" and "Schematics" sections.

It is important to bear in mind the initialization sequencing:

  1. Ensure that the board is powered.
  2. If the onboard slow clock is used, enable the device by forcing to high level the WLAN_OSC_OE signal (GPIO1). If the CLK_32kHz signal from the standard rhom connectors is being used, ommit this step.
  3. Enable the WLAN interface by forcing the WLAN_EN signal (GPIO2) to high level.

The block Diagram also shows that is being used six rohmb GPIO signals. For more information regarding the functionality of these signals, see the "GPIO" section.

Connections

GPIO

The following table summarizes the GPIOs used on the WiFi/BLE R078B Module. Note that the GPIO0 and the GPIO4 should be configured as interrupt sources on the rhomb-compatible host.

Signal (module) rhomb pinout Interruption Description
WLAN_IRQ GPIO0 Yes SDIO available
WLAN_OSC_OE GPIO1 No Onboard low speed oscillator enable
WLAN_EN GPIO2 No WLAN enable
BT_EN GPIO3 No BT and BLE enable
BT_WAKE_UP_H GPIO4 Yes Signal to wakeup the host from BT and BLE
BT_WAKE_UP GPIO5 No Signal for wakeup the BT and BLE from host
WLAN_CLK_REQ GPIO6 No Don't use

For more details regarding the mentioned signals it is recommended to read the rhomb standard specifications and the wireless IC manufacturer documentation (R078(WL1837)/D7020).

Serial interfaces

The following table indicates the available serial interfaces on the rhomb standard and its been indicated the used ones. The table also shows the nomenclature used on the schematic and its corresponding on the rhom standard.

Signal (rhomb) Signal (module) Used by
I2C
I2C.SDA Unused
I2C.SCL
MD_I2C_INT
SPI
SPI_MISO Unused
SPI_MOSI
SPI_CLK
MD_SPI_CSn
MD_SPI_INT
UART
UART_RTSN UART_RTSN Wireless IC
UART_RXD UART_RXD
UART_TXD UART_TXD
UART_CTSN UART_CTSN
USB
USB_DATA_N Unused
USB_DATA_P

The Wireless IC shares the HCI transport for BT and BLE over UART. Look at the manufacturer documentation (R078(WL1837)/D7020).

SDIO

The nex table shows the nomenclature used on the schematic and its corresponding on the rhom standard for the Secure Digital Input Output (SDIO) interfaces. Note that the SDIO port 0 has been used in order to communicate the WLAN interface with the host.

SDIO0
Signal (rhomb) Signal (module) Used by
SDIO0_CMD SDIO0_CMD Wireless IC
SDIO0_CDN SDIO0_CDN
SDIO0_CLK SDIO0_CLK
SDIO0_DATA0 SDIO0_DATA0
SDIO0_DATA1 SDIO0_DATA1
SDIO0_DATA2 SDIO0_DATA2
SDIO0_DATA3 SDIO0_DATA3
SDIO1
SDIO1_CMD Unused
SDIO1_CDN
SDIO1_CLK
SDIO1_DATA0
SDIO1_DATA1
SDIO1_DATA2
SDIO1_DATA3

For more details, look at the specifications for the rhomb standard.

Power

As per the supply lines used on the board, there is a summary on the next table.

Signal (rhomb) Signal (module) Voltage (V) Used
1V8 150mA 1V8 150mA 1.8 Yes
2V8 150mA 2.8 No
VCH 5 No
VSYS VSYS 3 - 5.5 Yes
Buck8 3.3 No
Buck9 3.3 No

For more details, look at the rhomb standard specifications.

Other signals

On the following table it is shown the remaining signals from the rhomb module connectors standard.

Signal (rhomb) Signal (module) Used by
CLK_32KH CLK_32KH Wireless IC
AD_OUT Unused
PWM_INT

As it has been mentioned on the "Module specifications" section, the Wireless IC needs a fast clock running at 26MHz, and a slow one running at 32.768kHz. The WiFi/BLE R078B Module include two possibilities to provide the slow clock signal. To select the clock source, the resistors R12 and R13 should be mounted/unmounted according to the next specifications:

  • Selecting internal source (default): R12 should be assembled and R13 unassembled. The signal is provided by an onboard oscillator.
  • Selecting clock from the standard rhomb signals: R13 should be assembled and R12 unassembled.

Getting started

In order to initialize properly the WiFi/BLE R078B Module, it is required to follow the next steps:

  1. Ensure that there is power supply on the board.
  2. If the onboard slow clock is used, enable the device by forcing to high level the WLAN_OSC_OE signal (GPIO1). If the CLK_32kHz signal from the standard rhom connectors is being used, ommit this step.
  3. Enable the WLAN interface by forcing the WLAN_EN signal (GPIO2) to high level.
[Añadir un paso a paso sobre cómo emplear el módulo con una Expansion (con una Hyperion no tiene mucho sentido pues ya tiene en la placa el chip Wireless]

Schematics


WiFiBLE-R078B-Schematics-v2.jpg

Bill of materials

[ESTO ES LA HOJA DE CÁLCULO QUE HAY QUE ADJUNTARLA]

Part number package marking

Mechanical specifications

Board


WiFiBLE R078B Dimensions v1.JPG

Connector

[PONER VISTAS DEL CONECTOR E INTRUCCIONES DE CÓMO CONECTAR/DESCONECTAR]

Warranty

  • Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:
  1. The users should wear anti-static clothing and use earth band when manipulating the device.
  2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
  3. Equipment and work table must be earthed.
  4. Ionizer is recommended to remove electron charge.
  • Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
  • Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
  • Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
  • Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
  • Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
  • Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
  • EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

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  1. For this feature it is needed to mount a 5GHz antenna.
  2. Future implementation.