S100 Slave - Audio Codec SGTL5000

Overview

The S100 Slave - Audio Codec SGTL5000 Module is a certified Rhomb.io Module that carries the NXP SGTL5000 audio codec, a low-power stereo codec that includes a headphone amplifier. It has been designed to provide a comprehensive audio solution for portable products that require line-in, microphone-in, line-out, headphone-out and digital I/O. The Module includes a microphone on the board.

The next figure shows a 3D view for the S100 Slave - Audio Codec SGTL5000 Module.

S100 Slave - Audio Codec SGTL5000 v1.0 TOP.png

           S100 Slave - Audio Codec SGTL5000 v1.0 BOTTOM.png

Applications:

  • Media players
  • Smart devices
  • Consumer audio equipment

Module Specification

The S100 Slave - Audio Codec SGTL5000 Module mounts the NXP SGTL5000, a low power stereo codec with headphone amplifier from Freescale.

The SGTL5000 accepts the following inputs:

  • Line input
  • Microphone input, with mic bias
  • Digital I2S input

In addition, the SGTL5000 supports the following outputs:

  • Line output
  • Headphone output
  • Digital I2S output

The SGTL5000 can accept an external standard master clock at a multiple of the sampling frequency. In addition it can take non-standard frequencies and use the internal PLL to derive the audio clocks. The device supports 8.0 kHz, 11.025 kHz, 12 kHz, 16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1kHz, 48 kHz, 96 kHz sampling frequencies.

A miniature, high-performance, low power microphone is include on the board. By default, the on-board microphone is connected directly to the audio codec, put you can use an external microphone if you open de solder-jumper and you solder it on the pads. In this mode, if you solder a 7 pin jack connector and you connect a headset, the Module will switch automatically between the on-board microphone and the headset microphone.

The following figure identifies the main components onboard:

S100 Slave - Audio Codec SGTL5000 v1.0 Description TOP.png

The "Audio Jack" pads have been designed to solder in them the lines of a 3.5 mm jack connector with the following pinout.

PAD Name Jack Connector Pin & Name Function Schematics
VGND 1. Ring 2 Virtual Ground 3.5 Jack Connector.png
LEFT 2. Tip Left audio
RIGHT 3. Ring 1 Right audio
R_SW 4. Ring switch Isolated switch. Normally closed contact, open when a plug is inserted.
BREAK 5. Break
T_SW 6. Tip switch Normally closed contact, disconnected from tip when a plug is inserted. Not used in this Module
MIC 7. Sleeve Microphone
  • VGND: Do not connect VGND to system ground, even when unused. This is a virtual ground (DC voltage) that should never connect to an actual “0 Volt ground”.


The next figure shows the block diagram for the S100 Slave - Audio Codec SGTL5000 v1.0 Module:

S100 Slave - Audio Codec SGTL5000 v1.0 Block Diagram.png


As a summary, the following table indicates the main features:

I2S Audio Codec Key Features
Low Power Stereo Codec with Headphone
Amp based on NXP SGTL5000
Designed to provide a complete audio solution for portable products needing LINEIN, mic-in, LINEOUT, headphone-out and digital I/O
Integrated Digital Processing
Op. Voltage: 1.8 V to 3.3 V
Op. Temperature: -40 ºC to +85 ºC

User Interfaces

The following table indicates the available serial interfaces of the Rhomb.io standard used in this Module. This table relates the interfaces of the Rhomb.io standard with the net names of the schematic and with the components to which they are connected.

Rhomb.io Interface Schematic Signal Component Component Pin
I2C I2C_SDA SGTL5000 (U1) CTRL_DATA
I2C_SCL CTRL_CLK
SAI SAI_BCLK SGTL5000 (U1) I2S_BCLK
SAI_LRCLK I2S_LRCLK
SAI_SDI I2S_DIN
SAI_SDO I2S_DOUT
SAI_MCLK I2S_MCLK

GPIOs and Control Signals

The following table summarizes the GPIOs and Control Signals used on the S100 Slave - Audio Codec SGTL5000 Module. This table relates the signals of the Rhomb.io standard with the net names of the schematic and with the components to which they are connected.

Rhomb.io Signal Schematic Signal Component Component Pin
1WIRE 1WIRE ID Memory (U2) IO
  • 1WIRE: This signal can be used to read the ID Memory.

Power

The S100 Slave - Audio Codec SGTL5000 can use the 1.8 V and the VIO_IN (voltage reference with which the Core/Master operates) rail. Make sure this rail is enabled on the motherboard you are going to plug this Module.

Do not connect VGND to system ground, even when unused. This is a virtual ground (DC voltage) that should never connect to an actual “0 Volt ground”.

You can find more information about power consumption in the SGTL5000 datasheet.

Schematics

Click the image below to download the schematic files.


Bill of materials

Click the image below to download the BOM files.

Fabrication files

Click the image below to download the fabrication files.



Mechanical Specifications

S100 Slave - Audio Codec SGTL5000 v1.0 Dimensions.png

Warranty

  • Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:
  1. The users should wear anti-static clothing and use earth band when manipulating the device.
  2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
  3. Equipment and work table must be earthed.
  4. Ionizer is recommended to remove electron charge.
  • Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
  • Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
  • Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
  • Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
  • Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
  • Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
  • EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

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