Difference between revisions of "S300 Adapter - DAPter v1.2"

(Mechanical specifications)
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<!-- This sheet shows the documentation for the Rhomb.io ''S300 Adapter - DAPter v1.2 (PR)''. -->
 
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= Overview =
 
= Overview =
 
The ''S300 Adapter - DAPter v1.2'' is a [https://os.mbed.com/handbook/DAPLink DAPlink] interface for Rhomb.io Master modules. [https://os.mbed.com/handbook/DAPLink Arm® Mbed™ DAPlink] is an open-source software project that enables programming and debugging application software on running on Arm Cortex CPUs. Commonly referred to as interface firmware, DAPLink runs on a secondary MCU that is attached to the SWD or JTAG port of the application MCU. This configuration is found on nearly all development boards. It creates a bridge between your development computer and the CPU debug access port.
 
The ''S300 Adapter - DAPter v1.2'' is a [https://os.mbed.com/handbook/DAPLink DAPlink] interface for Rhomb.io Master modules. [https://os.mbed.com/handbook/DAPLink Arm® Mbed™ DAPlink] is an open-source software project that enables programming and debugging application software on running on Arm Cortex CPUs. Commonly referred to as interface firmware, DAPLink runs on a secondary MCU that is attached to the SWD or JTAG port of the application MCU. This configuration is found on nearly all development boards. It creates a bridge between your development computer and the CPU debug access port.
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These signals, along with the USB interface, are the only ones that do not go straight from the corresponding connector on the bottom side to the one on the top side.
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These signals, along with the USB interface, are the only ones that do not go straight from the corresponding connector on the bottom side to the one on the top side.-->
  
 
== rhomb.io connector signals ==
 
== rhomb.io connector signals ==

Revision as of 12:49, 22 February 2019

Under construction

rhomb.io connector signals

All but the aforementioned signals are connected straight from the motherboard to the Master module socket, and follow the rhomb.io S300 Master standard.

Schematics

Click the image below to download the schematic files.

Bill of materials

Click the image below to download the BOM files.

Fabrication files

Click the image below to download the fabrication files.

Mechanical specifications

DAPter12-dimensions.png

Warranty

  • Precaution against Electrostatic Discharge. When handling Rhomb.io products, ensure that the environment is protected against static electricity. Follow the next recommendations:
  1. The users should wear anti-static clothing and use earth band when manipulating the device.
  2. All objects that come in direct contact with devices should be made of materials that do not produce static electricity that would cause damage.
  3. Equipment and work table must be earthed.
  4. Ionizer is recommended to remove electron charge.
  • Contamination. Be sure to use semiconductor products in the environment that may not be exposed to dust or dirt adhesion.
  • Temperature/Humidity. Semiconductor devices are sensitive to environment temperature and humidity. High temperature or humidity may deteriorate semiconductor devices characteristics. Therefore avoid storage or usage in such conditions.
  • Mechanical Shock. Care should be exercised not to apply excessive mechanical shock or force on the connectors and semiconductors devices.
  • Chemical. Do not expose semiconductor device to chemical because reaction to chemical may cause deterioration of device characteristics.
  • Light Protection. In case of non-EMC (Epoxy Molding Compound) package, do not expose semiconductor IC to strong light. It may cause devices malfunction. Some special products which utilize the light or have security function are excepted from this specification.
  • Radioactive, Cosmic and X-ray. Semiconductor devices can be influenced by radioactive, cosmic ray or X-ray. Radioactive, cosmic and X-ray may cause soft error during device operation. Therefore semiconductor devices must be shielded under environment that may be exposed to radioactive, cosmic ray or X-ray.
  • EMS (Electromagnetic Susceptibility). Note that semiconductor devices characteristics may be affected by strong electromagnetic waves or magnetic field during operation.

Disclaimer

Rhomb.io reserves the right to make corrections, enhancements, improvements and other changes to its products and services, and to discontinue any product or service. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All the hardware products are sold subject to the Rhomb.io terms and conditions of sale supplied at the time of order acknowledgment.

All brand names, trademarks and registered trademarks belong to their respective owners.

We are constantly striving to improve the quality of our technical notes. If you find an error or omission please let us know.

Email us at: info@rhomb.io

References

Arm® Mbed™ Website. DAPLink - Handbook | Mbed

More information on Arm® Pelion™ IoT Platform:

Where to buy

You can purchase this item at the Rhomb website store.

Please, click the icon below.