Class 1 - Hyperion


The Hyperion board is a certified rhomb PCB that integrates the rhomb modular ecosystem in a small form factor device. This board is a modular machine focused on multimedia capable to support two rhomb modules and a rhomb core. Is not a simple computer with multimedia features, it is the most upgradable device you will find on the market. It gives the opportunity to easily assemble your machine according not only to your needs, but to your imagination.

The most common communication features such as WiFi, Ethernet and USB ports are available on board. But there are no limits on the Hyperion capabilities: LoRa, ZigBee, movement sensing, GPS..., all those are available on standard rhomb modules. The only thing you need is connect them on the corresponding slots. If there is a need for more processing power: you don't need to replace the Hyperion, the only thing you have to do is replace the core module for another more powerful.

The next figure show a 3D view for the Hyperion board.

Hyperion12 3D Top.png Hyperion12 3D Bottom.png

As a summary, the following table indicates the main features:

Hyperion Key Features
Multi-platform single-board computer
1x Core
2x Slave sockets
WiFi + BT
4x USB
SD card


  • Mini-PC
  • Media center
  • Router
  • IoT
  • WiFi/BT access point
  • NAS
  • Education

Board specifications

Key features

The Hyperion board has been designed as to be the most upgradeable and customizable computer device in the market using the modular architecture. This board offers a huge amount of multimedia and communications capabilities such as HDMI, USB, Ethernet, WiFi and Bluetooth. The Hyperion is not limited only to these features, the board also includes two sockets for standard Modules and one socket for standard Cores. This brings a countless amount of customization options. The Block Diagram shows the parts that make it possible.

Hyperion Block Diagram v5.jpg

The following figures identify the main parts of the board. The most important parts will be explained with more details in the next sections.

Hyperion12 Description Top.png Hyperion12 Description Bottom.png Core

The Central Processing Unit (CPU), RAM, PMIC among other auxiliary elements are embedded on the Core, a small standardized board designed to be connected on the core socket. Look on the description image to see where this socket is placed. On the following link you can find the currently available cores. Shop

Core Exynos v2.jpg Modules

Lots of Modules focused in different areas such as communications, sensing or storage, are available. The Hyperion board allows to connect a maximum of two standard Modules. Look at here to choose the desired module to convert your Hyperion in the device you want. Note that if a memory module is used, it should be connected on the module socket number one.

Modules v2.jpg


Two memory options are available for the Hyperion board: a micro SD card and a Memory eMMCXX Module. The eMMC memory modules used to be faster than the SD cards, but it occupies one module socket. The user should choose either one or other. In order to allow that, there is a switch array on the board that should be configured as it is shown on the two following images:

  • eMMC bootloader configuration:

Bootloader eMMC v1.JPG

  • Micro SD card bootloader configuration:

Bootloader uSD v1.JPG

The DIP switches should not be moved unless the system is turned off.

Hyperion12 Memory Top.png Hyperion12 Memory Bottom.png



There are available three USB 2.0 ports on the Hyperion and all are working as a host. Note that there are two USB B-Type connectors on the board, but these ports are used only as a supply source. See the "Power" section for more details.

It is also available an Ethernet port that can carry traffic at the nominal rate of 100Mbit/s, supporting full and half-duplex with flow control.

Hyperion12 Wired.png


The Hyperion board offers WiFi and Bluetooth (BT). As a summary, the following table shows the main features for each supported interface:

Hyperion wireless interfaces
WLAN EEE 802.11b, IEEE 802.11g, IEEE 802.11n
2.4 GHz
Bluetooth V2.1+EDR/BT v3.0/BT v3.0+HS/BT v4.0


The Hyperion board is fully compliant with the HDMI audio and video interface. The next figure shows where the HDMI type A connector is placed on the board.

Hyperion12 VideoAudio.png

LEDs and Button

Four LEDs are assembled on the Hyperion board in order to give status feedback to the user. The functionality is explained next:

  • Main PWR IN LED: indicates that the main power supply source is connected on its corresponding micro USB connector. More details regarding this connector will be found at the "Power" section.
  • SYS ON LED: indicates that the system is running. If all is okay, this LED should bright once the Button ON is pressed.
  • Secondary PWR IN LED: indicates that the secondary power supply source is connected on its corresponding micro USB connector. More details regarding this connector will be found at the "Power" section.
  • User LED: Programmable LED connected to GPIO00.

The Button ON is used to turn ON/OFF the system and to reset it if you keep it pressed a few seconds.

Hyperion12 LEDsandButtons.png



The following table summarizes the GPIOs used on the Hyperion board.

GPIO Signal Description
00 LED_MCU_1 Activates User LED (LED1)
01 - -
02 - -
03 - -
04 - -
05 - -
06 MOD_RESET Resets the Modules
07 MOD1_GPIO0 Module 1 socket, GPIO 0
08 MOD1_GPIO1 Module 1 socket, GPIO 1
09 MOD1_GPIO2 Module 1 socket, GPIO 2
10 MOD1_GPIO3 Module 1 socket, GPIO 3
11 MOD1_GPIO4 Module 1 socket, GPIO 4
12 MOD1_GPIO5 Module 1 socket, GPIO 5
13 MOD1_GPIO6 Module 1 socket, GPIO 6
14 MOD1_GPIO7 Module 1 socket, GPIO 7
15 MOD2_GPIO0 Module 2 socket, GPIO 0
16 MOD2_GPIO1 Module 2 socket, GPIO 1
17 MOD2_GPIO2 Module 2 socket, GPIO 2
18 MOD2_GPIO3 Module 2 socket, GPIO 3
19 MOD2_GPIO4 Module 2 socket, GPIO 4
20 MOD2_GPIO5 Module 2 socket, GPIO 5
21 MOD2_GPIO6 Module 2 socket, GPIO 6
22 MOD2_GPIO7 Module 2 socket, GPIO 7
23 - -
24 - -
25 - -
26 - -
27 - -
28 - -
29 - -
30 - -
31 - -
32 - -
33 - -
34 - -
35 - -
36 - -
37 - -
38 SPI-A_CS1 SPI-A Chip Select for Module 2
39 - -
40 - -


The following table summarizes the signals that can cause interrupts on the Core.

XEINT Signal Description XEINT Signal Description
00 MOD1_INT Interrupt on the Module 1 08 - -
01 MOD2_INT Interrupt on the Module 2 09 - -
02 - - 10 - -
03 - - 11 - -
04 - - 12 - -
05 - - 13 CEC_HDMI HDMI Consumer Electronics Control
06 - - 14 - -
07 HPD_HDMI HDMI Hot Plug Detect 15 XEINT15 System Power ON

Serial interfaces

The following tables indicates the use of the available serial interfaces on the standard.


I2C Used by
A Module 1 Module 2
B -

The I2C-A has 4.7kΩ pull-up resistors connected to a VDDIO.


This interface is not used on the Hyperion board.


SPI Used by
A Module 1 Module 2
B -


UART Used by
A Module 1
B Module 2
Debug pads
C -
D Module 1 Module 2

As the standard defines, the UART-B is the interface used for the system debugging.


USB Used by
USB-A Module 1
USB-C HUB USB/Ethernet
USB1_HUB2 USB-A connector
USB4_HUB2 Module 2


The next table shows how the Secure Digital Input Output (SDIO) interfaces are connected on the Hyperion board.

SDIO Used by
A Module 1
C Module 2 socket
Micro SD


The Block Diagram shows that the supply power comes from the two micro USB B connectors. The "Main PWR USB" is the main power supply and feeds all the circuitry. The "Secondary PWR USB" is a secondary source power that feeds the three USB type A connectors. This should be used when the devices connected there needs more power than the "Main PWR USB" is capable to supply. A switching circuit is responsible to derive the current in order to do so. Note that the data lines are not connected to the micro USB B connectors, are used only as a power supply connectors.

The following table summarizes the power supply signals on the Hyperion board and indicates where are used.

Signal Voltage (V) Used by
VBAT 5 Module 1 Module 2
VSYS 3 - 5.5 Core Module 1 Module 2
VDDIO Core logic level Module 1 Module 2
Boot sequence
BUCK8-A_3V3 3.3 Module 1 Module 2
BUCK-B_REG_3V3 3.3 Module 1 Module 2
USB HUB/Ethernet
Wireless IC
LDO-A_2V8 2.8 Module 2
LDO-B - -
LDO-C - -
LDO-D - -
LDO-E - -
LDO-F 2V8 Micro-SD
LDO-G - -
LDO-H - -
LDO-I - -
LDO-J - -
LDO-K - -
LDO-L - -
LDO-M_1V8 - -
LDO-N - -
LDO-O_1V8 1V8 Module 2
LDO-P - -
LDO-Q_1V8 1V8 Module 1
LDO-R_2V8 1V8 Module 1

Secondary signals

On the following table it is shown how the Analog to Digital, PWM and CLK signals are connected on the Hyperion board.

Signal Used by
Analog to Digital
AD_IN0 Module 1
AD_IN1 MOdule 2
AD_IN2 -
AD_IN3 -
PWM_OUT0 Module 1
PWM_OUT1 MOdule 2
CLK 32.768kHz
CLK_32KH_1 Module 1 MOdule 2

Getting started

[Under construction]


Click the image below to download the schematic files.

Bill of materials

Click the image below to download the BOM files.

Fabrication files

Click the image below to download the fabrication files.

Mechanical specifications


Hyperion Dimensions v1.JPG


  • Precaution against Electrostatic Discharge. When handling products, ensure that the environment is protected against static electricity. Follow the next recommendations:
  1. The users should wear anti-static clothing and use earth band when manipulating the device.
  2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
  3. Equipment and work table must be earthed.
  4. Ionizer is recommended to remove electron charge.
  • Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
  • Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
  • Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
  • Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
  • Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
  • Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
  • EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

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